| Design and fabrication of screen-printed silver circuits for stretchable electronics KS Kim, KH Jung, SB Jung Microelectronic engineering 120, 216-220, 2014 | 84 | 2014 |
| Photo-induced healing of stretchable transparent electrodes based on thermoplastic polyurethane with embedded metallic nanowires KS Kim, SB Choi, DU Kim, CR Lee, JW Kim Journal of Materials Chemistry A 6 (26), 12420-12429, 2018 | 51 | 2018 |
| The characteristics of Cu nanopaste sintered by atmospheric-pressure plasma KS Kim, JO Bang, YH Choa, SB Jung Microelectronic engineering 107, 121-124, 2013 | 44 | 2013 |
| Electrochemical migration behavior of silver nanopaste screen-printed for flexible and printable electronics KS Kim, JO Bang, SB Jung Current Applied Physics 13, S190-S194, 2013 | 39 | 2013 |
| Microstructure, electrical properties, and electrochemical migration of a directly printed Ag pattern BI Noh, JW Yoon, KS Kim, YC Lee, SB Jung Journal of Electronic Materials 40 (1), 35-41, 2011 | 39 | 2011 |
| Intense pulsed light sintering of vanadium dioxide nanoparticle films and their optical properties for thermochromic smart window KS Kim, EW Son, JW Youn, DU Kim Materials & Design 176, 107838, 2019 | 36 | 2019 |
| Electrochemical migration of directly printed Ag electrodes using Ag paste with epoxy binder BI Noh, JW Yoon, KS Kim, S Kang, SB Jung Microelectronic engineering 103, 1-6, 2013 | 33 | 2013 |
| Flexibility of silver conductive circuits screen-printed on a polyimide substrate KS Kim, YC Lee, JW Kim, SB Jung Journal of nanoscience and nanotechnology 11 (2), 1493-1498, 2011 | 30 | 2011 |
| Effects of sintering conditions on microstructure and characteristics of screen-printed Ag thin film KS Kim, WR Myung, SB Jung Electronic Materials Letters 8 (3), 309-314, 2012 | 27 | 2012 |
| Enhancing adhesion of screen‐printed silver nanopaste films JH Kim, KS Kim, KR Jang, SB Jung, TS Kim Advanced Materials Interfaces 2 (13), 1500283, 2015 | 26 | 2015 |
| Regulation in shear test method for BGA of flip-chip packages JH Ahn, KS Kim, YC Lee, YI Kim, SB Jung Journal of the Microelectronics and Packaging Society 17 (3), 1-9, 2010 | 26 | 2010 |
| Fabrication of a bending-insensitive in-plane strain sensor from a reversible cross-linker-functionalized silicone polymer SO Kim, CJ Han, Y Kim, KS Kim, DU Kim, CR Lee, JW Kim ACS applied materials & interfaces 12 (5), 6516-6524, 2020 | 24 | 2020 |
| Microstructure and adhesion characteristics of a silver nanopaste screen-printed on Si substrate KS Kim, Y Kim, SB Jung Nanoscale research letters 7 (1), 49, 2012 | 23 | 2012 |
| Revisiting the thickness reduction approach for near-foldable capacitive touch sensors based on a single layer of Ag nanowire-polymer composite structure KS Kim, SO Kim, CJ Han, DU Kim, JS Kim, YT Yu, CR Lee, JW Kim Composites Science and Technology 165, 58-65, 2018 | 21 | 2018 |
| Adhesion characteristics of VO2 ink film sintered by intense pulsed light for smart window JW Youn, SJ Lee, KS Kim, DU Kim Applied Surface Science 441, 508-514, 2018 | 20 | 2018 |
| Fabrication of Ag-MWNT nanocomposite paste for high-power LED package KS Kim, BG Park, H Kim, HS Lee, SB Jung Current Applied Physics 15, S36-S41, 2015 | 18 | 2015 |
| Electrochemical migration of Ag nanoink patterns controlled by atmospheric-pressure plasma KS Kim, YT Kwon, YH Choa, SB Jung Microelectronic engineering 106, 27-32, 2013 | 18 | 2013 |
| Thermochromic vanadium dioxide nanostructures for smart windows and radiative cooling J Yoon, KS Kim, WK Hong Chemistry–A European Journal 30 (43), e202400826, 2024 | 17 | 2024 |
| Effect of Process Parameters on TSV Formation Using Deep Reactive Ion Etching KS Kim, YC Lee, JH Ahn, JY Song, CD Yoo, SB Jung Korean Journal of Metals and Materials 48 (11), 1028-1034, 2010 | 17 | 2010 |
| Evaluation of the flexibility of silver circuits screen-printed on polyimide with an environmental reliability test KS Kim, YC Lee, JH Ahn, SB Jung Journal of nanoscience and nanotechnology 11 (7), 5806-5811, 2011 | 16 | 2011 |
