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LY Thuc Hue (李淑惠)Department of Chemistry, City University of Hong KongVerified email at cityu.edu.hk
Lok Wing WONGThe Hong Kong Polytechnic UniversityVerified email at polyu.edu.hk
Qingming DengIFW Dresden (Leibniz institute for solid state and materials research)Verified email at ifw-dresden.de
young hee leeprofessor of physics, sungkyunkwan universityVerified email at skku.edu
Fangyuan ZHENGThe University of Hong KongVerified email at hku.hkQuoc Huy ThiInstitute of Advanced Technology, Vietnam Academy of Science and TechnologyVerified email at my.cityu.edu.hk
C.S. LeeCity University of Hong KongVerified email at cityu.edu.hk
Jing ZhuProfessor, School of Materials Science & Engineering, Tsinghua University, Beijing, ChinaVerified email at mail.tsinghua.edu.cnHUANG LingliCity Univeristy of Hong KongVerified email at my.cityu.edu.hk
Xiaodong ZhengHebei University of Technology; The Hong Kong Polytechnic University; IMR, CAS;Verified email at imr.ac.cn
Shu Ping LauThe Hong Kong Polytechnic University and Nanyang Technological UniversityVerified email at polyu.edu.hk
Dong Hoon Keum (금동훈)삼성전기, Samsung Electro-Mechanics CO.LTD, Corporate R&D Institute, Republic of KoreaVerified email at samsung.com
Seok Joon YunUniversity of UlsanVerified email at ulsan.ac.kr
Prof. Feng YanChair Professor of Organic Electronics, Department of Applied Physics, The Hong Kong PolytechnicVerified email at polyu.edu.hk
IO Weng FuResearch Assistant Professor, University of MacauVerified email at um.edu.mo
Gang Hee HanIncheon National UniversityVerified email at inu.ac.krHyun Kimsamsung electro-mechanicsVerified email at samsung.com
Ming YangDepartment of Applied Physics, The Hong Kong Polytechnic UniversityVerified email at polyu.edu.hk
Man PingCity University of Hong Kong, Hong Kong Polytechnic UniversityVerified email at my.cityu.edu.hkSheng Dai (戴升)East China University of Science and TechnologyVerified email at ecust.edu.cn