[go: up one dir, main page]

Cha et al., 2018 - Google Patents

Poly (dimethylsiloxane) stamp coated with a low-surface-energy, diffusion-blocking, covalently bonded perfluoropolyether layer and its application to the fabrication of …

Cha et al., 2018

Document ID
4744104748342433281
Author
Cha S
Kim C
Publication year
Publication venue
ACS Applied Materials & Interfaces

External Links

Snippet

It is demonstrated that a stamp composed of a poly (dimethylsiloxane)(PDMS) bulk and perfluoropolyether (PFPE) coating fabricated by a simple dip-coating method has the following properties that are ideal for the transfer patterning of various materials. Deposited …
Continue reading at pubs.acs.org (other versions)

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/05Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential- jump barrier or surface barrier multistep processes for their manufacture
    • H01L51/0504Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential- jump barrier or surface barrier multistep processes for their manufacture the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or swiched, e.g. three-terminal devices
    • H01L51/0508Field-effect devices, e.g. TFTs
    • H01L51/0512Field-effect devices, e.g. TFTs insulated gate field effect transistors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/0032Selection of organic semiconducting materials, e.g. organic light sensitive or organic light emitting materials
    • H01L51/0045Carbon containing materials, e.g. carbon nanotubes, fullerenes
    • H01L51/0048Carbon nanotubes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
    • H01L51/0002Deposition of organic semiconductor materials on a substrate
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
    • H01L51/0021Formation of conductors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANO-TECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANO-STRUCTURES; MEASUREMENT OR ANALYSIS OF NANO-STRUCTURES; MANUFACTURE OR TREATMENT OF NANO-STRUCTURES
    • B82Y10/00Nano-technology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANO-TECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANO-STRUCTURES; MEASUREMENT OR ANALYSIS OF NANO-STRUCTURES; MANUFACTURE OR TREATMENT OF NANO-STRUCTURES
    • B82Y30/00Nano-technology for materials or surface science, e.g. nano-composites
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANO-TECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANO-STRUCTURES; MEASUREMENT OR ANALYSIS OF NANO-STRUCTURES; MANUFACTURE OR TREATMENT OF NANO-STRUCTURES
    • B82Y40/00Manufacture or treatment of nano-structures

Similar Documents

Publication Publication Date Title
Tong et al. Printed thin-film transistors: research from China
Secor et al. Emerging carbon and post-carbon nanomaterial inks for printed electronics
Iwasaki et al. Bubble-free transfer technique for high-quality graphene/hexagonal boron nitride van der Waals heterostructures
Cha et al. Poly (dimethylsiloxane) stamp coated with a low-surface-energy, diffusion-blocking, covalently bonded perfluoropolyether layer and its application to the fabrication of organic electronic devices by layer transfer
Cao et al. Screen printing as a scalable and low-cost approach for rigid and flexible thin-film transistors using separated carbon nanotubes
Briseno et al. Patterning organic semiconductors using “dry” poly (dimethylsiloxane) elastomeric stamps for thin film transistors
Menard et al. Micro-and nanopatterning techniques for organic electronic and optoelectronic systems
Kang et al. Recent advances in organic transistor printing processes
Torrisi et al. Inkjet-printed graphene electronics
Khan et al. Technologies for printing sensors and electronics over large flexible substrates: A review
Parashkov et al. Large area electronics using printing methods
Kim et al. Facile and microcontrolled blade coating of organic semiconductor blends for uniaxial crystal alignment and reliable flexible organic field-effect transistors
Kim et al. Direct writing and aligning of small-molecule organic semiconductor crystals via “dragging mode” electrohydrodynamic jet printing for flexible organic field-effect transistor arrays
Jiang et al. Nanoscaled surface patterning of conducting polymers
Li et al. High-resolution organic light-emitting diodes patterned via contact printing
Kim et al. Transparent flexible nanoline field-effect transistor array with high integration in a large area
Wang et al. Graphene-assisted solution growth of vertically oriented organic semiconducting single crystals
Gramling et al. Spatially precise transfer of patterned monolayer WS2 and MoS2 with features larger than 104 μm2 directly from multilayer sources
CN103620733A (en) Method of transferring thin films
Liu et al. Solution-assisted assembly of organic semiconducting single crystals on surfaces with patterned wettability
Kim et al. Sheet size-induced evaporation behaviors of inkjet-printed graphene oxide for printed electronics
Oh et al. Patterned taping: a high-efficiency soft lithographic method for universal thin film patterning
Zhang et al. Preferential trapping of C60 in nanomesh voids
Opatkiewicz et al. Nanotubes on display: how carbon nanotubes can be integrated into electronic displays
Wang et al. Lithographical fabrication of organic single-crystal arrays by area-selective growth and solvent vapor annealing