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C.S. LeeCity University of Hong KongVerified email at cityu.edu.hkCHEN Xianfeng (Michael)Institute for Bioengineering, School of Engineering, The University of EdinburghVerified email at ed.ac.uk
Chundong WangProfessor at Huazhong University of Science and TechnologyVerified email at hust.edu.cn
Juan Antonio ZapienCity Uniiversity of Hong KongVerified email at cityu.edu.hk
NG Tsz-WaiCity University of Hong KongVerified email at cityu.edu.hk
zhenyu.zhangDoctor of Chongqing Communication InstituteVerified email at cqu.edu.cn
Shuilin WuSouth central minzu UniversityVerified email at my.cityu.edu.hkLin-Bao Luo (罗林保)Hefei University of Technology (合肥工业大学微电子学院教授)Verified email at hfut.edu.cn
Zhubing HESouthern University of Science and TechnologyVerified email at sustc.edu.cn
Xin JiangProfessor, University of SiegenVerified email at uni-siegen.deGuo HongCity University of Hong KongVerified email at cityu.edu.hk
CHENG JunyeShenzhen MSU-BIT UniversityVerified email at smbu.edu.cn
Wenyue LiMoses Lake Industries Inc.Verified email at mlindustries.com
Xiaoyue ZhuUniversity of Rhode IslandVerified email at uri.edu
Kaili ZhangProfessor, Dept. of Mechanical Engineering, City University of Hong KongVerified email at cityu.edu.hkJinfeng ZhangSchool of Life Science, Beijing Institute of TechnologyVerified email at bit.edu.cn
Hong-En Wang(王洪恩)Yunnan Normal University(云南师范大学)Verified email at ynnu.edu.cn
Yeshayahu LifshitzAlfred and Marion Bar Chair of Engineering, Dept. of Materials Science and Engineering, TechnionVerified email at tx.technion.ac.ilChaoping LiuShantou UniversityVerified email at stu.edu.cn
Shrawan Kumar Jha, PhD, SMIEEEImperial College LondonVerified email at imperial.ac.uk