WO2003030609A1 - Electric apparatus comprising shield structure - Google Patents
Electric apparatus comprising shield structure Download PDFInfo
- Publication number
- WO2003030609A1 WO2003030609A1 PCT/JP2002/009485 JP0209485W WO03030609A1 WO 2003030609 A1 WO2003030609 A1 WO 2003030609A1 JP 0209485 W JP0209485 W JP 0209485W WO 03030609 A1 WO03030609 A1 WO 03030609A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- printed board
- electric apparatus
- shield member
- section
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
- H05K9/0035—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids with retainers mounted beforehand on the PCB, e.g. clips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0015—Gaskets or seals
- H05K9/0016—Gaskets or seals having a spring contact
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
An electric apparatus a shield structure which facilitates the automation of the mounting of a shield member on a printed board without reducing the component mounting range of a printed board back, prevents the shield member from coming off by a drop, and facilitates maintenance. A shield member 101 of this electric apparatus has a top face 102, which covers the circuit section on a printed board 109, and an outer periphery 103 including the circuit section. A clamping member 104 has a plane section 105 and a clamping section 106, which is formed at both ends of one face of the plane section 105 and elastically clamps both faces of the outer periphery 103. A face opposite the one face of the plane section 105 is connected by soldering on the printed board 109, so that the shield member 101 is mounted on the printed board 109.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001-302578 | 2001-09-28 | ||
| JP2001302578A JP2003110274A (en) | 2001-09-28 | 2001-09-28 | Electronic equipment with shield structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2003030609A1 true WO2003030609A1 (en) | 2003-04-10 |
Family
ID=19122797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2002/009485 Ceased WO2003030609A1 (en) | 2001-09-28 | 2002-09-17 | Electric apparatus comprising shield structure |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2003110274A (en) |
| WO (1) | WO2003030609A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7501587B2 (en) | 2007-04-16 | 2009-03-10 | Laird Technologies, Inc. | Mounting clips for use with electromagnetic interference shielding and methods of using the same |
| GB2464328A (en) * | 2008-10-13 | 2010-04-14 | Askey Computer Corp | Attaching method of an isolation cover that reduces heat dissipation during manufacture |
| US8337219B2 (en) | 2011-02-19 | 2012-12-25 | Laird Technologies, Inc. | Card guide grounding strips |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007034754A1 (en) * | 2005-09-20 | 2007-03-29 | Murata Manufacturing Co., Ltd. | Shield structure |
| WO2007138808A1 (en) * | 2006-05-30 | 2007-12-06 | Murata Manufacturing Co., Ltd. | Shield structure |
| JP4827135B2 (en) * | 2006-11-10 | 2011-11-30 | 北川工業株式会社 | Surface mount clip |
| JP5170583B2 (en) * | 2010-05-26 | 2013-03-27 | シャープ株式会社 | Shield cover and base unit having the shield cover |
| KR101169955B1 (en) * | 2010-10-06 | 2012-09-19 | (주)케이티엑스 | A clip for fixing of shield can protecting emi |
| KR101029221B1 (en) | 2011-01-14 | 2011-04-14 | 에프엔티주식회사 | Shield can fixing clip for electromagnetic shielding with partial plating layer |
| KR101052559B1 (en) * | 2011-02-25 | 2011-07-29 | 김선기 | Shield case for electromagnetic shielding and protection |
| JP2013211294A (en) * | 2012-03-30 | 2013-10-10 | Auto Splice Kk | Shield case assembly |
| JP6160910B2 (en) * | 2013-07-10 | 2017-07-12 | 北川工業株式会社 | Electromagnetic shielding structure |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5814600A (en) * | 1981-07-17 | 1983-01-27 | 富士通テン株式会社 | Device for mounting shielding plate for electronic equipment |
| US5792994A (en) * | 1995-08-09 | 1998-08-11 | Mitsubishi Denki Kabushiki Kaisha | Device for mounting a component |
| JPH10294585A (en) * | 1997-04-22 | 1998-11-04 | Kokusai Electric Co Ltd | Shield case for printed circuit board |
| JPH1126978A (en) * | 1997-07-03 | 1999-01-29 | Ace Five:Kk | Electromagnetic shield connecting device and connecting terminal |
| WO2000025563A1 (en) * | 1998-10-28 | 2000-05-04 | Qualcomm Incorporated | A shield clip and method of securing a shield cover |
-
2001
- 2001-09-28 JP JP2001302578A patent/JP2003110274A/en active Pending
-
2002
- 2002-09-17 WO PCT/JP2002/009485 patent/WO2003030609A1/en not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5814600A (en) * | 1981-07-17 | 1983-01-27 | 富士通テン株式会社 | Device for mounting shielding plate for electronic equipment |
| US5792994A (en) * | 1995-08-09 | 1998-08-11 | Mitsubishi Denki Kabushiki Kaisha | Device for mounting a component |
| JPH10294585A (en) * | 1997-04-22 | 1998-11-04 | Kokusai Electric Co Ltd | Shield case for printed circuit board |
| JPH1126978A (en) * | 1997-07-03 | 1999-01-29 | Ace Five:Kk | Electromagnetic shield connecting device and connecting terminal |
| WO2000025563A1 (en) * | 1998-10-28 | 2000-05-04 | Qualcomm Incorporated | A shield clip and method of securing a shield cover |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7501587B2 (en) | 2007-04-16 | 2009-03-10 | Laird Technologies, Inc. | Mounting clips for use with electromagnetic interference shielding and methods of using the same |
| GB2464328A (en) * | 2008-10-13 | 2010-04-14 | Askey Computer Corp | Attaching method of an isolation cover that reduces heat dissipation during manufacture |
| GB2464328B (en) * | 2008-10-13 | 2011-01-26 | Askey Computer Corp | Circuit board of communication product and manufacturing method thereof |
| US8337219B2 (en) | 2011-02-19 | 2012-12-25 | Laird Technologies, Inc. | Card guide grounding strips |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2003110274A (en) | 2003-04-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AK | Designated states |
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| AL | Designated countries for regional patents |
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| 121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
| 122 | Ep: pct application non-entry in european phase |