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Go et al., 2018 - Google Patents

Microstructure and Thermal Conductivity of Sintered Reaction‐Bonded Silicon Nitride: The Particle Size Effects of MgO Additive

Go et al., 2018

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Document ID
14165642060569497356
Author
Go S
Li Y
Ko J
Kim H
Kwon S
Kim H
Park Y
Publication year
Publication venue
Advances in Materials Science and Engineering

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Snippet

The particle size effect of MgO as a sintering additive on the thermal conductivity of sintered reaction‐bonded silicon nitride (SRBSN) was investigated. It was revealed that the size of MgO is critical for thermal conductivity with regard to the microstructural evolution process …
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