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Co-authors
Ying ShanDistinguished Scientist at Tencent, Director of ARC LabVerified email at tencent.com
Mike Z. SHOUNational U. of Singapore; Facebook AI; Columbia UniversityVerified email at columbia.edu
Xiaohu QieTencentVerified email at tencent.com
Hongsheng Li (李鸿升)The Chinese University of Hong KongVerified email at ee.cuhk.edu.hk
Xintao WangKling Team, Kuaishou TechnologyVerified email at ie.cuhk.edu.hk
Ping Luo (羅平)Associate Professor, The University of Hong Kong; MMLAB@HKUVerified email at hku.hk
Xihui LiuUniversity of Hong Kong, UC Berkeley, CUHK, Tsinghua UniversityVerified email at hku.hk
Weixian LeiNational University of SingaporeVerified email at u.nus.eduXinggang WangProfessor, Huazhong University of Science and TechnologyVerified email at hust.edu.cn
Yuying GeXPENG RoboticsVerified email at xiaopeng.com
Yukang GanTencent ARC LabVerified email at tencent.com
Xiaogang WangProfessor of Electronic Engineering, the Chinese University of Hong KongVerified email at ee.cuhk.edu.hk
Yan-Pei CaoVASTVerified email at vastai3d.com
Wenqi ShaoResearcher at Shanghai AI LaboratoryVerified email at pjlab.org.cn
Yansong Tang (唐彦嵩)Associate Professor, Tsinghua UniversityVerified email at sz.tsinghua.edu.cn
Hengshuang ZhaoThe University of Hong KongVerified email at cs.hku.hk
Wanli Ouyang (欧阳万里)SLAI & CUHK & Shanghai AI LabVerified email at sydney.edu.au
Yu LiIDEAVerified email at idea.edu.cn
Zhongang Qi (祁仲昂)Chief Scientist, Imaging AI, vivoVerified email at vivo.com