| Optimum mask and source patterns to print a given shape AE Rosenbluth, S Bukofsky, C Fonseca, M Hibbs, K Lai, AF Molless, ... Journal of Micro/Nanolithography, MEMS and MOEMS 1 (1), 13-30, 2002 | 349 | 2002 |
| Optimum mask and source patterns to print a given shape AE Rosenbluth, SJ Bukofsky, MS Hibbs, K Lai, AF Molless, RN Singh, ... Optical Microlithography XIV 4346, 486-502, 2001 | 170 | 2001 |
| Modeling of stress-induced leakage current in ultrathin oxides with the trap-assisted tunneling mechanism AI Chou, K Lai, K Kumar, P Chowdhury, JC Lee Applied physics letters 70 (25), 3407-3409, 1997 | 145 | 1997 |
| Directed self-assembly of block copolymers for 7 nanometre FinFET technology and beyond CC Liu, E Franke, Y Mignot, R Xie, CW Yeung, J Zhang, C Chi, C Zhang, ... Nature Electronics 1 (10), 562-569, 2018 | 142 | 2018 |
| Method of forming sub-lithographic features using directed self-assembly of polymers J Cheng, K Lai, W Li, YH Na, C Rettner, DP Sanders, D Yang US Patent 8,114,306, 2012 | 127 | 2012 |
| Printability verification by progressive modeling accuracy GM Gallatin, K Lai, M Mukherjee, AE Rosenbluth US Patent 7,512,927, 2009 | 84 | 2009 |
| Experimental result and simulation analysis for the use of pixelated illumination from source mask optimization for 22nm logic lithography process K Lai, AE Rosenbluth, S Bagheri, J Hoffnagle, K Tian, D Melville, ... Optical Microlithography XXII 7274, 82-93, 2009 | 74 | 2009 |
| Intensive optimization of masks and sources for 22nm lithography AE Rosenbluth, DO Melville, K Tian, S Bagheri, J Tirapu-Azpiroz, K Lai, ... Optical Microlithography XXII 7274, 67-81, 2009 | 69 | 2009 |
| Method for evaluating the effects of multiple exposure processes in lithography CA Fonseca, SJ Bukofsky, K Lai US Patent 6,777,147, 2004 | 68 | 2004 |
| Scattered light: the increasing problem for 193-nm exposure tools and beyond K Lai, CHJ Wu, CJ Progler Optical Microlithography XIV 4346, 1424-1435, 2001 | 68 | 2001 |
| Method for designing optical lithography masks for directed self-assembly J Cheng, K Lai, W Li, YH Na, JW Pitera, CT Rettner, DP Sanders, D Yang US Patent 8,336,003, 2012 | 58 | 2012 |
| Extending the range of lithographic simulation integrals GM Gallatin, E Gofman, K Lai, MA Lavin, M Mukherjee, D Ramm, ... US Patent 7,010,776, 2006 | 54 | 2006 |
| Benefits and trade-offs of global source optimization in optical lithography K Tian, A Krasnoperova, D Melville, AE Rosenbluth, D Gil, ... Optical Microlithography XXII 7274, 105-116, 2009 | 49 | 2009 |
| Design of a tunable GaAs/AlGaAs multiple-quantum-well resonant-cavity photodetector K Lai, JC Campbell IEEE journal of quantum electronics 30 (1), 108-114, 2002 | 46 | 2002 |
| Correlation of dielectric breakdown with hole transport for ultrathin thermal oxides and N2O oxynitrides MY Hao, WM Chen, K Lai, JC Lee, M Gardner, J Fulford Applied physics letters 66 (9), 1126-1128, 1995 | 46 | 1995 |
| Directed self-assembly of block copolymers using segmented prepatterns J Cheng, K Lai, W Li, YH Na, C Rettner, DP Sanders US Patent 8,398,868, 2013 | 44 | 2013 |
| Progress towards the integration of optical proximity correction and directed self-assembly of block copolymers with graphoepitaxy CC Liu, J Pitera, N Lafferty, K Lai, C Rettner, M Tjio, N Arellano, J Cheng Alternative Lithographic Technologies IV 8323, 178-184, 2012 | 41 | 2012 |
| New paradigm in lens metrology for lithographic scanner: evaluation and exploration K Lai, GM Gallatin, MA van de Kerkhof, W de Boeij, H Kok, M Schriever, ... Optical Microlithography XVII 5377, 160-171, 2004 | 41 | 2004 |
| Demonstrating the benefits of source-mask optimization and enabling technologies through experiment and simulations D Melville, AE Rosenbluth, K Tian, K Lai, S Bagheri, J Tirapu-Azpiroz, ... Optical Microlithography XXIII 7640, 51-68, 2010 | 38 | 2010 |
| Design and manufacturability tradeoffs in unidirectional and bidirectional standard cell layouts in 14 nm node K Vaidyanathan, SH Ng, D Morris, N Lafferty, L Liebmann, M Bender, ... Design for Manufacturability through Design-Process Integration VI 8327, 164-175, 2012 | 37 | 2012 |