| Low cost electroless plating process for single chips and wafer parts and products obtained thereof H De Pauw, J Vanfleteren, S Zhang US Patent 6,548,327, 2003 | 35 | 2003 |
| Comparative study on the effects of PVT variations between a novel all-MOS current reference and alternative CMOS solutions J Windels, C Van Praet, H De Pauw, J Doutreloigne 2009 52nd IEEE International Midwest Symposium on Circuits and Systems, 49-53, 2009 | 9 | 2009 |
| Revolutionizing Patient Care: A Comprehensive Review of Recent Advances in Flexible Printed Heaters for Wearable Medical Applications HD Nemomssa, F Bossuyt, B Vandecasteele, H De Pauw, NW Gidi, ... Actuators 14 (1), 1, 2024 | 5 | 2024 |
| A 16-phase 8-branch charge pump with advanced charge recycling strategy H Peng, P Bauwens, H De Pauw, J Doutreloigne 2019 IEEE International Conference on Electron Devices and Solid-State …, 2019 | 4 | 2019 |
| Automatic load-based MOSFET segmentation for switching DC-DC converters J Windels, A Monté, H De Pauw, J Doutreloigne 2014 Proceedings of the 21st International Conference Mixed Design of …, 2014 | 3 | 2014 |
| P‐51: Mjollnir: A 300‐Output Cascadeable High‐Voltage Display Driver H De Pauw, J Doutreloigne, H De Smet, A Van Calster SID Symposium Digest of Technical Papers 37 (1), 386-389, 2006 | 3 | 2006 |
| A fully integrated half-bridge driver circuit in All-GaN GAN-IC technology U Chatterjee, H De Pauw, O Syshchyk, T Cosnier, A Vohra, S Decoutere Solid-State Electronics 207, 108707, 2023 | 2 | 2023 |
| Development of the Area-Reducing Active “Coil-Enhancement” Principle, Practiced Onto an ADSL–POTS Splitter H De Pauw, V De Gezelle, J Doutreloigne, A Van Calster, EO De Beeck, ... IEEE Transactions on Circuits and Systems I: Regular Papers 57 (2), 471-480, 2009 | 2 | 2009 |
| Development of 3D-Formed Textile-Based Electrodes with Flexible Interconnect Ribbon P Veske-Lepp, G Van Steenkiste, S Thienpondt, J Cools, H De Pauw, ... Sensors 25 (2), 414, 2025 | 1 | 2025 |
| Revolutionizing Patient Care: A Comprehensive Review of Recent Advances in Flexible Printed Heaters for Wearable Medical Applications. Actuators 2025, 14, 1 HD Nemomssa, F Bossuyt, B Vandecasteele, H De Pauw, NW Gidi, ... Rn 1 (R3), 3, 2024 | 1 | 2024 |
| Taking GaN to the Next Level of 100 V to 2000 V and Beyond Scalability with the Revolutionary 200 mm and 300 mm QST® Manufacturing Platform C Basceri, V Odnoblyudov, C Kurth, M Yamada, S Konishi, M Kawahara, ... International Conference on Compound Semiconductor Manufacturing Technology, 2024 | 1 | 2024 |
| Substrate Network Modeling for Lateral p-GaN Gate HEMTs in a 200V GAN-IC Platform M Alaei, H De Pauw, U Chatterjee, S Decoutere, J Lauwaert, B Bakeroot 2023 International Semiconductor Conference (CAS), 143-146, 2023 | 1 | 2023 |
| A monolithic low-power-consumption driver circuit based on a Dickson charge pump for MEMS actuator applications H Peng, H De Pauw, P Bauwens, J Doutreloigne Solid-State Electronics 164, 107683, 2020 | 1 | 2020 |
| A monolithic high-voltage driver circuit based on a Dickson charge pump for MEMS actuator applications H Peng, H De Pauw, P Bauwens, J Doutreloigne INTERNATIONAL JOURNAL OF CIRCUITS, SYSTEMS AND SIGNAL PROCESSING 13, 516-519, 2019 | 1 | 2019 |
| An active clamping H-bridge for isolated forward DC-DC converters, integrated in a high-voltage smart-power IC technology J Doutreloigne, H De Pauw Proceedings of the World Congress on Engineering and Computer Science 2, 2012 | 1 | 2012 |
| Extension of a multilayer interconnection technology in MCM-Si with opto-electronic facilities H De Pauw, H De Smet, J Vanfleteren, J Lernout, A Van Calster Microelectronics Reliability 40 (1), 163-170, 2000 | 1 | 2000 |
| Compressible electrode J Vanfleteren, H De Pauw, M Willockx, H De Winter, S Moorkens US Patent 12,399,071, 2025 | | 2025 |
| GaN power devices on 200 mm engineered substrates B Bakeroot, K Geens, S Kumar, H De Pauw, M Borga, A Vohra, ... | | 2024 |
| A high-efficiency charge pump with charge recycling scheme and finger boost capacitor H Peng, H De Pauw, P Bauwens, J Doutreloigne Integration 75, 85-90, 2020 | | 2020 |
| Implementation of a 16-phase 8-branch charge pump with advanced charge recycling strategy H Peng, P Bauwens, H De Pauw, J Doutreloigne IEICE Transactions on Electronics 103 (5), 231-237, 2020 | | 2020 |
