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WO2004110698A3 - Methods and systems for processing microfeature workpieces with flow agitators and/or multiple electrodes - Google Patents

Methods and systems for processing microfeature workpieces with flow agitators and/or multiple electrodes Download PDF

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Publication number
WO2004110698A3
WO2004110698A3 PCT/US2004/017670 US2004017670W WO2004110698A3 WO 2004110698 A3 WO2004110698 A3 WO 2004110698A3 US 2004017670 W US2004017670 W US 2004017670W WO 2004110698 A3 WO2004110698 A3 WO 2004110698A3
Authority
WO
WIPO (PCT)
Prior art keywords
reactor
workpiece
agitator
systems
methods
Prior art date
Application number
PCT/US2004/017670
Other languages
French (fr)
Other versions
WO2004110698A2 (en
Inventor
Paul R Mchugh
Gregory J Wilson
Daniel J Woodruff
Nolan Zimmerman
James J Erickson
Original Assignee
Semitool Inc
Paul R Mchugh
Gregory J Wilson
Daniel J Woodruff
Nolan Zimmerman
James J Erickson
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/733,807 external-priority patent/US7393439B2/en
Priority claimed from US10/734,098 external-priority patent/US7390383B2/en
Application filed by Semitool Inc, Paul R Mchugh, Gregory J Wilson, Daniel J Woodruff, Nolan Zimmerman, James J Erickson filed Critical Semitool Inc
Priority to EP04754300A priority Critical patent/EP1638732A4/en
Priority to JP2006515180A priority patent/JP2007527948A/en
Publication of WO2004110698A2 publication Critical patent/WO2004110698A2/en
Publication of WO2004110698A3 publication Critical patent/WO2004110698A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Weting (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Tools having mounting modules with registration systems are disclosed. The mounting includes positioning elements for precisely locating a reactor and a workpiece transport that moves workpieces to and for the reactor. The relative positions between positioning elements of the reactor are fixed so that the workpiece transport does not need to be recalibrated when the reactor is removed and replaced with another reactor. The reactor includes an agitator for agitating processing fluid at a process surface of the workpiece. The agitator, the reactor, and electrodes within the reactor are configured to reduce the likelihood for electrical shadowing created by the agitator at the surface of the workpiece, and to account for three-dimensional effects on the electrical field as the agitator and/or the workpiece reciprocate relative to each other.
PCT/US2004/017670 2003-06-06 2004-06-03 Methods and systems for processing microfeature workpieces with flow agitators and/or multiple electrodes WO2004110698A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP04754300A EP1638732A4 (en) 2003-06-06 2004-06-03 Methods and systems for processing microfeature workpieces with flow agitators and/or multiple electrodes
JP2006515180A JP2007527948A (en) 2003-06-06 2004-06-04 Method and system for processing microfeature workpieces using a flow stirrer and / or multiple electrodes

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
US47678603P 2003-06-06 2003-06-06
US60/476,786 2003-06-06
US48460403P 2003-07-01 2003-07-01
US48460303P 2003-07-01 2003-07-01
US60/484,603 2003-07-01
US60/484,604 2003-07-01
US10/734,098 2003-12-11
US10/733,807 US7393439B2 (en) 2003-06-06 2003-12-11 Integrated microfeature workpiece processing tools with registration systems for paddle reactors
US10/734,098 US7390383B2 (en) 2003-07-01 2003-12-11 Paddles and enclosures for enhancing mass transfer during processing of microfeature workpieces
US10/733,807 2003-12-11
US10/734,100 2003-12-11
US10/734,100 US7390382B2 (en) 2003-07-01 2003-12-11 Reactors having multiple electrodes and/or enclosed reciprocating paddles, and associated methods

Publications (2)

Publication Number Publication Date
WO2004110698A2 WO2004110698A2 (en) 2004-12-23
WO2004110698A3 true WO2004110698A3 (en) 2006-08-24

Family

ID=33556803

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/017670 WO2004110698A2 (en) 2003-06-06 2004-06-03 Methods and systems for processing microfeature workpieces with flow agitators and/or multiple electrodes

Country Status (4)

