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WO2009001643A1 - Duplex head surface grinder - Google Patents

Duplex head surface grinder Download PDF

Info

Publication number
WO2009001643A1
WO2009001643A1 PCT/JP2008/059802 JP2008059802W WO2009001643A1 WO 2009001643 A1 WO2009001643 A1 WO 2009001643A1 JP 2008059802 W JP2008059802 W JP 2008059802W WO 2009001643 A1 WO2009001643 A1 WO 2009001643A1
Authority
WO
WIPO (PCT)
Prior art keywords
work
holding hole
rotation axis
rocking
axis
Prior art date
Application number
PCT/JP2008/059802
Other languages
French (fr)
Japanese (ja)
Inventor
Toshiharu Moridono
Original Assignee
Daisho Seiki Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daisho Seiki Corporation filed Critical Daisho Seiki Corporation
Priority to CN200880021784.9A priority Critical patent/CN103298586B/en
Publication of WO2009001643A1 publication Critical patent/WO2009001643A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Abstract

Intended is to improve a grinding precision in a double head grinder with a simple structure, thereby to prevent the offset wear of grinding wheels (2). Provided is a double head surface grinder, which comprises a pair of grinding wheels arranged to confront each other over a common stone rotation axis (01), and a carrier disk (11) fixed on a carrier disc rotation shaft (12) having a rotation axis (02) parallel to the stone rotation axis (01) and having a work holding hole (18) for holding a work (W). This work (W) is fed at a predetermined loading position (A1) on the transfer track of the work holding hole (18) to the work holding hole (18), and is inserted between the two grinding wheels (2) so that it is ground on its two faces. The work (W) is then discharged from the work holding hole (18). The carrier disc rotation shaft (12) is supported by a rocking arm (30), which can rock on a rocking axis (03) parallel to the carrier disc rotation axis (02), and is rocked on the rocking axis (O3) together with the carrier disk (11) by a rocking drive mechanism (31).
PCT/JP2008/059802 2007-06-25 2008-05-28 Duplex head surface grinder WO2009001643A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN200880021784.9A CN103298586B (en) 2007-06-25 2008-05-28 Double head surface grinder

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-165963 2007-06-25
JP2007165963A JP4818995B2 (en) 2007-06-25 2007-06-25 Double-head surface grinding machine

Publications (1)

Publication Number Publication Date
WO2009001643A1 true WO2009001643A1 (en) 2008-12-31

Family

ID=40185465

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059802 WO2009001643A1 (en) 2007-06-25 2008-05-28 Duplex head surface grinder

Country Status (4)

Country Link
JP (1) JP4818995B2 (en)
CN (1) CN103298586B (en)
TW (1) TWI428203B (en)
WO (1) WO2009001643A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102294652A (en) * 2011-09-20 2011-12-28 天津市天机液压机械有限公司 Trimming device and method for large-radius concave arc grinding wheel
US8838781B2 (en) 2010-07-15 2014-09-16 Cisco Technology, Inc. Continuous autonomous monitoring of systems along a path
US9787593B2 (en) 2010-07-07 2017-10-10 Cicsco Technology, Inc. Performing path-oriented systems management

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104128857A (en) * 2014-07-30 2014-11-05 苏州鸿大金属制品有限公司 Polisher for annular metal tubes
JP6285375B2 (en) * 2015-02-17 2018-02-28 光洋機械工業株式会社 Double-head surface grinding machine
JP6858539B2 (en) * 2016-12-08 2021-04-14 株式会社ディスコ Grinding device
KR102003399B1 (en) * 2019-03-04 2019-10-01 (주)오성지엠 Double side grinding apparatus capable of continuous processing
CN110253390A (en) * 2019-06-19 2019-09-20 浙江三纵精密机械有限公司 Vane Pump Blade Width Machining and Grinding Equipment
CN110977650B (en) * 2020-01-08 2024-12-20 洛阳聚享新科智能科技有限公司 A rocker arm device and control method for a vertical double-end surface grinding machine
CN112548719B (en) * 2020-12-15 2022-09-30 长春斯迈尔科技有限公司 Surface auxiliary treatment equipment for carbon fiber material processing

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5997831A (en) * 1982-11-25 1984-06-05 Nisshin Kogyo Kk Grinding method of double head surface grinder
JPH07186020A (en) * 1993-12-24 1995-07-25 Koyo Mach Ind Co Ltd Vertical shaft double head grinder
JP2000218532A (en) * 1999-02-03 2000-08-08 Toshiba Mach Co Ltd Surface polishing device
JP2002355750A (en) * 2001-05-31 2002-12-10 Ibiden Co Ltd Facing device and facing method
JP2002370161A (en) * 2001-06-18 2002-12-24 Mitsubishi Materials Corp Two-surface machining method for wafer and its device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63158754A (en) * 1986-12-19 1988-07-01 Mitsubishi Electric Corp Internal reforming fuel cell
JPH0643020B2 (en) * 1988-06-08 1994-06-08 光洋機械工業株式会社 Grinding method in double-sided surface grinder
MY121670A (en) * 1996-09-09 2006-02-28 Koyo Machine Ind Co Ltd Double side grinding apparatus for flat disklike work
JP3310924B2 (en) * 1998-02-26 2002-08-05 光洋機械工業株式会社 Double head surface grinding machine
JP3527213B2 (en) * 2001-04-11 2004-05-17 大昌精機株式会社 Vertical double-sided surface grinder
CN100537134C (en) * 2003-01-27 2009-09-09 英诺普雷股份有限公司 Equipment and method for grinding semiconductor wafer
CN2765718Y (en) * 2005-02-06 2006-03-22 董广胜 Double round platform jib-type surface-grinding machine

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5997831A (en) * 1982-11-25 1984-06-05 Nisshin Kogyo Kk Grinding method of double head surface grinder
JPH07186020A (en) * 1993-12-24 1995-07-25 Koyo Mach Ind Co Ltd Vertical shaft double head grinder
JP2000218532A (en) * 1999-02-03 2000-08-08 Toshiba Mach Co Ltd Surface polishing device
JP2002355750A (en) * 2001-05-31 2002-12-10 Ibiden Co Ltd Facing device and facing method
JP2002370161A (en) * 2001-06-18 2002-12-24 Mitsubishi Materials Corp Two-surface machining method for wafer and its device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9787593B2 (en) 2010-07-07 2017-10-10 Cicsco Technology, Inc. Performing path-oriented systems management
US8838781B2 (en) 2010-07-15 2014-09-16 Cisco Technology, Inc. Continuous autonomous monitoring of systems along a path
US9565082B2 (en) 2010-07-15 2017-02-07 Cisco Technology, Inc. Continuous autonomous monitoring of systems along a path
US10110451B2 (en) 2010-07-15 2018-10-23 Cisco Technology, Inc. Continuous autonomous monitoring of systems along a path
CN102294652A (en) * 2011-09-20 2011-12-28 天津市天机液压机械有限公司 Trimming device and method for large-radius concave arc grinding wheel

Also Published As

Publication number Publication date
CN103298586B (en) 2015-07-15
TW200911459A (en) 2009-03-16
TWI428203B (en) 2014-03-01
JP2009000794A (en) 2009-01-08
JP4818995B2 (en) 2011-11-16
CN103298586A (en) 2013-09-11

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