[go: up one dir, main page]

WO2008004531A3 - Cream solder and method of soldering electronic part - Google Patents

Cream solder and method of soldering electronic part Download PDF

Info

Publication number
WO2008004531A3
WO2008004531A3 PCT/JP2007/063267 JP2007063267W WO2008004531A3 WO 2008004531 A3 WO2008004531 A3 WO 2008004531A3 JP 2007063267 W JP2007063267 W JP 2007063267W WO 2008004531 A3 WO2008004531 A3 WO 2008004531A3
Authority
WO
WIPO (PCT)
Prior art keywords
alloy
cream solder
powdery
silver
eutectic composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/063267
Other languages
English (en)
French (fr)
Other versions
WO2008004531A2 (en
Inventor
Mitsuo Yamashita
Tomoaki Goto
Takeshi Asagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Nihon Handa Co Ltd
Original Assignee
Nihon Handa Co Ltd
Fuji Electric Holdings Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Handa Co Ltd, Fuji Electric Holdings Ltd filed Critical Nihon Handa Co Ltd
Priority to US12/307,370 priority Critical patent/US8968488B2/en
Priority to EP07790423A priority patent/EP2047943A4/en
Priority to KR1020097002305A priority patent/KR101160860B1/ko
Priority to JP2008523678A priority patent/JP5142999B2/ja
Priority to CN2007800255136A priority patent/CN101500744B/zh
Publication of WO2008004531A2 publication Critical patent/WO2008004531A2/ja
Publication of WO2008004531A3 publication Critical patent/WO2008004531A3/ja
Anticipated expiration legal-status Critical
Priority to US14/606,305 priority patent/US9301403B2/en
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0483—Alloys based on the low melting point metals Zn, Pb, Sn, Cd, In or Ga
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0133—Ternary Alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
PCT/JP2007/063267 2006-07-05 2007-07-03 Cream solder and method of soldering electronic part Ceased WO2008004531A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US12/307,370 US8968488B2 (en) 2006-07-05 2007-07-03 Cream solder and method of soldering electronic part
EP07790423A EP2047943A4 (en) 2006-07-05 2007-07-03 SOLDER PASTE AND METHOD FOR SOLDERING AN ELECTRONIC PART
KR1020097002305A KR101160860B1 (ko) 2006-07-05 2007-07-03 크림 땜납 및 전자 부품의 납땜 방법
JP2008523678A JP5142999B2 (ja) 2006-07-05 2007-07-03 クリームはんだ及び電子部品のはんだ付け方法
CN2007800255136A CN101500744B (zh) 2006-07-05 2007-07-03 膏状钎焊料和电子部件的软钎焊方法
US14/606,305 US9301403B2 (en) 2006-07-05 2015-01-27 Method of soldering electronic part

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2006185080 2006-07-05
JP2006-185080 2006-07-05
JP2006191707 2006-07-12
JP2006-191707 2006-07-12
JP2006276820 2006-10-10
JP2006-276819 2006-10-10
JP2006-276820 2006-10-10
JP2006276819 2006-10-10

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/307,370 A-371-Of-International US8968488B2 (en) 2006-07-05 2007-07-03 Cream solder and method of soldering electronic part
US14/606,305 Division US9301403B2 (en) 2006-07-05 2015-01-27 Method of soldering electronic part

Publications (2)

Publication Number Publication Date
WO2008004531A2 WO2008004531A2 (en) 2008-01-10
WO2008004531A3 true WO2008004531A3 (en) 2008-03-27

Family

ID=38895009

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/063267 Ceased WO2008004531A2 (en) 2006-07-05 2007-07-03 Cream solder and method of soldering electronic part

Country Status (6)

