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Boon S. OoiRPI & KAUSTVerified email at kaust.edu.sa
Xiaobin SunArchitect of Optical Interconnection for AI Cluster, HuaweiVerified email at huawei.com
Hassan Makine OubeiKing Abdullah University of Science and TechnologyVerified email at kaust.edu.sa
Bilal JanjuaUofTVerified email at utoronto.ca
Chun Hong KangKing Abdullah University of Science and Technology (KAUST)Verified email at kaust.edu.sa
Prof. Mohamed-Slim AlouiniWireless CT Lab, King Abdullah University of Science and Technology (KAUST), Kingdom of Saudi ArabiaVerified email at kaust.edu.sa
Changmin LeePalomino Laboratories, IncVerified email at palominolabs.ai
Chao ZhaoProfessor, Institute of Semiconductors, Chinese Academy of Sciences; Fellow of IOPVerified email at semi.ac.cn
Jorge A. Holguín-LermaCorning IncorporatedVerified email at corning.com
Kang-Ting HoKAUSTVerified email at kaust.edu.saOmar AlkhazragiUniversity of MichiganVerified email at umich.edu
Guangyu LiuKAUST, Intel, Lehigh UniversityVerified email at kaust.edu.sa
Aditya PrabaswaraEpitaxy development engineer, ams OSRAM international GmbHVerified email at tyndall.ie
Osman BakrProfessor, Materials Science & Eng., King Abdullah University of Science and Technology (KAUST)Verified email at kaust.edu.sa
John T. LeonardAppleVerified email at umail.ucsb.edu
Abdullah AlatawiKing Abdullah University for Science and TechnologyVerified email at kaust.edu.sa
Jun PanZhejiang University of Technology; KAUSTVerified email at zjut.edu.cn
Mohammed Zahed M. KhanSenior Lecturer, Electrical and Electronics Engg, School of EBE, Anglia Ruskin UniversityVerified email at aru.ac.uk
Jr-Hau HeInternational College of Semiconductor Technology, NYCUVerified email at nycu.edu.tw
Omar F. Mohammed, PhD, FRSC, FIM...Professor, Materials Science & Engineering, King Abdullah University of Science and TechnologyVerified email at kaust.edu.sa