| Additive manufacturing of 3D nano-architected metals A Vyatskikh, S Delalande, A Kudo, X Zhang, CM Portela, JR Greer Nature communications 9 (1), 593, 2018 | 655 | 2018 |
| Lightweight, flaw-tolerant, and ultrastrong nanoarchitected carbon X Zhang, A Vyatskikh, H Gao, JR Greer, X Li Proceedings of the National Academy of Sciences 116 (14), 6665-6672, 2019 | 256 | 2019 |
| Theoretical strength and rubber-like behaviour in micro-sized pyrolytic carbon X Zhang, L Zhong, A Mateos, A Kudo, A Vyatskikh, H Gao, JR Greer, X Li Nature nanotechnology 14 (8), 762-769, 2019 | 143 | 2019 |
| A scalable route to nanoporous large-area atomically thin graphene membranes by roll-to-roll chemical vapor deposition and polymer support casting PR Kidambi, DD Mariappan, NT Dee, A Vyatskikh, S Zhang, R Karnik, ... ACS applied materials & interfaces 10 (12), 10369-10378, 2018 | 128 | 2018 |
| Process integration and future outlook of 2D transistors KP O’Brien, CH Naylor, C Dorow, K Maxey, AV Penumatcha, A Vyatskikh, ... nature communications 14 (1), 6400, 2023 | 123 | 2023 |
| Additive manufacturing of high-refractive-index, nanoarchitected titanium dioxide for 3D dielectric photonic crystals A Vyatskikh, RC Ng, B Edwards, RM Briggs, JR Greer Nano Letters 20 (5), 3513-3520, 2020 | 120 | 2020 |
| Additive manufacturing of polymer-derived titania for one-step solar water purification A Vyatskikh, A Kudo, S Delalande, JR Greer Materials Today Communications 15, 288-293, 2018 | 86 | 2018 |
| Additive manufacturing by spatially controlled material fusion MC FELDMANN, AJ Hart, K SVENSON, A Vyatskikh US Patent 10,919,090, 2021 | 57 | 2021 |
| Enhancement-mode 300-mm GaN-on-Si (111) with integrated Si CMOS for future mm-wave RF applications HW Then, M Radosavljevic, Q Yu, A Latorre-Rey, H Vora, S Bader, ... IEEE Microwave and Wireless Technology Letters 33 (6), 835-838, 2023 | 34 | 2023 |
| Fabrication and design of composites with architected layers CM PORTELA, A Vyatskikh, JR Greer US Patent App. 16/206,163, 2020 | 24 | 2020 |
| DrGaN: An integrated CMOS driver-GaN power switch technology on 300mm GaN-on-Si with E-mode GaN MOSHEMT and 3D monolithic Si PMOS HW Then, M Radosavljevic, S Bader, A Zubair, H Vora, N Nair, P Koirala, ... 2023 International Electron Devices Meeting (IEDM), 1-4, 2023 | 23 | 2023 |
| High mobility TMD NMOS and PMOS transistors and GAA architecture for ultimate CMOS scaling A Penumatcha, KP O’Brien, K Maxey, W Mortelmans, R Steinhardt, ... 2023 International Electron Devices Meeting (IEDM), 1-4, 2023 | 22 | 2023 |
| Record Performance in GAA 2D NMOS and PMOS using Monolayer MoS2 and WSe2 with scaled contact and gate length W Mortelmans, P Buragohain, C Rogan, A Kitamura, CJ Dorow, ... 2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and …, 2024 | 18 | 2024 |
| Additive manufacturing of architectured materials A Vyatskikh, SJ Delalande, JR Greer US Patent App. 15/719,338, 2018 | 18 | 2018 |
| Advancements in 300 mm GaN-on-Si technology with industry’s first circuit demonstration of monolithically integrated GaN and Si transistors Q Yu, AA Farid, I Momson, J Garrett, H Vora, S Bader, A Zubair, P Koirala, ... IEEE Microwave and Wireless Technology Letters 34 (6), 745-748, 2024 | 10 | 2024 |
| Three-dimensional architected pyrolyzed electrodes for use in secondary batteries and methods of making three-dimensional architected electrodes JR Greer, A Vyatskikh, JS Thorne, A Kudo, K NARITA, MA CITRIN, ... US Patent 10,833,318, 2020 | 10 | 2020 |
| Gate Oxide Module Development for Scaled GAA 2D FETs Enabling SS< 75mV/d and Record Idmax> 900μA/μm at Lg< 50nm W Mortelmans, P Buragohain, A Kitamura, CJ Dorow, C Rogan, ... 2024 IEEE International Electron Devices Meeting (IEDM), 1-4, 2024 | 8 | 2024 |
| Additive manufacturing of titanium dioxide for dielectric photonic crystals A Vyatskikh, RC Ng, B Edwards, JR Greer Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XII …, 2019 | 7 | 2019 |
| IEEE Microwave and Wireless Tech HW Then, M Radosavljevic, Q Yu, A Latorre-Rey, H Vora, S Bader, ... Lett 33 (6), 835-838, 2023 | 6 | 2023 |
| Wafer-to-Wafer Bonding with Ultralow Thermal Resistance and High Bonding Energy W Li, F Eid, A Vyatskikh, R Vreeland, W Brezinski, M Njuki, C Jezewski, ... 2025 IEEE 75th Electronic Components and Technology Conference (ECTC), 79-82, 2025 | 4 | 2025 |
