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Mark Ritter
Mark Ritter
IBM T.J. Watson Research Center
Verified email at us.ibm.com
Title
Cited by
Cited by
Year
Exploitation of optical interconnects in future server architectures
AF Benner, M Ignatowski, JA Kash, DM Kuchta, MB Ritter
IBM Journal of research and development 49 (4.5), 755-775, 2005
5402005
Three-dimensional architecture for self-checking and self-repairing integrated circuits
K Bernstein, PW Coteus, IAM Elfadel, PG Emma, KW Guarini, ...
US Patent App. 11/621,188, 2008
2152008
Specifications of nanoscale devices and circuits for neuromorphic computational systems
B Rajendran, Y Liu, J Seo, K Gopalakrishnan, L Chang, DJ Friedman, ...
IEEE Transactions on Electron Devices 60 (1), 246-253, 2012
2062012
Physics-based via and trace models for efficient link simulation on multilayer structures up to 40 GHz
R Rimolo-Donadio, X Gu, YH Kwark, MB Ritter, B Archambeault, ...
IEEE Transactions on Microwave Theory and Techniques 57 (8), 2072-2083, 2009
2052009
Electro-optical connectors
MF Bregman, WD Brewer, MS Cohen, GW Johnson, IC Noyan, ...
US Patent 5,093,879, 1992
1641992
Stepped electronic device package
PW Cotues, PA Moskowitz, P Murphy, MB Ritter, GF Walker
US Patent 5,239,447, 1993
1611993
120-Gb/s VCSEL-based parallel-optical interconnect and custom 120-Gb/s testing station
DM Kuchta, YH Kwark, C Schuster, C Baks, C Haymes, J Schaub, ...
Journal of lightwave technology 22 (9), 2200, 2004
1152004
Is 25 Gb/s on-board signaling viable?
DG Kam, MB Ritter, TJ Beukema, JF Bulzacchelli, PK Pepeljugoski, ...
IEEE Transactions on advanced packaging 32 (2), 328-344, 2009
1002009
ARQUIN: architectures for multinode superconducting quantum computers
J Ang, G Carini, Y Chen, I Chuang, M Demarco, S Economou, ...
ACM Transactions on Quantum Computing 5 (3), 1-59, 2024
862024
Multi-protocol agile framer
CL Haymes, MB Ritter, T Röwer
US Patent 6,654,383, 2003
842003
Developing a" physical" model for vias-Part II: Coupled and ground return vias
G Selli, C Schuster, YH Kwark, MB Ritter, JL Drewniak
Proceedings of DesignCon 2007 (2007, Santa Clara, CA) 2, 2007
752007
Integrated circuit testing system having a cantilevered contact lead probe pattern mounted on a flexible tape for interconnecting an integrated circuit to a tester
MF Bregman, PR Hoffman, PG Ledermann, PA Moskowitz, RA Pollak, ...
US Patent 5,189,363, 1993
531993
Method for extending bandwidth of large core fiber optic transmission links
MF Cina, DL Karst, MM Oprysko, MB Ritter, SL Spanoudis, JM Trewhella
US Patent 5,495,545, 1996
441996
System for address-event-representation network simulation
MM Denneau, DJ Friedman, R Linsker, MB Ritter
US Patent 8,429,107, 2013
422013
Collective behavior of supercooled liquids in porous media
MB Ritter, DD Awschalom, MW Shafer
Physical review letters 61 (8), 966, 1988
391988
Silicon-on-insulator (SOI) trench photodiode
YH Kwark, D Moy, MB Ritter, DL Rogers, JJ Welser
US Patent 6,538,299, 2003
372003
Wafer level I/O test, repair and/or customization enabled by I/O layer
K Bernstein, P Coteus, IM Elfadel, P Emma, D Friedman, R Puri, MB Ritter, ...
US Patent 7,913,202, 2011
362011
SiGe BiCMOS integrated circuits for high-speed serial communication links
DJ Friedman, M Meghelli, BD Parker, J Yang, HA Ainspan, AV Rylyakov, ...
IBM Journal of Research and Development 47 (2.3), 259-282, 2003
352003
Electromagnetic modeling of massively coupled through silicon vias for 3D interconnects
B Wu, X Gu, L Tsang, MB Ritter
Microwave and Optical Technology Letters 53 (6), 1204-1206, 2011
322011
Temperature-dependent studies of the electrical properties and the conduction mechanism of HfOx-based RRAM
C Ahn, S Kim, T Gokmen, O Dial, M Ritter, HSP Wong
Proceedings of Technical Program-2014 International Symposium on VLSI …, 2014
312014
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Articles 1–20