Country Link
EP (1) EP1638732A4 (en)
JP (1) JP2007527948A (en)
KR (1) KR20060024792A (en)
WO (1) WO2004110698A2 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6747734B1 (en) 2000-07-08 2004-06-08 Semitool, Inc. Apparatus and method for processing a microelectronic workpiece using metrology
US20050035046A1 (en) 2003-06-06 2005-02-17 Hanson Kyle M. Wet chemical processing chambers for processing microfeature workpieces
US7393439B2 (en) 2003-06-06 2008-07-01 Semitool, Inc. Integrated microfeature workpiece processing tools with registration systems for paddle reactors
US7390383B2 (en) 2003-07-01 2008-06-24 Semitool, Inc. Paddles and enclosures for enhancing mass transfer during processing of microfeature workpieces
WO2007062114A2 (en) * 2005-11-23 2007-05-31 Semitool, Inc. Apparatus and method for agitating liquids in wet chemical processing of microfeature workpieces
US7842173B2 (en) 2007-01-29 2010-11-30 Semitool, Inc. Apparatus and methods for electrochemical processing of microfeature wafers
JP5038024B2 (en) * 2007-06-06 2012-10-03 上村工業株式会社 Work surface treatment system
US8177944B2 (en) 2007-12-04 2012-05-15 Ebara Corporation Plating apparatus and plating method
JP5184308B2 (en) * 2007-12-04 2013-04-17 株式会社荏原製作所 Plating apparatus and plating method
FR2966282B1 (en) * 2010-10-18 2013-02-15 Nexcis CONTROL OF LAYER I-III-VI STOICHIOMETRY FOR PHOTOVOLTAIC APPLICATIONS FROM IMPROVED ELECTROLYSIS CONDITIONS.
JP6100049B2 (en) * 2013-03-25 2017-03-22 株式会社荏原製作所 Plating equipment
KR102194716B1 (en) * 2014-03-06 2020-12-23 삼성전기주식회사 Plating apparatus
JP6411943B2 (en) * 2014-05-26 2018-10-24 株式会社荏原製作所 Substrate electrolytic treatment apparatus and paddle used for the substrate electrolytic treatment apparatus
US10227706B2 (en) * 2015-07-22 2019-03-12 Applied Materials, Inc. Electroplating apparatus with electrolyte agitation
US10240248B2 (en) * 2015-08-18 2019-03-26 Applied Materials, Inc. Adaptive electric field shielding in an electroplating processor using agitator geometry and motion control
JP6890528B2 (en) * 2017-12-15 2021-06-18 株式会社荏原製作所 Plating device with wave-dissipating member and wave-dissipating member that can be attached to the paddle
JP6790016B2 (en) * 2018-04-10 2020-11-25 上村工業株式会社 Surface treatment equipment, surface treatment method and paddle
TWI671435B (en) * 2018-06-08 2019-09-11 台灣創智成功科技有限公司 Plating device
GB201905138D0 (en) * 2019-04-11 2019-05-29 Spts Technologies Ltd Apparatus and method for processing a substrate
CN118829749B (en) * 2022-12-20 2025-05-02 株式会社荏原制作所 Plating device and operation method of plating device
TWI872422B (en) * 2022-12-23 2025-02-11 日商荏原製作所股份有限公司 Coating device and operating method of coating device

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3652442A (en) * 1967-12-26 1972-03-28 Ibm Electroplating cell including means to agitate the electrolyte in laminar flow
US4749601A (en) * 1985-04-25 1988-06-07 Hillinger Brad O Composite structure
US5516412A (en) * 1995-05-16 1996-05-14 International Business Machines Corporation Vertical paddle plating cell
US6136163A (en) * 1999-03-05 2000-10-24 Applied Materials, Inc. Apparatus for electro-chemical deposition with thermal anneal chamber
US6214193B1 (en) * 1998-06-10 2001-04-10 Novellus Systems, Inc. Electroplating process including pre-wetting and rinsing
US6231743B1 (en) * 2000-01-03 2001-05-15 Motorola, Inc. Method for forming a semiconductor device
US20010032788A1 (en) * 1999-04-13 2001-10-25 Woodruff Daniel J. Adaptable electrochemical processing chamber
US6454918B1 (en) * 1999-03-23 2002-09-24 Electroplating Engineers Of Japan Limited Cup type plating apparatus

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6379511B1 (en) * 1999-09-23 2002-04-30 International Business Machines Corporation Paddle design for plating bath

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3652442A (en) * 1967-12-26 1972-03-28 Ibm Electroplating cell including means to agitate the electrolyte in laminar flow
US4749601A (en) * 1985-04-25 1988-06-07 Hillinger Brad O Composite structure
US5516412A (en) * 1995-05-16 1996-05-14 International Business Machines Corporation Vertical paddle plating cell
US6214193B1 (en) * 1998-06-10 2001-04-10 Novellus Systems, Inc. Electroplating process including pre-wetting and rinsing
US6136163A (en) * 1999-03-05 2000-10-24 Applied Materials, Inc. Apparatus for electro-chemical deposition with thermal anneal chamber
US6454918B1 (en) * 1999-03-23 2002-09-24 Electroplating Engineers Of Japan Limited Cup type plating apparatus
US20010032788A1 (en) * 1999-04-13 2001-10-25 Woodruff Daniel J. Adaptable electrochemical processing chamber
US6231743B1 (en) * 2000-01-03 2001-05-15 Motorola, Inc. Method for forming a semiconductor device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
TACKEN R. A. ET AL.: "Applications of Magnetoelectrolysis", JOURNAL OF APPLIED ELECTROCHEMISTRY, vol. 25, 1995, pages 1 - 5, XP008082905 *

Also Published As

Publication number Publication date
JP2007527948A (en) 2007-10-04
EP1638732A2 (en) 2006-03-29
EP1638732A4 (en) 2007-06-06
WO2004110698A2 (en) 2004-12-23
KR20060024792A (en) 2006-03-17

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