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Kim S Siow
Kim S Siow
Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia (National
Verified email at ukm.edu.my
Title
Cited by
Cited by
Year
Plasma methods for the generation of chemically reactive surfaces for biomolecule immobilization and cell colonization‐a review
KS Siow, L Britcher, S Kumar, HJ Griesser
Plasma processes and polymers 3 (6‐7), 392-418, 2006
12282006
Mechanical properties of nano-silver joints as die attach materials
KS Siow
Journal of Alloys and Compounds 514, 6-19, 2012
4812012
Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?
KS Siow
Journal of Electronic Materials 43 (4), 947-961, 2014
3932014
Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints
TF Chen, KS Siow
Journal of Alloys and Compounds 866, 158783, 2021
2402021
XPS Study of Sulfur and Phosphorus Compounds with Different Oxidation States
K SIOW, L Britcher, S Kumar, H JGriesser
Sains Malaysiana 47 (8), 1913-1922, 2018
2262018
Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (DBC) and copper substrates aged at 300° C
ST Chua, KS Siow
Journal of Alloys and Compounds 687, 486-498, 2016
2192016
Identifying the development state of sintered silver (Ag) as a bonding material in the microelectronic packaging via a patent landscape study
KS Siow, YT Lin
Journal of Electronic Packaging 138 (2), 020804, 2016
1962016
Unveiling the damage evolution of SAC305 during fatigue by entropy generation
X Long, Y Guo, Y Su, KS Siow, C Chen
International Journal of Mechanical Sciences 244, 108087, 2023
1152023
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging
KS Siow
Materials, Process, Equipment, and Reliability, Springer International …, 2019
1062019
Mechanical properties of nanocrystalline copper and nickel
KS Siow, AAO Tay, P Oruganti
Materials science and technology 20 (3), 285-294, 2004
912004
Low‐Pressure Plasma Methods for Generating Non‐Reactive Hydrophilic and Hydrogel‐Like Bio‐Interface Coatings–A Review
KS Siow, S Kumar, HJ Griesser
Plasma Processes and Polymers 12 (1), 8-24, 2015
782015
Plasma polymerized carvone as an antibacterial and biocompatible coating
YW Chan, KS Siow, PY Ng, U Gires, BY Majlis
Materials Science and Engineering: C 68, 861-871, 2016
702016
Sulfonated Surfaces by Sulfur Dioxide Plasma Surface Treatment of Plasma Polymer Films
KS Siow, L Britcher, S Kumar, HJ Griesser
Plasma Processes and Polymers 6 (9), 583-592, 2009
682009
Deposition and XPS and FTIR Analysis of Plasma Polymer Coatings Containing Phosphorus
KS Siow, L Britcher, S Kumar, HJ Griesser
Plasma Processes and Polymers 11 (2), 133-141, 2014
662014
Public benefit and risk perceptions of nanotechnology development: Psychological and sociological aspects
NA Kamarulzaman, KE Lee, KS Siow, M Mokhtar
Technology in Society 62, 101329, 2020
592020
QCM-D and XPS study of protein adsorption on plasma polymers with sulfonate and phosphonate surface groups
KS Siow, L Britcher, S Kumar, HJ Griesser
Colloids and Surfaces B: Biointerfaces 173, 447-453, 2019
592019
Pitting corrosion of duplex stainless steels
KS Siow, TY Song, JH Qiu
Anti Corrosion Methods and Materials 48 (1), 31-37, 2001
572001
Rapid sintering of nano-Ag paste at low current to bond large area (>100 mm2) power chips for electronics packaging
Y Xie, Y Wang, Y Mei, H Xie, K Zhang, S Feng, KS Siow, X Li, GQ Lu
Journal of Materials Processing Technology 255, 644-649, 2018
512018
Review of uniqueness challenge in inverse analysis of nanoindentation
X Long, Y Li, Z Shen, Y Su, T Gu, KS Siow
Journal of Manufacturing Processes 131, 1897-1916, 2024
502024
Constitutive, creep, and fatigue behavior of sintered Ag for finite element simulation of mechanical reliability: a critical review
X Long, Y Guo, Y Su, KS Siow, C Chen
Journal of Materials Science: Materials in Electronics 33 (5), 2293-2309, 2022
452022
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Articles 1–20