| Overview of constitutive laws, kinematics, homogenization and multiscale methods in crystal plasticity finite-element modeling: Theory, experiments, applications F Roters, P Eisenlohr, L Hantcherli, DD Tjahjanto, TR Bieler, D Raabe Acta materialia 58 (4), 1152-1211, 2010 | 2559 | 2010 |
| The effect of alpha platelet thickness on plastic flow during hot working of TI–6Al–4V with a transformed microstructure SL Semiatin, TR Bieler Acta materialia 49 (17), 3565-3573, 2001 | 563 | 2001 |
| The role of heterogeneous deformation on damage nucleation at grain boundaries in single phase metals TR Bieler, P Eisenlohr, F Roters, D Kumar, DE Mason, MA Crimp, ... International Journal of Plasticity 25 (9), 1655-1683, 2009 | 459 | 2009 |
| Influence of Sn grain size and orientation on the thermomechanical response and reliability of Pb-free solder joints TR Bieler, H Jiang, LP Lehman, T Kirkpatrick, EJ Cotts, B Nandagopal IEEE Transactions on Components and Packaging Technologies 31 (2), 370-381, 2008 | 437 | 2008 |
| Crystal plasticity finite element methods: in materials science and engineering F Roters, P Eisenlohr, TR Bieler, D Raabe Wiley-Vch, 2010 | 422 | 2010 |
| Grain boundaries and interfaces in slip transfer TR Bieler, P Eisenlohr, C Zhang, HJ Phukan, MA Crimp Current Opinion in Solid State and Materials Science 18 (4), 212-226, 2014 | 387 | 2014 |
| The origins of heterogeneous deformation during primary hot working of Ti–6Al–4V TR Bieler, SL Semiatin International Journal of Plasticity 18 (9), 1165-1189, 2002 | 331 | 2002 |
| Superplasticity in powder metallurgy aluminum alloys and composites RS Mishra, TR Bieler, AK Mukherjee Acta metallurgica et materialia 43 (3), 877-891, 1995 | 330 | 1995 |
| Twin nucleation by slip transfer across grain boundaries in commercial purity titanium L Wang, Y Yang, P Eisenlohr, TR Bieler, MA Crimp, DE Mason Metallurgical and Materials Transactions A 41 (2), 421-430, 2010 | 328 | 2010 |
| Methodology for estimating the critical resolved shear stress ratios of α-phase Ti using EBSD-based trace analysis H Li, DE Mason, TR Bieler, CJ Boehlert, MA Crimp Acta Materialia 61 (20), 7555-7567, 2013 | 320 | 2013 |
| Effects of working, heat treatment, and aging on microstructural evolution and crystallographic texture of α, α′, α ″and β phases in Ti–6Al–4V wire L Zeng, TR Bieler Materials Science and Engineering: A 392 (1-2), 403-414, 2005 | 291 | 2005 |
| Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging S Choi, TR Bieler, JP Lucas, KN Subramanian Journal of Electronic Materials 28 (11), 1209-1215, 1999 | 277 | 1999 |
| Direct measurement of critical resolved shear stress of prismatic and basal slip in polycrystalline Ti using high energy X-ray diffraction microscopy L Wang, Z Zheng, H Phukan, P Kenesei, JS Park, J Lind, RM Suter, ... Acta Materialia 132, 598-610, 2017 | 250 | 2017 |
| Cyclic twin nucleation in tin-based solder alloys LP Lehman, Y Xing, TR Bieler, EJ Cotts Acta Materialia 58 (10), 3546-3556, 2010 | 243 | 2010 |
| Orientation informed nanoindentation of α-titanium: Indentation pileup in hexagonal metals deforming by prismatic slip C Zambaldi, Y Yang, TR Bieler, D Raabe Journal of Materials Research 27 (1), 356-367, 2012 | 229 | 2012 |
| Nucleation of paired twins at grain boundaries in titanium L Wang, P Eisenlohr, Y Yang, TR Bieler, MA Crimp Scripta Materialia 63 (8), 827-830, 2010 | 208 | 2010 |
| Effect of texture and slip mode on the anisotropy of plastic flow and flow softening during hot working of Ti-6Al-4V SL Semiatin, TR Bieler Metallurgical and Materials Transactions A 32 (7), 1787-1799, 2001 | 195 | 2001 |
| Fundamentals of lead-free solder interconnect technology TK Lee, TR Bieler, C Kim, H Ma Springer (US) chapter 1, 1-20, 2015 | 172 | 2015 |
| An analysis of (the lack of) slip transfer between near-cube oriented grains in pure Al TR Bieler, R Alizadeh, M Peña-Ortega, J Llorca International Journal of Plasticity 118, 269-290, 2019 | 169 | 2019 |
| Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys AU Telang, TR Bieler, JP Lucas, KN Subramanian, LP Lehman, Y Xing, ... Journal of electronic materials 33 (12), 1412-1423, 2004 | 165 | 2004 |
Philip EisenlohrAssociate Professor, Chemical Engineering and Materials Science, Michigan State UniversityVerified email at egr.msu.edu
