Park et al., 2018 - Google Patents
Experimental validation of fatigue life of CCGA 624 package with initial contact pressure of thermal gap pads under random vibration excitationPark et al., 2018
View PDF- Document ID
- 922617309102994209
- Author
- Park T
- Jeon S
- Kim S
- Jung S
- Oh H
- Publication year
- Publication venue
- International Journal of Aerospace Engineering
External Links
Snippet
Thermal gap pads are widely used for effective heat transfer from high‐heat‐dissipating components to a heat sink. The initial contact pressure of thermal pads is an important parameter for enhancing the heat transfer capability of thermal design during the assembly …
- 230000005284 excitation 0 title description 10
Classifications
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- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
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