[go: up one dir, main page]

US20070137775A1 - Adhesive film comprising at least two layers - Google Patents

Adhesive film comprising at least two layers Download PDF

Info

Publication number
US20070137775A1
US20070137775A1 US10/569,353 US56935304A US2007137775A1 US 20070137775 A1 US20070137775 A1 US 20070137775A1 US 56935304 A US56935304 A US 56935304A US 2007137775 A1 US2007137775 A1 US 2007137775A1
Authority
US
United States
Prior art keywords
adhesive film
adhesive
layer
resins
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/569,353
Other languages
English (en)
Inventor
Renke Bargmann
Marc Husemann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tesa SE
Original Assignee
Tesa SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34258221&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=US20070137775(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Tesa SE filed Critical Tesa SE
Assigned to TESA AG reassignment TESA AG CORRECTIVE ASSIGNMENT TO CORRECT THE THE ASSIGNMENT RECORDED ON 1//23/07 INCORRECTLY RECORDED TO SERIAL NO. 11/569353 AND SHOULD HAVE BEEN RECORDED TO 10/569353 PREVIOUSLY RECORDED ON REEL 018794 FRAME 0950. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT TO TESA AG FROM INVENTORS RENKE BARGMANN AND MARC HUSEMANN. Assignors: BARGMANN, RENKE, HUSEMANN, MARC
Publication of US20070137775A1 publication Critical patent/US20070137775A1/en
Assigned to TESA SE reassignment TESA SE CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: TESA AG
Abandoned legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C09J2301/1242—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape the opposite adhesive layers being different
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2421/00—Presence of unspecified rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2477/00—Presence of polyamide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2998—Coated including synthetic resin or polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31573—Next to addition polymer of ethylenically unsaturated monomer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31938—Polymer of monoethylenically unsaturated hydrocarbon

Definitions

  • the invention relates to an at least two-layer adhesive film, to its use for bonding electrical modules (chips) in card bodies, and to a process for producing adhesive films of this kind.
  • the bar is continually being raised as regards the requirements imposed on the adhesive system.
  • the adhesive is required to adhere well to polycarbonate, to ABS, PVC, and PET, and also to the electrical module. Bonding here is generally to epoxy materials or polyimide.
  • cyanoacrylates were used as liquid adhesives, and have the advantage of optimum wetting of both the card body and the electrical chip. This technology, however, is dying out, since the operations were very slow. The evaporation of the solvent from the cavity in the card body was slow; the metering nozzles became blocked during downtime, as a result of drying out, and were also of poor meterability; and the liquid adhesive likewise required a certain time for curing. As a result, the quality of the adhesive bond was decidedly poor.
  • planarity of the electrical module with the card body is an important criterion, since otherwise the cards could no longer be read. This imposes an upper limit on the implantation temperatures, since otherwise deformations occur.
  • a further criterion is the requirement from the banking sector that the electrical modules should not be removable without destruction. Consequently the internal cohesion of the adhesive must be very high, so that it does not split in the middle and so that the adhesion to either side (card body and electrical module) is extremely high. At the same time the adhesive is also required to exhibit very high flexibility, since following implantation the cards go through torsion tests and flexural testing. The card material ought preferably to rupture first, before the failure of the adhesion to the card body and to the electrical module. In general not even edge lifting is tolerated.
  • a further criterion are temperature fluctuations and the effect of moisture, since in their subsequent use these cards are required to withstand both high and low temperatures and in some cases must even survive a passage through the wash. Consequently the adhesive should not become brittle at low temperatures, should not liquefy at high temperatures, and should possess a low tendency to absorb water.
  • a further requirement criterion is the processing speed, as a result of the growing number of cards needed.
  • the adhesive ought to soften or melt very quickly, in order that the implanting operation can be concluded within a second.
  • the invention is based on the object of providing an improved adhesive film for implanting electrical modules into a card body that meets the criteria set out above and which in particular exhibits a very high level of adhesion to the different card bodies and electrical modules.
  • this object is achieved by means of a two-layer adhesive film.
  • This adhesive film is furnished with at least two adhesive layers (i) and (ii) which differ chemically from one another.
  • one layer (i) exhibits high suitability for bonding with epoxy materials and/or polyimides and the other layer (ii) exhibits high suitability for bonding with polycarbonate, polyethylene, polypropylene, acrylonitrile-butadiene-styrene copolymers, polyethylene terephthalate and/or polyvinyl chloride.
