| Silicon Heterostructure Handbook: Materials, Fabrication, Devices, Circuits and Applications of SiGe and Si Strained-Layer Epitaxy JD Cressler, S Monfray, G Freeman, D Friedman, DJ Paul, S Tsujino, ... CRC press, 2018 | 314 | 2018 |
| The effective drive current in CMOS inverters MH Na, EJ Nowak, W Haensch, J Cai Digest. International Electron Devices Meeting,, 121-124, 2002 | 309 | 2002 |
| High-/Metal-Gate Fully Depleted SOI CMOS With Single-Silicide Schottky Source/Drain With Sub-30-nm Gate Length MH Khater, Z Zhang, J Cai, C Lavoie, C D'Emic, Q Yang, B Yang, ... IEEE Electron Device Letters 31 (4), 275-277, 2010 | 275 | 2010 |
| High performance 14nm SOI FinFET CMOS technology with 0.0174µm2 embedded DRAM and 15 levels of Cu metallization CH Lin, B Greene, S Narasimha, J Cai, A Bryant, C Radens, V Narayanan, ... 2014 IEEE International Electron Devices Meeting, 3.8. 1-3.8. 3, 2014 | 212 | 2014 |
| Method for fabricating super-steep retrograde well MOSFET on SOI or bulk silicon substrate, and device fabricated in accordance with the method J Cai, A Majumdar, TH Ning, Z Ren US Patent 8,329,564, 2012 | 164 | 2012 |
| A perspective on today’s scaling challenges and possible future directions RH Dennard, J Cai, A Kumar Solid-State Electronics 51 (4), 518-525, 2007 | 141* | 2007 |
| High performance low power bulk FET device and method of manufacture J Cai, T Furukawa, RR Robison US Patent 8,361,872, 2013 | 128 | 2013 |
| Gate tunneling currents in ultrathin oxide metal–oxide–silicon transistors J Cai, CT Sah Journal of Applied Physics 89 (4), 2272-2285, 2001 | 127 | 2001 |
| CMOS EPROM and EEPROM devices and programmable CMOS inverters J Cai, TH Ning, JM Safran US Patent 7,700,993, 2010 | 113 | 2010 |
| Low power circuit design based on heterojunction tunneling transistors (HETTs) D Kim, Y Lee, J Cai, I Lauer, L Chang, SJ Koester, D Sylvester, D Blaauw Proceedings of the 2009 ACM/IEEE international symposium on Low power …, 2009 | 105 | 2009 |
| Ultra-thin-body and BOX (UTBB) fully depleted (FD) device integration for 22nm node and beyond Q Liu, A Yagishita, N Loubet, A Khakifirooz, P Kulkarni, T Yamamoto, ... 2010 Symposium on VLSI Technology, 61-62, 2010 | 101 | 2010 |
| ETSOI CMOS with back gates J Cai, RH Dennard, A Khakifirooz US Patent 8,415,743, 2013 | 93 | 2013 |
| A 3-transistor DRAM cell with gated diode for enhanced speed and retention time W Luk, J Cai, R Dennard, M Immediato, S Kosonocky 2006 Symposium on VLSI Circuits, 2006. Digest of Technical Papers., 184-185, 2006 | 93 | 2006 |
| Embedded DRAM integrated circuits with extremely thin silicon-on-insulator pass transistors J Cai, J Chang, L Chang, BL Ji, SJ Koester, A Majumdar US Patent 7,985,633, 2011 | 88 | 2011 |
| Low-power circuit analysis and design based on heterojunction tunneling transistors (HETTs) Y Lee, D Kim, J Cai, I Lauer, L Chang, SJ Koester, D Blaauw, D Sylvester IEEE transactions on very large scale integration (VLSI) systems 21 (9 …, 2013 | 84 | 2013 |
| Impact of back bias on ultra-thin body and BOX (UTBB) devices Q Liu, F Monsieur, A Kumar, T Yamamoto, A Yagishita, P Kulkarni, ... 2011 Symposium on VLSI Technology-Digest of Technical Papers, 160-161, 2011 | 70 | 2011 |
| Vertical SiGe-base bipolar transistors on CMOS-compatible SOI substrate J Cai, H Chen, Q Ouyang, T Ning 2003 Proceedings of the Bipolar/BiCMOS Circuits and Technology Meeting (IEEE …, 2003 | 66 | 2003 |
| On the performance and scaling of symmetric lateral bipolar transistors on SOI TH Ning, J Cai IEEE Journal of the Electron Devices Society 1 (1), 21-27, 2013 | 64 | 2013 |
| Monitoring interface traps by DCIV method J Cai, CT Sah IEEE Electron Device Letters 20 (1), 60-63, 1999 | 58 | 1999 |
| Monolithic integrated photonics with lateral bipolar and BiCMOS J Cai, E Leobandung, N Li, TH Ning, JO Plouchart, DK Sadana US Patent 9,450,381, 2016 | 50 | 2016 |