Country Link
US (2) US8968488B2 (ja)
EP (2) EP2047943A4 (ja)
JP (1) JP5142999B2 (ja)
KR (1) KR101160860B1 (ja)
CN (1) CN101500744B (ja)
WO (1) WO2008004531A2 (ja)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG161110A1 (en) * 2008-10-15 2010-05-27 Autium Pte Ltd Solder alloy
CN102196881B (zh) * 2008-10-24 2014-06-04 三菱电机株式会社 半导体装置
KR101132631B1 (ko) * 2009-10-27 2012-04-02 김문숙 악세서리 용 메탈 와이어 용접용 파우더 조성물
US9017446B2 (en) * 2010-05-03 2015-04-28 Indium Corporation Mixed alloy solder paste
HUE042634T2 (hu) * 2010-06-01 2019-07-29 Senju Metal Industry Co Maradék-mentes ólom-mentes forrasztópaszta
CN101972901B (zh) * 2010-10-25 2012-06-06 北京科技大学 一种钎焊铝碳化硅复合材料的中温钎料及制备和钎焊方法
CN102060556B (zh) * 2010-11-30 2012-11-21 哈尔滨工业大学 使用Ag-Cu共晶钎料钎焊Ti2AlC陶瓷和铜的方法
JP2012174332A (ja) * 2011-02-17 2012-09-10 Fujitsu Ltd 導電性接合材料、導体の接合方法、及び半導体装置の製造方法
US8673761B2 (en) 2011-02-19 2014-03-18 International Business Machines Corporation Reflow method for lead-free solder
JP5973992B2 (ja) * 2011-04-08 2016-08-23 株式会社日本スペリア社 はんだ合金
US9050651B2 (en) * 2011-06-14 2015-06-09 Ingot Metal Company Limited Method for producing lead-free copper—bismuth alloys and ingots useful for same
CN102306631B (zh) * 2011-07-20 2013-01-23 中国科学院上海微系统与信息技术研究所 一种基于电镀工艺改善Sn-Ag焊料性能的方法
IN2014DN07833A (ja) * 2012-03-20 2015-04-24 Alpha Metals
KR20130124516A (ko) * 2012-04-09 2013-11-14 센주긴조쿠고교 가부시키가이샤 땜납 합금
EP2874780B1 (en) 2012-07-18 2019-05-15 Lumileds Holding B.V. Method of soldering an electronic component with a high lateral accuracy
JP6136690B2 (ja) * 2012-08-01 2017-05-31 三菱マテリアル株式会社 ハンダペースト
US9402321B2 (en) * 2012-10-15 2016-07-26 Senju Metal Industry Co., Ltd. Soldering method using a low-temperature solder paste
CN105103279B (zh) * 2013-05-10 2018-03-23 富士电机株式会社 半导体装置及半导体装置的制造方法
US9607964B2 (en) * 2014-03-28 2017-03-28 Intel Corporation Method and materials for warpage thermal and interconnect solutions
ES2710219T3 (es) 2014-06-24 2019-04-23 Harima Chemicals Inc Aleación de soldadura, pasta de soldadura y placa de circuitos electrónicos
JP6648468B2 (ja) * 2014-10-29 2020-02-14 Tdk株式会社 Ｐｂフリーはんだ及び電子部品内蔵モジュール
US9731384B2 (en) 2014-11-18 2017-08-15 Baker Hughes Incorporated Methods and compositions for brazing
CN104526190A (zh) * 2014-12-23 2015-04-22 苏州龙腾万里化工科技有限公司 一种新型锡条的制作方法
FR3033272B1 (fr) * 2015-03-04 2017-03-24 Labinal Power Systems Procede de brasage pour assembler deux elements via un compose intermetallique
DE102015205193A1 (de) 2015-03-23 2016-09-29 Würth Elektronik eiSos Gmbh & Co. KG Vorrichtung zum Absorbieren des elektrischen Rauschens
TWI764632B (zh) * 2015-05-05 2022-05-11 美商銦業公司 用於嚴苛環境之電子應用的高可靠度無鉛焊料合金
MY205097A (en) 2015-05-05 2024-10-01 Indium Corp High reliability lead-free solder alloys for harsh environment electronics applications
JP6745453B2 (ja) * 2016-05-18 2020-08-26 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた実装構造体
JP6924432B2 (ja) * 2017-01-04 2021-08-25 富士電機株式会社 半導体装置の製造方法及び半導体装置
KR102286739B1 (ko) * 2017-08-17 2021-08-05 현대자동차 주식회사 무연 솔더 조성물
EP3708290B1 (en) 2018-04-13 2021-11-03 Senju Metal Industry Co., Ltd Solder paste
CN110961831B (zh) 2018-09-28 2022-08-19 株式会社田村制作所 成形软钎料及成形软钎料的制造方法
DE112019005431T5 (de) * 2018-10-31 2021-07-15 Robert Bosch Gmbh Mischlegierungslotpaste, verfahren zur herstellung derselben und lötverfahren
US11267080B2 (en) * 2019-05-09 2022-03-08 Indium Corporation Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders
MY208234A (en) * 2020-04-29 2025-04-25 Indium Corp Lead-free solder paste with mixed solder powders for high temperature applications
RU2769023C1 (ru) * 2021-05-26 2022-03-28 Общество с ограниченной ответственностью Научно-производственный центр "Углеродные волокна и композиты" (ООО "НПЦ "УВИКОМ") Сетчатое полотно для молниезащитного покрытия полимерного композита
KR20240019350A (ko) * 2021-06-11 2024-02-14 인듐 코포레이션 혼합 땜납 합금 분말을 갖는 고 신뢰성 무연 땜납 페이스트
CN113798722B (zh) * 2021-09-30 2022-09-27 大连理工大学 一种复合焊膏及应用其制备组织为细晶β-Sn晶粒的BGA焊锡球/焊点的方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01266987A (ja) * 1988-04-19 1989-10-24 Senju Metal Ind Co Ltd クリームはんだおよびクリームはんだのはんだ付け方法
JPH01271094A (ja) * 1988-04-20 1989-10-30 Aiwa Co Ltd ペースト状ハンダ
JPH11186712A (ja) * 1997-12-24 1999-07-09 Nissan Motor Co Ltd はんだペーストおよび接続方法
JP2002254195A (ja) * 2000-12-25 2002-09-10 Tdk Corp はんだ付け用組成物及びはんだ付け方法
JP2003260587A (ja) * 2002-03-08 2003-09-16 Hitachi Ltd はんだ
WO2005084877A1 (ja) * 2004-03-09 2005-09-15 Senju Metal Industry Co. Ltd. ソルダペースト
JP2007268569A (ja) * 2006-03-31 2007-10-18 Fuji Electric Holdings Co Ltd 粉末はんだ材料および接合材料

