| Handbook of Silicon Based MEMS Materials and Technologies M Tilli, T Motooka, VM Airaksinen, S Franssila, M Paulasto-Kröckel, ... Handbook of Silicon Based MEMS Materials and Technologies (Second Edition …, 2015 | 850* | 2015 |
| Adhesive wafer bonding F Niklaus, G Stemme, JQ Lu, RJ Gutmann Journal of applied physics 99 (3), 2006 | 730 | 2006 |
| MEMS-based uncooled infrared bolometer arrays: a review F Niklaus, C Vieider, H Jakobsen MEMS/MOEMS technologies and applications III 6836, 125-139, 2008 | 492* | 2008 |
| Electromechanical piezoresistive sensing in suspended graphene membranes AD Smith, F Niklaus, A Paussa, S Vaziri, AC Fischer, M Sterner, ... Nano letters 13 (7), 3237-3242, 2013 | 491 | 2013 |
| Integrating MEMS and ICs AC Fischer, F Forsberg, M Lapisa, SJ Bleiker, Stemme, Göran, N Roxhed, ... Microsystems & Nanoengineering 1 (1), 15005, 2015 | 418 | 2015 |
| Resistive graphene humidity sensors with rapid and direct electrical readout AD Smith, K Elgammal, F Niklaus, A Delin, AC Fischer, S Vaziri, ... Nanoscale 7 (45), 19099-19109, 2015 | 389 | 2015 |
| Low-temperature full wafer adhesive bonding F Niklaus, P Enoksson, E Kälvesten, G Stemme Journal of Micromechanics and Microengineering 11 (2), 100, 2001 | 340 | 2001 |
| Method of joining components E Kälvesten, G Stemme, F Niklaus US Patent 7,067,345, 2006 | 275 | 2006 |
| Sealing of adhesive bonded devices on wafer level J Oberhammer, F Niklaus, G Stemme Sensors and Actuators A: Physical 110 (1-3), 407-412, 2004 | 245 | 2004 |
| Large-area integration of two-dimensional materials and their heterostructures by wafer bonding A Quellmalz, X Wang, S Sawallich, B Uzlu, M Otto, S Wagner, Z Wang, ... Nature communications 12 (1), 917, 2021 | 229 | 2021 |
| Wearable all-solid-state potentiometric microneedle patch for intradermal potassium detection M Parrilla, M Cuartero, S Padrell Sánchez, M Rajabi, N Roxhed, F Niklaus, ... Analytical chemistry 91 (2), 1578-1586, 2018 | 223 | 2018 |
| Handbook of wafer bonding P Ramm, JJQ Lu, MMV Taklo John Wiley & Sons, 2012 | 207 | 2012 |
| Nanoelectromechanical sensors based on suspended 2D materials MC Lemme, S Wagner, K Lee, X Fan, GJ Verbiest, S Wittmann, S Lukas, ... Research, 2020 | 187 | 2020 |
| Wafer-level heterogeneous integration for MOEMS, MEMS, and NEMS M Lapisa, G Stemme, F Niklaus IEEE Journal of Selected Topics in Quantum Electronics 17 (3), 629-644, 2011 | 174 | 2011 |
| Piezoresistive properties of suspended graphene membranes under uniaxial and biaxial strain in nanoelectromechanical pressure sensors AD Smith, F Niklaus, A Paussa, S Schröder, AC Fischer, M Sterner, ... ACS nano 10 (11), 9879-9886, 2016 | 172 | 2016 |
| Hydrophobic valves of plasma deposited octafluorocyclobutane in DRIE channels H Andersson, W van der Wijngaart, P Griss, F Niklaus, G Stemme Sensors and Actuators B: Chemical 75 (1-2), 136-141, 2001 | 167 | 2001 |
| Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities J Oberhammer, F Niklaus, G Stemme Sensors and Actuators A: Physical 105 (3), 297-304, 2003 | 148 | 2003 |
| Low temperature full wafer adhesive bonding of structured wafers F Niklaus, H Andersson, P Enoksson, G Stemme Sensors and Actuators A: Physical 92 (1-3), 235-241, 2001 | 140 | 2001 |
| Graphene ribbons with suspended masses as transducers in ultra-small nanoelectromechanical accelerometers X Fan, F Forsberg, AD Smith, S Schröder, S Wagner, H Rödjegård, ... Nature Electronics 2 (9), 394-404, 2019 | 137 | 2019 |
| Encyclopedia of sensors CA Grimes, EC Dickey, MV Pishko, RA Marcus (No Title), 2006 | 137 | 2006 |
Göran StemmeProfessor, Micro and Nanosystems, KTH Royal Institute of Technology, SwedenVerified email at ee.kth.se