  • layer (i) is based on thermoplastic polymers, in particular based on polyesters, polyamides, copolyesters and/or copolyamides
  • layer (ii) is based on polyurethanes, rubbers, especially synthetic rubbers, and/or on heat-activatable systems, particularly those composed of an elastomer and at least one reactive resin, in which context, in particular, rubbers, polychloroisoprenes, polyacrylates, nitrile rubbers and/or epoxidized nitrile rubbers are used as elastomer and/or phenolic resins, epoxy resins, melamine resins and/or resins with isocyanate function, alone or in combination with one another, are used as reactive resins.
  • One very preferred embodiment of the invention unites the properties of the first and second embodiments described above.
  • one layer in particular layer (ii)
  • the other layer in particular layer (i)
  • FIG. 1 is a schematic of one embodiment of the adhesive film of the invention.
  • FIG. 2 is a schematic of another embodiment of the adhesive film of the invention.
  • FIG. 1 shows: 1 an electrical module (chip) 2 the card body 3 adhesive layer (i) 4 adhesive layer (ii).
  • Adhesive layers (i) and (ii) may have the same or different thicknesses.
  • the adhesive assembly as a whole in one preferred embodiment possesses a layer thickness of between 10 and 125 ⁇ m.
  • adhesive layer (i) exhibits between 5 and 90 ⁇ m, adhesive layer (ii) likewise between 5 and 90 ⁇ m.
  • interlayers layers present between the two adhesive layers (i) and (ii) (these layers are also referred to below as “interlayers”), especially primer, barrier and/or carrier layers, it also being possible for these functions to be combined in one or more of the further layers.
  • interlayers especially primer, barrier and/or carrier layers
  • the thickness of the interlayers in one preferred embodiment is between 0.5 and 100 ⁇ m.
  • Adhesive layers (i) and (ii) and the further layers differ in respect of their chemical composition.
  • Adhesive layer (i), aligned to the bonding of the electrical module, is required to exhibit good adhesion to epoxy materials and polyimides.
  • thermoplastic materials are used for this purpose which by virtue of their melting achieve effective wetting of the epoxy or polyimide surface.
  • the following polymers are used here with particular preference: polyesters, polyamides, copolyamides, and copolyesters.
  • Suitable for the inventive purpose are, however, polyurethanes, ethylene-vinyl acetates, synthetic rubbers, such as styrene-isoprene diblock and triblock copolymers (SIS), styrene-butadiene diblock and triblock copolymers (SBS), styrene-ethylene-butadiene diblock and triblock copolymer (SEBS), polyvinyl acetate, polyimides, polyethers, copolyamides, copolyesters, polyolefins, such as polyethylene, polypropylene or poly(meth)acrylates, for example.
  • SIS styrene-isoprene diblock and triblock copolymers
  • SBS styrene-butadiene diblock and triblock copolymers
  • SEBS styrene-ethylene-butadiene diblock and triblock copolymer
  • polyimides polyethers, copolyamides, cop
  • Layer (i) therefore comprises adhesives which become tacky under temperature exposure and optional pressure and which, after bonding and cooling, as a result of solidification, develop a high bond strength to polyimide or epoxy materials.
  • the bond strength is with particular preference so high that, following the implanting operation, the electrical module can no longer be removed without destruction.
  • these heat-activatable adhesives have different static glass transition temperatures T g,A or a melting point T m,A . In one very preferred range the T g,A or T m,A is situated in a range between +55° C. and 150° C.
  • Tackifying resins for addition which can be used are the tackifier resins already known and described in the literature. Representatives that may be mentioned include pinene resins, indene resins, and rosins, their disproportionated, hydrogenated, polymerized, and esterified derivatives and salts, the aliphatic and aromatic hydrocarbon resins, terpene resins and terpene-phenolic resins, and also C5, C9, and other hydrocarbon resins. Any desired combinations of these and further resins may be used in order to adjust the properties of the resultant adhesive in accordance with requirements.
  • adhesive for layer (i) it is additionally possible to use heat-activatable adhesives which are composed of an elastomer and at least one reactive resin.
  • Elastomers used in this case are preferably rubbers, polychloroisoprenes, polyacrylates, nitrile rubbers, epoxidized nitrile rubbers, etc.
  • suitable reactive resins include phenolic resins, epoxy resins, melamine resins, resins having isocyanate functions, or mixtures of the aforementioned resins. In combination with the reactive systems it is also possible to add a multiplicity of other resins, filler materials, catalysts, ageing inhibitors, etc.
  • One very preferred group comprises epoxy resins.
  • the molecular weight (weight average Mw) of the epoxy resins varies from 100 g/mol up to a maximum of 10,000 g/mol for polymeric epoxy resins.
  • the epoxy resins comprise, for example, the reaction product of bisphenol A and epichlorohydrin, the reaction product of phenol and formaldehyde (Novolak resins) and epichlorohydrin, glycidyl esters, the reaction product of epichlorohydrin and p-aminophenol.
