| Methods and apparatus for detecting defects in imaging arrays by image analysis GH Chapman, I Koren, Z Koren, J Dudas, C Jung US Patent 8,009,209, 2011 | 276 | 2011 |
| Vision system and proximity detector GB Immega, GH Chapman US Patent 5,726,443, 1998 | 125 | 1998 |
| Method of making a conductive path in multi-layer metal structures by low power laser beam JI Raffel, JA Yasaitis, GH Chapman, ML Naiman, MIO Technology US Patent 4,585,490, 1986 | 85 | 1986 |
| Selectively programmable interconnections in multilayer integrated circuits GH Chapman, TO Herndon US Patent 5,087,589, 1992 | 81 | 1992 |
| A monolithic Hough transform processor based on restructurable VLSI FM Rhodes, JJ Dituri, GH Chapman, BE Emerson, AM Soares, JI Raffel IEEE transactions on pattern analysis and machine intelligence 10 (1), 106-110, 1988 | 73 | 1988 |
| Anti-theft electrical power cord GH Chapman, M Zaacks US Patent 6,150,940, 2000 | 68 | 2000 |
| Fabrication of interlayer conductive paths in integrated circuits TO Herndon, GH Chapman US Patent 4,843,034, 1989 | 60 | 1989 |
| Angular domain imaging of objects within highly scattering media using silicon micromachined collimating arrays GH Chapman, M Trinh, N Pfeiffer, G Chu, D Lee IEEE Journal of selected topics in quantum electronics 9 (2), 257-266, 2003 | 59 | 2003 |
| A Wafer-Scale Digital Integrator Using Restructurable VSLI JI Raffel, AH Anderson, GH Chapman, KH Konkle, B Mathur, AM Soares, ... IEEE Journal of Solid-State Circuits 20 (1), 399-406, 2003 | 58 | 2003 |
| Quantitative analysis of in-field defects in image sensor arrays J Leung, J Dudas, GH Chapman, I Koren, Z Koren 22nd IEEE International Symposium on Defect and Fault-Tolerance in VLSI …, 2007 | 54 | 2007 |
| Identification of in-field defect development in digital image sensors J Dudas, LM Wu, C Jung, GH Chapman, Z Koren, I Koren Digital Photography III 6502, 319-330, 2007 | 54 | 2007 |
| Cathodoluminescence Characteristics of CuxS Films Produced By Different Methods JJ Loferski, GH Chapman, J Shewchun, SD Mittleman, EA De Meo, ... Solar Energy Materials 1 (1), 157, 1979 | 51 | 1979 |
| Successive order, multiple scattering of two-term Henyey-Greenstein phase functions N Pfeiffer, GH Chapman Optics express 16 (18), 13637-13642, 2008 | 50 | 2008 |
| Laser‐formed connections using polyimide JI Raffel, JF Freidin, GH Chapman Applied Physics Letters 42 (8), 705-706, 1983 | 48 | 1983 |
| Statistical identification and analysis of defect development in digital imagers J Leung, GH Chapman, Z Koren, I Koren Digital Photography V 7250, 272-283, 2009 | 43 | 2009 |
| A wafer-scale digital integrator using restructurable VSLI JI Raffel, AH Anderson, GH Chapman, KH Konkle, B Mathur, AM Soares, ... IEEE transactions on electron devices 32 (2), 479-486, 2005 | 43 | 2005 |
| The technology of laser formed interactions for wafer scale integration GH Chapman, JM Canter, SS Cohen [1989] Proceedings International Conference on Wafer Scale Integration, 21-29, 1989 | 39 | 1989 |
| Laser restructurable technology and design J Raffel, AH Anderson, GH Chapman Wafer Scale Integration, 319-363, 1988 | 38 | 1988 |
| Image contrast enhancement in angular domain optical imaging of turbid media F Vasefi, B Kaminska, GH Chapman, JJL Carson Optics express 16 (26), 21492-21504, 2008 | 37 | 2008 |
| Automatic detection of in-field defect growth in image sensors J Leung, GH Chapman, I Koren, Z Koren 2008 IEEE International Symposium on Defect and Fault Tolerance of VLSI …, 2008 | 37 | 2008 |
