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Edmund Han
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Ultrasoft slip-mediated bending in few-layer graphene
E Han, J Yu, E Annevelink, J Son, DA Kang, K Watanabe, T Taniguchi, ...
Nature materials 19 (3), 305-309, 2020
2902020
Designing the bending stiffness of 2D material heterostructures
J Yu, E Han, MA Hossain, K Watanabe, T Taniguchi, E Ertekin, ...
Advanced Materials 33 (9), 2007269, 2021
722021
Elucidating the Effect of Iron Speciation (Fe2+/Fe3+) on Crystallization Kinetics of Sodium Aluminosilicate Glasses
Y Shaharyar, JY Cheng, E Han, A Maron, J Weaver, J Marcial, JS McCloy, ...
Journal of the American Ceramic Society 99 (7), 2306-2315, 2016
552016
Crystallization behavior of iron‐ and boron‐containing nepheline (Na2O·Al2O3·2SiO2) based model high‐level nuclear waste glasses
A Deshkar, M Ahmadzadeh, A Scrimshire, E Han, PA Bingham, D Guillen, ...
Journal of the American Ceramic Society 102 (3), 1101-1121, 2019
452019
Stochastic stress jumps due to soliton dynamics in two-dimensional van der Waals interfaces
SP Kim, E Annevelink, E Han, J Yu, PY Huang, E Ertekin, ...
Nano letters 20 (2), 1201-1207, 2020
312020
Wafer-scale programmed assembly of one-atom-thick crystals
SJ Yang, JH Jung, E Lee, E Han, MY Choi, D Jung, S Choi, JH Park, D Oh, ...
Nano letters 22 (4), 1518-1524, 2022
282022
Bend-Induced Ferroelectric Domain Walls in α-In2Se3
E Han, SM Nahid, T Rakib, G Nolan, PF Ferrari, MA Hossain, A Schleife, ...
ACS nano 17 (8), 7881-7888, 2023
212023
Facilitated fluorination and etching of 2D materials
Y Shin, S Shin, D Sung, J Cha, HK Choi, Y Jeong, MJ Im, YH Kim, S Ahn, ...
Applied Surface Science 645, 158857, 2024
142024
Jangyup Son, Dongyun A. Kang, Kenji Watanabe, Takashi Taniguchi, Elif Ertekin, Pinshane Y. Huang, and Arend M. van der Zande. Ultrasoft slipmediated bending in few-layer graphene
E Han, J Yu, E Annevelink
Nature materials 19 (3), 305-309, 2019
142019
Crystallization behavior of iron-and boron-containing nepheline (Na2O• Al2O3• 2SiO2) based glasses: Implications on the chemical durability of high-level nuclear waste glasses
A Deshkar, M Ahmadzadeh, A Scrimshire, E Han, PA Bingham, D Guillen, ...
ALL RIGHTS RESERVED, 189, 2019
52019
Revealing 3D Defect Structure in van der Waals Ferroelectric α-In2Se3 via Multislice Electron Ptychography
G Nolan, E Han, SM Nahid, PT Carmichael, AM van der Zande, A Schleife, ...
Microscopy and Microanalysis 30 (Supplement_1), ozae044. 551, 2024
22024
2d materials: Designing the bending stiffness of 2d material heterostructures (adv. mater. 9/2021)
J Yu, E Han, MA Hossain, K Watanabe, T Taniguchi, E Ertekin, ...
Advanced Materials 33 (9), 2170066, 2021
12021
Probing the Intrinsic Bending Stiffness of 2D Multilayers and Heterostructures Using Aberration-corrected STEM
E Han, J Yu, M Houssain, K Watanabe, T Taniguchi, E Ertekin, ...
Microscopy and Microanalysis 26 (S2), 1632-1634, 2020
12020
Facilitated fluorination and etching of 2D materials (vol 645, 158857, 2024)
Y Shin, S Shin, D Sung, J Cha, HK Choi, Y Jeong, MJ Im, YH Kim, S Ahn, ...
APPLIED SURFACE SCIENCE 700, 2025
2025
Corrigendum to “Facilitated fluorination and etching of 2D materials”[Appl. Surf. Sci. 645 (2024) 158857]
Y Shin, S Shin, D Sung, J Cha, HK Choi, Y Jeong, MJ Im, YH Kim, S Ahn, ...
Applied Surface Science 700, 163144, 2025
2025
Detecting DNA translocation through a nanopore using a van der Waals heterojunction diode
S Chen, S Huang, J Son, E Han, K Watanabe, T Taniguchi, PY Huang, ...
Proceedings of the National Academy of Sciences 122 (18), e2422135122, 2025
2025
Electrical DNA Sensing using a Vertical 2D Heterojunction Diode Nanopore
S Chen, S Huang, J Son, E Han, K Watanabe, T Taniguchi, P Huang, ...
2024
Deformable electronic device and method of making a deformable electronic device
P Huang, A Van Der Zande, E Ertekin, E Han, J YU, MA Hossain
US Patent 11,908,894, 2024
2024
Imaging Charged Domain Walls in van der Waals Ferroelectric α-In2Se3 via 4D-STEM
G Nolan, E Han, SM Nahid, AM van der Zande, A Schleife, P Huang
Microscopy and Microanalysis 29 (Supplement_1), 1644-1645, 2023
2023
Atomic-scale studies of bending in two-dimensional materials using transmission electron microscopy
E Han
University of Illinois at Urbana-Champaign, 2022
2022
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Articles 1–20