  • Preferred commercial examples are AralditeTM 6010, CY-281TM, ECNTM 1273, ECNTM 1280, MY 720, RD-2 from Ciba Geigy, DERTM 331, DERTM 732, DERTM 736, DENTM 432, DENTM 438, DENTM 485 from Dow Chemical, EponTM 812, 825, 826, 828, 830, 834, 836, 871, 872, 1001, 1004, 1031 etc. from Shell Chemical, and HPTTM 1071 and HPTTM 1079, likewise from Shell Chemical.
  • Examples of commercial aliphatic epoxy resins are vinylcyclohexane dioxides, such as ERL-4206, ERL-4221, ERL 4201, ERL-4289 or ERL-0400 from Union Carbide Corp.
  • Novolak resins which can be used include Epi-RezTM 5132 from Celanese, ESCN-001 from Sumitomo Chemical, CY-281 from Ciba Geigy, DENTM 431, DENTM 438, and Quatrex 5010 from Dow Chemical, RE 305S from Nippon Kayaku, EpiclonTM N673 from DaiNippon Ink Chemistry or EpikoteTM 152 from Shell Chemical
  • melamine resins such as CymelTM 327 and 323 from Cytec, for example.
  • reactive resins it is also possible to use terpene-phenolic resins, such as NIREZTM 2019 from Arizona Chemical, for example.
  • phenolic resins such as YP 50 from Toto Kasei, PKHC from Union Carbide Corp., and BKR 2620 from Showa Union Gosei Corp., for example.
  • reactive resins it is also possible to use polyisocyanates, such as CoronateTM L from Nippon Polyurethane Ind., DesmodurTM N3300 or MondurTM 489 from Bayer, for example.
  • polyisocyanates such as CoronateTM L from Nippon Polyurethane Ind., DesmodurTM N3300 or MondurTM 489 from Bayer, for example.
  • adhesives based on poly(meth)acrylate are employed.
  • monomers al) used are acrylic monomers comprising acrylic and methacrylic esters having alkyl groups consisting of 1 to 14 carbon atoms.
  • Specific examples are methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, propyl acrylate, propyl methacrylate, n-butyl acrylate, n-butyl methacrylate, n-pentyl acrylate, n-hexyl acrylate, n-hexyl methacrylate, n-heptyl acrylate, n-octyl acrylate, n-nonyl acrylate, lauryl acrylate, stearyl acrylate, stearyl methacrylate, behenyl acrylate, and the branched isomers thereof, such as 2-ethylhexyl acrylate.
  • component a2) are hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate, allyl alcohol, maleic anhydride, itaconic anhydride, itaconic acid, acrylamide, and glyceridyl methacrylate, benzyl acrylate, benzyl methacrylate, phenyl acrylate, phenyl methacrylate, tert-butylphenyl acrylate, tert-butylphenyl methacrylate, phenoxyethyl acrylate, phenoxyethyl methacrylate, 2-butoxyethyl methacrylate, 2-butoxyethyl acrylate, dimethylaminoethyl methacrylate, dimethylaminoethyl acrylate, diethylaminoethyl methacrylate, diethylaminoethyl acrylate, dieth
  • aromatic vinyl compounds are used for compound a2), the aromatic nuclei being composed preferably of C 4 to C 18 units. and being able also to include hetero atoms.
  • Particularly preferred examples are styrene, 4-vinylpyridine, N-vinylphthalimide, methylstyrene, 3,4-dimethoxystyrene, and 4-vinylbenzoic acid, this enumeration not being conclusive.
  • the monomers are chosen such that the resultant polymers can be employed as heat-activatable adhesives, especially such that the resultant polymers have adhesive properties in accordance with the “Handbook of Pressure Sensitive Adhesive Technology” by Donatas Satas (van Nostrand, New York 1989).
  • the static glass transition temperature of the resultant polymer is advantageously above 30° C.
  • the monomers are very preferably selected, and the quantitative composition of the monomer mixture advantageously chosen, such that according to the Fox equation (E1) (cf. T.G. Fox, Bull. Am. Phys. Soc. 1 (1956) (123)) the desired T g,A value is produced for the polymer.
  • E1 Fox equation
  • n represents the serial number of the monomers employed, w n the mass fraction of the respective monomer n (% by weight), and T g,n the respective glass transition temperature of the homopolymer of the respective monomers n, in K.
  • the heat-activatable polymers of layer (i) it may be of advantage if the polymer is treated by corona or plasma prior to coating.
  • examples of instruments suitable for atmospheric plasma treatment are those from Plasmatreat.
  • chemical anchoring takes place via, for example, a primer.