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01177366A (ja) 1988-01-08 1989-07-13 Ricoh Co Ltd 薄膜形成装置
US6231691B1 (en) 1997-02-10 2001-05-15 Iowa State University Research Foundation, Inc. Lead-free solder
JP2943064B2 (ja) 1997-03-26 1999-08-30 セイコー精機株式会社 気体圧縮機の取付け構造
JP3296289B2 (ja) 1997-07-16 2002-06-24 富士電機株式会社 はんだ合金
JPH11138292A (ja) * 1997-11-10 1999-05-25 Showa Denko Kk 無鉛ソルダペースト
JP2001266987A (ja) 2000-03-24 2001-09-28 Fujikura Ltd オス型端子並びにこれを用いたコネクタ及び電気接続構造
TWI248384B (en) 2000-06-12 2006-02-01 Hitachi Ltd Electronic device
JP3654161B2 (ja) 2000-08-17 2005-06-02 千住金属工業株式会社 ソルダペーストとはんだ付け方法
JP4051893B2 (ja) 2001-04-18 2008-02-27 株式会社日立製作所 電子機器
JP2004130371A (ja) 2002-10-11 2004-04-30 Ebara Corp 接合体
JP3558083B2 (ja) 2003-06-27 2004-08-25 ソニー株式会社 バッテリーパック
US20050100474A1 (en) * 2003-11-06 2005-05-12 Benlih Huang Anti-tombstoning lead free alloys for surface mount reflow soldering
WO2006075459A1 (ja) * 2005-01-11 2006-07-20 Murata Manufacturing Co., Ltd はんだペースト、及び電子装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01266987A (ja) * 1988-04-19 1989-10-24 Senju Metal Ind Co Ltd クリームはんだおよびクリームはんだのはんだ付け方法
JPH01271094A (ja) * 1988-04-20 1989-10-30 Aiwa Co Ltd ペースト状ハンダ
JPH11186712A (ja) * 1997-12-24 1999-07-09 Nissan Motor Co Ltd はんだペーストおよび接続方法
JP2002254195A (ja) * 2000-12-25 2002-09-10 Tdk Corp はんだ付け用組成物及びはんだ付け方法
JP2003260587A (ja) * 2002-03-08 2003-09-16 Hitachi Ltd はんだ
WO2005084877A1 (ja) * 2004-03-09 2005-09-15 Senju Metal Industry Co. Ltd. ソルダペースト
JP2007268569A (ja) * 2006-03-31 2007-10-18 Fuji Electric Holdings Co Ltd 粉末はんだ材料および接合材料

