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Shuang SONGHarbin Institutes of Technology, ShenzhenVerified email at hit.edu.cn
Jiankun WangSouthern University of Science and TechnologyVerified email at sustech.edu.cn
Hongliang RenChinese University of Hong Kong | National University of Singapore | JHU/Harvard(RF) | CUHK(PhD)Verified email at jhu.edu
Simon X. Yang, Ph.D., P.Eng., FCAEUniversity of GuelphVerified email at uoguelph.ca
Jiaole WangHITSZVerified email at hit.edu.cn
Chaoqun WangThe Chinese University of HongKongVerified email at ee.cuhk.edu.hk
Peter X. LiuCarleton UniversityVerified email at sce.carleton.caZhe MinShandong University/University College LondonVerified email at ucl.ac.uk
Yixuan YuanAssociate Professor in Chinese University of Hong KongVerified email at cuhk.edu.hk
Lisheng XUProfessor of Biomedical Engineering, Northeastern UniversityVerified email at bmie.neu.edu.cn
Yangxin XuThe Chinese University of Hong KongVerified email at link.cuhk.edu.hkXiao JiaStanford UniversityVerified email at stanford.edu
Zhu DelongHuawei TechnologiesVerified email at huawei.com
Keyu LiPhD, Dept. Electronic Engineering, The Chinese University of Hong KongVerified email at link.cuhk.edu.hk
Wenzheng ChiSoochow UniversityVerified email at suda.edu.cn
Chenming LIPh.D., The Chinese University of Hong KongVerified email at link.cuhk.edu.hk
Ming LiuROAS Thrust, Hong Kong University of Science and Technology (GZ)Verified email at hkust-gz.edu.cn
Ziqi ZhaoSouthern University of Science and TechnologyVerified email at mail.sustech.edu.cn
Yuxiang SunCity University of Hong KongVerified email at cityu.edu.hk
Jiyu Cheng(程吉禹)Associate Professor, Shandong UniversityVerified email at sdu.edu.cn