Ruffoni et al., 1988 - Google Patents
Pulse-plating of Au Cu Cd alloys—II. Theoretical modelling of alloy compositionRuffoni et al., 1988
- Document ID
- 5618335556930836084
- Author
- Ruffoni A
- Landolt D
- Publication year
- Publication venue
- Electrochimica Acta
External Links
Snippet
A theoretical model for pulse-plating of ternary alloys based on Butler—Volmer kinetics and taking into account non-steady state and steady state mass transport of the reacting ionic species has been developed. The composition of Au Cu Cd alloys for different kinetic …
- 239000000203 mixture 0 title abstract description 26
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of work-pieces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
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