| Growth time performance dependence of vertically aligned carbon nanotube supercapacitors grown on aluminum substrates R Reit, J Nguyen, WJ Ready Electrochimica Acta 91, 96-100, 2013 | 86 | 2013 |
| Design and demonstration of an intracortical probe technology with tunable modulus DM Simon, H Charkhkar, C St. John, S Rajendran, T Kang, R Reit, ... Journal of Biomedical Materials Research Part A 105 (1), 159-168, 2017 | 76 | 2017 |
| Organic light-emitting diodes on shape memory polymer substrates for wearable electronics MP Gaj, A Wei, C Fuentes-Hernandez, Y Zhang, R Reit, W Voit, ... Organic Electronics 25, 151-155, 2015 | 58 | 2015 |
| High‐Tg Thiol‐Click Thermoset Networks via the Thiol‐Maleimide Michael Addition S Parker, R Reit, H Abitz, G Ellson, K Yang, B Lund, WE Voit Macromolecular rapid communications 37 (13), 1027-1032, 2016 | 53 | 2016 |
| Integration of high-charge-injection-capacity electrodes onto polymer softening neural interfaces DE Arreaga-Salas, A Avendaño-Bolívar, D Simon, R Reit, ... ACS applied materials & interfaces 7 (48), 26614-26623, 2015 | 45 | 2015 |
| Polymer substrate for flexible electronics microfabrication and methods of use R Radu, A AVENDANO-BOLIVAR, D ARREAGA-SALAS US Patent 10,615,191, 2020 | 31 | 2020 |
| Hydrolytically stable thiol–ene networks for flexible bioelectronics R Reit, D Zamorano, S Parker, D Simon, B Lund, W Voit, TH Ware ACS applied materials & interfaces 7 (51), 28673-28681, 2015 | 25 | 2015 |
| Method for forming flexible cover lens films R Radu, A AVENDANO-BOLIVAR, A Voutsas, D ARREAGA-SALAS US Patent 11,667,111, 2023 | 17 | 2023 |
| Thiol–epoxy/maleimide ternary networks as softening substrates for flexible electronics R Reit, H Abitz, N Reddy, S Parker, A Wei, N Aragon, M Ho, ... Journal of Materials Chemistry B 4 (32), 5367-5374, 2016 | 17 | 2016 |
| Shape memory polymer–inorganic hybrid nanocomposites R Reit, B Lund, W Voit Organic-Inorganic Hybrid Nanomaterials, 313-350, 2014 | 15 | 2014 |
| Flexible color filter and method of manufacturing R Radu, A AVENDANO-BOLIVAR, D ARREAGA-SALAS US Patent App. 16/481,438, 2019 | 7 | 2019 |
| Robotic Insertion Aid for Self-Coiling Cochlear Implants H Ajieren, R Reit, R Lee, T Pham, D Shao, K Lee, W Voit MRS Advances 1 (1), 51-56, 2016 | 7 | 2016 |
| New Polymer Materials Enable a Variety of Flexible Substrates T Voutsas, R Reit, A Avendano, D Arreaga, J Dupree Letters to the Editor, 2005 | 5 | 2005 |
| Substrates for stretchable electronics and method of manufacture R Radu, D ARREAGA-SALAS US Patent 10,736,212, 2020 | 4 | 2020 |
| 82‐3: Temporary Bonding Alternative to Laser Lift‐Off for Flexible Displays R Reit, J Espinoza, A Vega, T Voutsas, A Avendaño-Bolívar, ... SID Symposium Digest of Technical Papers 49 (1), 1110-1112, 2018 | 4 | 2018 |
| Photopatterned planarization layers for flexible electronics R Radu, A AVENDANO-BOLIVAR, A Voutsas, D ARREAGA-SALAS US Patent 11,427,684, 2022 | 2 | 2022 |
| Temporary bonding layer for flexible electronics fabrication R Radu, D ARREAGA-SALAS US Patent 10,840,120, 2020 | 1 | 2020 |
| P‐216: High efficiency, transparent overcoat for planarization of display modules R Reit, N Nagashima, M Imaizumi, S Mori, K Yang, A Vega, A Avendano, ... SID Symposium Digest of Technical Papers 50 (1), 1518-1521, 2019 | 1 | 2019 |
| Electronics backplanes using thiol-click chemistry substrates R Radu, AE Avendano-Bolivar, DE Arreaga-Salas, WE Voit US Patent App. 15/521,521, 2018 | 1 | 2018 |
| Overview of Mechanical Behavior of Materials R Reit, M Di Prima, WE Voit Biomaterial Mechanics, 2-24, 2017 | 1 | 2017 |
Walter VoitUniversity of Texas at DallasVerified email at utdallas.edu
