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Mingjun HuCity University of Hong KongVerified email at mail.ustc.edu.cn
Wei HuangVerified email at uwm.eduRuguang Ma (马汝广)Shanghai Institute of Ceramics, Chinese Academy of SciencesVerified email at mail.sic.ac.cn
Haoyi TanBeihang UniversityVerified email at buaa.edu.cnTian WangBeihang UniversityVerified email at buaa.edu.cn
Hichem SnoussiProfessor of Signal and Image Processing, University of Technology of TroyesVerified email at utt.fr
G.P. ZhengHong Kong Polytechnic UniversityVerified email at polyu.edu.hk
Jiliang ZhangDalian Jiaotong UniversityVerified email at djtu.edu.cnJiacheng Wang (王家成)Taizhou University/Previous: Shanghai Institute of Ceram., CAS/Tokyo Univ./DUT/Cardiff Univ.Verified email at mail.sic.ac.cn
Claudia FelserMax Planck Institute Chemical Physics of SolidsVerified email at cpfs.mpg.de
Haoshen ZhuResearch Fellow, University of MichiganVerified email at umich.edu
Hailong ChenInstitute of Physics, Chinese Academy of SciencesVerified email at iphy.ac.cnSeeram RamakrishnaNational University of SingaporeVerified email at nus.edu.sg
Zhouguang LuProfessor of Materials Science and Engineering, Southern University of Science and TechnologyVerified email at sustc.edu.cn
Chenwei CaoCity University of Hong KongVerified email at my.cityu.edu.hk
Jonathan C.Y. ChungDept. of Physics & Materials Science, City University of Hong KongVerified email at cityu.edu.hkJoshua E-Y LeeAssociate Professor, University of Technology SydneyVerified email at uts.edu.au
Xingang Ren(任信钢)Anhui UniversityVerified email at ahu.edu.cn
Wei E. I. ShaAssociate Professor, Zhejiang UniversityVerified email at zju.edu.cn
Li Jun JiangDept. of ECE, Missouri University of Science and TechnologyVerified email at umsystem.edu