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Zhengtang LuoHong Kong University of Science and TechnologyVerified email at ust.hk
Zhenjing LiuMITVerified email at mit.edu
Hongwei LIUPhD candidate, HKUST, MITVerified email at mit.edu
Mohsen TamtajiScientist@HKQAI, PhD@HKUST, Editor: Materials Today CommunicationVerified email at connect.ust.hk
Md Delowar HossainKing Fahd University of Petroleum and MineralsVerified email at stanford.edu
Abhishek Tyagi, Ph.D.Hong Kong University of Science and TechnologyVerified email at connect.ust.hk
Minghao ZhuangHong Kong University of Science and TechnologyVerified email at ust.hkIrfan H. AbidiPhD Chemical and Biomolecular Engineering, Hong Kong University of Science and Technology, Hong KongVerified email at connect.ust.hk
Feng XU (徐峰)Xi'an Jiaotong University, ChinaVerified email at mail.xjtu.edu.cn
Dazhi "Peter" SunSouth University of Science and Technology of ChinaVerified email at sustc.edu.cn
Haomin ChenPostdoc, Korea University, jenchable@korea.ac.krVerified email at korea.ac.kr
Yao DingWuhan University of TechnologyVerified email at connect.ust.hk
Zhenqiang Shi (施振强)Dalian University of TechnologyVerified email at dlut.edu.cn
Ana Claudia AriasProfessor of Electrical Engineering and Computer Sciences, UC BerkeleyVerified email at eecs.berkeley.edu
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Cai Yuting
Hong Kong University of Science and Technology;University of California, Berkeley
Verified email at berkeley.edu