| Effect of tool-electrode material in through-hole formation using ECDM process J Arab, K Pawar, P Dixit Materials and Manufacturing Processes 36 (9), 1019-1027, 2021 | 45 | 2021 |
| A critical review of copper electroless deposition on glass substrates for microsystems packaging applications K Pawar, P Dixit Surface Engineering 38 (6), 576-617, 2022 | 33 | 2022 |
| Investigations into surface topography of glass microfeatures formed by pulsed electrochemical discharge milling for microsystem applications AK Verma, DK Mishra, K Pawar, P Dixit Microsystem Technologies 26 (6), 2105-2116, 2020 | 30 | 2020 |
| Effect of tool electrode-workpiece gap in the microchannel formation by electrochemical discharge machining DK Mishra, K Pawar, P Dixit ECS Journal of Solid State Science and Technology 9 (3), 034011, 2020 | 27 | 2020 |
| Localized surface roughening to improve adhesion of electroless seed layer in through-glass vias K Pawar 1, H Pandey 1, P Dixit Materials Science in Semiconductor Processing 183, 108757, 2024 | 14 | 2024 |
| Facilitating electroless metalization of blind holes in glass substrates by electrochemical discharge-assisted surface roughening K Pawar, P Dixit Materials Letters 358, 135853, 2023 | 14 | 2023 |
| Fabrication of deep microfeatures in glass substrate using electrochemical discharge machining for biomedical and microfluidic applications DK Mishra, J Arab, K Pawar, P Dixit 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 263-266, 2019 | 13 | 2019 |
| Investigation of Cu-Sn-Cu transient liquid phase bonding for microsystems packaging K Pawar, P Dixit Materials and Manufacturing Processes 38 (3), 284-294, 2022 | 12 | 2022 |
| Continuous Electroless Seed Layer Deposition in Through-Glass-Vias by Ultrasonic Agitation K Pawar, H Pandey, P Dixit IEEE Transactions on Components, Packaging and Manufacturing Technology 14 …, 2024 | 10 | 2024 |
| Fabrication of through alumina vias (TAV) by ultrasonic micromachining for advanced packaging applications H Pandey, K Pawar, P Dixit Materials Science in Semiconductor Processing 185, 108923, 2024 | 4 | 2024 |
| Synergistic enhancement of electroless film adhesion on glass via graphene-oxide functionalization and surface roughening K Pawar, P Dixit Materials Letters 400, 139192, 2025 | 1 | 2025 |
| Through Glass Vias Fabrication using Ultrasonic Micromachining and Electroless Deposition K Pawar, H Pandey, P Dixit 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 1090-1093, 2023 | 1 | 2023 |
| Adhesion-Promoting Surface Modification with Zinc-Oxide and Graphene-Oxide for Direct Electroless Metallization in Through-Glass Vias K Pawar, P Dixit Surfaces and Interfaces 83, 108531, 2026 | | 2026 |
| Fabrication of Through Alumina Vias: An Alternative Approach Using Ultrasonic Machining and Electroless Deposition K Pawar, H Pandey, P Dixit 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC), 109-112, 2024 | | 2024 |
| Electrochemical Discharge-assisted Roughening to Improve the Adhesion of Electroless Nickel with Glass Substrate K Pawar, H Pandey, P Dixit International Conference on Precision, Meso, Micro and Nano Engineering …, 2022 | | 2022 |
| Adhesion improvement of the electroless film deposited on glass by the Ultrasonic micromachining process H Pandey, K Pawar, P Dixit 5th World Congress on Micro and Nano Manufacturing WCMNM 2022, Leuven, Belgium, 2022 | | 2022 |
| Geometrical characteristics and tool wear analysis during multipass microchannel formation in ECDM K Pawar, DK Mishra, J Arab, P Dixit International Conference on Precision, Meso, Micro and Nano Engineering …, 2019 | | 2019 |
Pradeep DixitIIT Bombay India, NTU Singapore, VTT FinlandVerified email at iitb.ac.in
