[go: up one dir, main page]

Lu et al., 2013 - Google Patents

Fabrication of copper/modal fabric composites through electroless plating process for electromagnetic interference shielding

Lu et al., 2013

Document ID
4407554714723672342
Author
Lu Y
Liang Q
Li W
Publication year
Publication venue
Materials Chemistry and Physics

External Links

Snippet

Electroless copper deposition on chemically grafted modal fabric (MF) has been developed. The process is relied on 3-aminopropyltrimethoxysilane (APTMS) grafting onto MF via a simple coupling reaction. Cu/MF composites can be obtained in three steps:(i) grafting of …
Continue reading at www.sciencedirect.com (other versions)

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pre-treatment of the material to be coated
    • C23C18/20—Pre-treatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pre-treatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pre-treatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals

Similar Documents

Publication Publication Date Title
Lu et al. Fabrication of copper/modal fabric composites through electroless plating process for electromagnetic interference shielding
Ali et al. Copper electroless plating of cotton fabrics after surface activation with deposition of silver and copper nanoparticles
Lu et al. Electromagnetic interference shielding, mechanical properties and water absorption of copper/bamboo fabric (Cu/BF) composites
Lee et al. Ultrahigh electromagnetic interference shielding performance of lightweight, flexible, and highly conductive copper-clad carbon fiber nonwoven fabrics
Jiang et al. Electromagnetic shielding and corrosion resistance of electroless Ni–P/Cu–Ni multilayer plated polyester fabric
Lu et al. Adhesion enhancement between electroless nickel and polyester fabric by a palladium-free process
Gan et al. Electroless copper plating on PET fabrics using hypophosphite as reducing agent
Han et al. Electromagnetic interference shielding effectiveness of electroless Cu-plated PET fabrics
Guo et al. An alternative process for electroless copper plating on polyester fabric
Lu et al. Electroless nickel deposition on silane modified bamboo fabric through silver, copper or nickel activation
Gan et al. Electroless plating of Cu–Ni–P alloy on PET fabrics and effect of plating parameters on the properties of conductive fabrics
Lili et al. Electroless silver plating on the PET fabrics modified with 3‐mercaptopropyltriethoxysilane
Lu et al. Palladium-free catalytic electroless copper deposition on bamboo fabric: Preparation, morphology and electromagnetic properties
Liu et al. Electroless nickel plating on APTHS modified wood veneer for EMI shielding
Zhao et al. Comparative study of electroless nickel film on different organic acids modified cuprammonium fabric (CF)
Qin et al. Enhanced electromagnetic-interference shielding effectiveness and mechanical strength of Co-Ni coated aramid-carbon blended fabric
Sun et al. Electromagnetic interference shielding material from electroless copper plating on birch veneer
Hui et al. Electromagnetic shielding wood-based composite from electroless plating corrosion-resistant Ni–Cu–P coatings on Fraxinus mandshurica veneer
Zhang et al. Comparative study of electroless Ni-P, Cu, Ag, and Cu-Ag plating on polyamide fabrics
Qin et al. Metallization of polyester fabric by autocatalytic copper plating process using glyoxylic acid as a reducing agent
Lin et al. Preparation of ultra-conductive bamboo cellulose fiber via a facile pretreatment
Wang et al. Fabrication of a laminated felt-like electromagnetic shielding material based on nickel-coated cellulose fibers via self-foaming effect in electroless plating process
Zhao et al. Microstructure and properties of copper plating on citric acid modified cotton fabric
He et al. Durable cellulose paper by grafting thiol groups and controlling silver deposition for ultrahigh electromagnetic interference shielding
Li et al. A new process for preparing conducting wood veneers by electroless nickel plating