Also Published As

Publication number Publication date
JP5142999B2 (ja) 2013-02-13
US20120018048A1 (en) 2012-01-26
WO2008004531A2 (en) 2008-01-10
CN101500744A (zh) 2009-08-05
CN101500744B (zh) 2011-11-30
EP2647467A3 (en) 2014-04-02
KR101160860B1 (ko) 2012-07-02
KR20090038887A (ko) 2009-04-21
JPWO2008004531A1 (ja) 2009-12-03
EP2647467A2 (en) 2013-10-09
US8968488B2 (en) 2015-03-03
EP2047943A2 (en) 2009-04-15
US20150208516A1 (en) 2015-07-23
EP2047943A4 (en) 2012-12-19
US9301403B2 (en) 2016-03-29

Similar Documents

Publication Publication Date Title
WO2008004531A3 (en) Cream solder and method of soldering electronic part
WO2005118213A3 (en) Solder paste and process
MY207771A (en) Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders
JP2013525121A5 (ja)
AU2015254179A1 (en) Lead-free solder alloy
TW200503872A (en) Solder paste
JP2012183558A (ja) 鉛フリーはんだ合金及びそれを用いたはんだ継手
JP2011156558A (ja) 鉛フリーはんだ合金
EP1724050A4 (en) BRASER PASTE
TWI469845B (zh) High temperature lead free solder alloy
JP5849421B2 (ja) 半田及び半田を用いた半導体装置並びに半田付け方法
JP2005512813A5 (ja)
KR102856123B1 (ko) 고온 응용 분야를 위한 혼합 땜납 분말을 함유한 무연 땜납 페이스트
TW200403124A (en) Tin-zinc system lead-free solder alloy, its mixture, and solder junction portion
JP2007160340A (ja) ロウ材
CN102848100A (zh) 含Nd、Ga的低银Sn-Ag-Cu无铅钎料
JP2004358539A (ja) 高温ろう材
JP2013035016A (ja) 鉛フリーはんだ及びそのはんだを用いたクリームはんだ
CN100491054C (zh) 无铅软钎焊料
CN109794703A (zh) Au-Ga钎料
JP4732900B2 (ja) クリームはんだ、及びそれを使用したはんだ付け方法
CN106181109B (zh) 一种高性能绿色钎焊材料
WO2015053114A1 (ja) 低融点ろう材
JP5051633B2 (ja) はんだ合金
CN102848099A (zh) 含Pr、Ga、Se的低银Sn-Ag-Cu无铅钎料

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200780025513.6

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07790423

Country of ref document: EP

Kind code of ref document: A2

WWE Wipo information: entry into national phase

Ref document number: 2008523678

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2007790423

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 1020097002305

Country of ref document: KR

NENP Non-entry into the national phase

Ref country code: RU

WWE Wipo information: entry into national phase

Ref document number: 12307370

Country of ref document: US