| Terahertz characterization of dielectric substrates for component design and nondestructive evaluation of packages JA Hejase, PR Paladhi, PP Chahal IEEE Transactions on Components, Packaging and Manufacturing Technology 1 …, 2011 | 136 | 2011 |
| Demystifying machine learning for signal and power integrity problems in packaging M Swaminathan, HM Torun, H Yu, JA Hejase, WD Becker IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 96 | 2020 |
| A multiple angle method for THz time-domain material characterization JA Hejase, EJ Rothwell, P Chahal IEEE Transactions on Terahertz Science and Technology 3 (5), 656-665, 2013 | 43 | 2013 |
| Microwave artificially structured periodic media microfluidic sensor N Wiwatcharagoses, KY Park, JA Hejase, L Williamson, P Chahal 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1889-1893, 2011 | 42 | 2011 |
| Worst-case eye analysis of high-speed channels based on Bayesian optimization MA Dolatsara, JA Hejase, WD Becker, J Kim, SK Lim, M Swaminathan IEEE Transactions on Electromagnetic Compatibility 63 (1), 246-258, 2020 | 26 | 2020 |
| Self-calibrating technique for terahertz time-domain material parameter extraction JA Hejase, EJ Rothwell, P Chahal Journal of the Optical Society of America A 28 (12), 2561-2567, 2011 | 23 | 2011 |
| IBM POWER9 package technology and design S Chun, WD Becker, J Casey, S Ostrander, D Dreps, JA Hejase, RM Nett, ... IBM Journal of Research and Development 62 (4/5), 12: 1-12: 10, 2018 | 22 | 2018 |
| Nonlinear eddy current technique for characterizing case hardening profiles SC Chan, R Grimberg, JA Hejase, Z Zeng, P Lekeakatakunju, L Udpa, ... IEEE transactions on magnetics 46 (6), 1821-1824, 2010 | 22 | 2010 |
| Bayesian active learning for uncertainty quantification of high speed channel signaling HM Torun, JA Hejase, J Tang, WD Beckert, M Swaminathan 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging …, 2018 | 20 | 2018 |
| A hybrid methodology for jitter and eye estimation in high-speed serial channels using polynomial chaos surrogate models MA Dolatsara, JA Hejase, WD Becker, M Swaminathan IEEE Access 7, 53629-53640, 2019 | 18 | 2019 |
| DC wander effect of DC blocking capacitors on PCIe Gen3 signal integrity N Na, DM Dreps, JA Hejase 2013 IEEE 63rd Electronic Components and Technology Conference, 2063-2068, 2013 | 16 | 2013 |
| Cyber warfare awareness in lebanon: exploratory research AJ Hejase, HJ Hejase, JA Hejase International Journal of Cyber-Security and Digital Forensics (IJCSDF) 4 (4 …, 2015 | 15 | 2015 |
| Method for performing frequency band splitting JA Hejase, RF Ahmed, DM Dreps, JD Jordan, NH Pham, LA Walls US Patent 9,368,852, 2016 | 14 | 2016 |
| Design study of electronically steerable half-width microstrip leaky wave antennas JA Hejase, J Myers, L Kempel, P Chahal 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1348-1353, 2011 | 13 | 2011 |
| Invertible neural networks for inverse design of CTLE in high-speed channels MA Dolatsara, H Yu, JA Hejase, WD Becker, M Swaminathan 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2020 | 11 | 2020 |
| The IEEE EPS packaging benchmark suite F Guo, K Aygün, WD Becker, SG Talocia, JA Hejase, WW Wong, T Zhou, ... 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | 10 | 2021 |
| Neural Network Based Prediction of PCB Glass Weave Induced Skew DJ Boday, Z Chen, JA Hejase, RS Krabbenhoft, PR Paladhi, J TANG US Patent App. 15/299,546, 2018 | 10 | 2018 |
| Design and test of wide-band terahertz dielectric sub-wavelength focusing probes JA Hejase, B Schulte, P Chahal 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1035-1040, 2011 | 10 | 2011 |
| Rx equalization for a high-speed channel based on Bayesian active learning using dropout X Yang, J Tang, HM Torun, WD Becker, JA Hejase, M Swaminathan 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging …, 2020 | 9 | 2020 |
| Package and printed circuit board design of a 19.2 Gb/s data link for high-performance computing S Chun, J Hejase, J Tang, J Audet, D Becker, D Dreps, G Wiedemeier, ... 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1701-1707, 2017 | 9 | 2017 |
Wiren BeckerIBM, Ret’dVerified email at ieee.org
