| A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface T Kamgaing, OM Ramahi IEEE Microwave and wireless components letters 13 (1), 21-23, 2003 | 287 | 2003 |
| Embedded millimeter-wave phased array module T Kamgaing, A Elsherbini, V Rao US Patent 9,773,742, 2017 | 136 | 2017 |
| Compact integration of LC resonators T Kamgaing US Patent 7,548,138, 2009 | 118 | 2009 |
| Design and modeling of high-impedance electromagnetic surfaces for switching noise suppression in power planes T Kamgaing, OM Ramahi IEEE Transactions on electromagnetic compatibility 47 (3), 479-489, 2005 | 113 | 2005 |
| Integration of switched capacitor networks for power delivery BS Oraw, T Kamgaing US Patent 8,582,333, 2013 | 111 | 2013 |
| Single-package phased array module with interleaved sub-arrays T Kamgaing, AA Elsherbini US Patent 9,413,079, 2016 | 98 | 2016 |
| Series and parallel hybrid switched capacitor networks for IC power delivery BS Oraw, T Kamgaing US Patent 8,330,436, 2012 | 98 | 2012 |
| Radio-and electromagnetic interference through-silicon vias for stacked-die packages, and methods of making same T Kamgaing, VR Rao US Patent 8,759,950, 2014 | 77 | 2014 |
| Multi-layer package with integrated antenna T Kamgaing, AA Elsherbini, TW Frank US Patent 10,128,177, 2018 | 65 | 2018 |
| Advanced Package Technologies for High-Performance Systems. D Mallik, K Radhakrishnan, T Kamgaing, D Searls, JD Jackson Intel Technology Journal 9 (4), 2005 | 65 | 2005 |
| Die package with superposer substrate for passive components T Kamgaing, VR Rao US Patent 10,615,133, 2020 | 61 | 2020 |
| Series and parallel hybrid switched capacitor networks for IC power delivery BS Oraw, T Kamgaing US Patent 9,318,952, 2016 | 47 | 2016 |
| Chip packages including through-silicon via dice with vertically inegrated phased-array antennas and low-frequency and power delivery substrates T Kamgaing, VR Rao, Y Palaskas US Patent 8,816,906, 2014 | 45 | 2014 |
| Drive and startup for a switched capacitor divider B Oraw, T Kamgaing US Patent 8,710,903, 2014 | 45 | 2014 |
| Multiband electromagnetic-bandgap structures for applications in small form-factor multichip module packages T Kamgaing, OM Ramahi IEEE transactions on microwave theory and techniques 56 (10), 2293-2300, 2008 | 45 | 2008 |
| Modeling of multilayered media using effective medium theory FG Hu, J Song, T Kamgaing 19th Topical Meeting on Electrical Performance of Electronic Packaging and …, 2010 | 44 | 2010 |
| High performance glass-based 60 ghz/mm-wave phased array antennas and methods of making same T Kamgaing US Patent 8,901,688, 2014 | 43 | 2014 |
| Modeling of frequency dependent losses in two-port and three-port inductors on silicon T Kamgaing, T Myers, M Petras, M Miller 2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No. 02CH37278 …, 2002 | 41 | 2002 |
| Platform with thermally stable wireless interconnects GC Dogiamis, SN OSTER, T Kamgaing, AA Elsherbini, BM Rawlings, ... US Patent 10,083,923, 2018 | 40 | 2018 |
| Front end system having an acoustic wave resonator (awr) on an interposer substrate T Kamgaing, VK Nair, F Eid, GC Dogiamis, JM Swan, S Leuschner US Patent App. 16/647,451, 2020 | 39 | 2020 |
Adel ElsherbiniIntel CorporationVerified email at intel.com