  • polyolefins especially poly- ⁇ -olefins
  • layer (i) which have a softening range of more than 30° C. and less than 150° C. and which likewise solidify again after bonding, in the course of cooling.
  • the polyolefin-activatable pressure-sensitive adhesives have static glass transition temperatures T g,A or melting points Tm,A, in one preferred embodiment, of +65° C. to 140° C.
  • the bond strength of these polymers can be increased by targeted additizing.
  • polyimine or polyvinylacetate copolymers can be used as bond strength promoter additives.
  • the monomers employed and also their amounts, here again, are preferably chosen again such that the desired temperature results when applying the Fox equation (E1).
  • the molecular weight can be varied.
  • polymers having a moderate or low molecular weight are used. It is also possible to mix together polymers of low and high molecular weight.
  • polyethylenes, polypropenes, polybutenes, polyhexenes or copolymers of polyethylene, polypropene, polybutene or polyhexene are employed.
  • VestoplastTM available commercially from Degussa under the trade name VestoplastTM are various heat-activatable poly- ⁇ -olefins. Propene-rich grades are offered under the names VestoplastTM 703, 704, 708, 750, 751, 792, 828, 888 or 891.
  • Adhesive layer (ii) is chosen such that it differs (i) in its chemical composition from layer (i).
  • Adhesive layer (ii) possesses very good adhesion to PC and/or ABS and/or PET and/or PVC. In one very preferred version the adhesion to these materials is so high that the electrical module can no longer be removed from the card body without destruction.
  • the heat-activatable adhesives for adhesive layer (ii) have different static glass transition temperatures T g,A or a melting point T m,A . In one very preferred range the T g,A or T m,A is situated in a range between +55° C. and 150° C.
  • thermoplastic materials are used for this purpose which by virtue of their melting achieve effective wetting of the card surface.
  • the following polymers are used here with particular preference: polyurethanes and/or synthetic rubbers, such as styrene-isoprene diblock and triblock copolymers (SIS), styrene-butadiene diblock and triblock copolymers (SBS), and styrene-ethylene-butadiene diblock and triblock copolymers (SEBS).
  • SIS styrene-isoprene diblock and triblock copolymers
  • SBS styrene-butadiene diblock and triblock copolymers
  • SEBS styrene-ethylene-butadiene diblock and triblock copolymers
  • polyesters such as polyethylene, polypropylene and/or poly(meth)acrylates.
  • Tackifying resins for addition are all the tackifier resins already known and described in the literature, without exception. Representatives that may be mentioned include pinene resins, indene resins, and rosins, their disproportionated, hydrogenated, polymerized, and esterified derivatives and salts, the aliphatic and aromatic hydrocarbon resins, terpene resins and terpene-phenolic resins, and also C5, C9, and other hydrocarbon resins. Any desired combinations of these and further resins may be used in order to adjust the properties of the resultant adhesive in accordance with requirements.
  • heat-activatable adhesives which are composed of an elastomer and at least one reactive resin.
  • Elastomers used in this case are preferably rubbers, polychloroisoprenes, polyacrylates, nitrile rubbers, epoxidized nitrile rubbers, etc.
  • suitable reactive resins include phenolic resins, epoxy resins, melamine resins, resins having isocyanate functions, or mixtures of the aforementioned resins. In combination with the reactive systems it is also possible to add a multiplicity of other resins, filler materials, catalysts, ageing inhibitors, etc.
  • One very preferred group comprises epoxy resins.
  • the molecular weight (weight average Mw) of the epoxy resins varies from 100 g/mol up to a maximum of 10,000 g/mol for polymeric epoxy resins.
  • the epoxy resins comprise, for example, the reaction product of bisphenol A and epichlorohydrin, the reaction product of phenol and formaldehyde (Novolak resins) and epichlorohydrin, glycidyl esters, the reaction product of epichlorohydrin and p-aminophenol.
  • Preferred commercial examples are AralditeTM 6010, CY-281TM, ECNTM 1273, ECNTM 1280, MY 720, RD-2 from Ciba Geigy, DERTM 331, DERTM 732, DERTM 736, DENTM 432, DENTM 438, DENTM 485 from Dow Chemical, EponTM 812, 825, 826, 828, 830, 834, 836, 871, 872, 1001, 1004, 1031 etc. from Shell Chemical, and HPTTM 1071 and HPTTM 1079, likewise from Shell Chemical.
  • Examples of commercial aliphatic epoxy resins are vinylcyclohexane dioxides, such as ERL-4206, ERL-4221, ERL 4201, ERL-4289 or ERL-0400 from Union Carbide Corp.
  • Novolak resins which can be used include Epi-RezTM 5132 from Celanese, ESCN-001 from Sumitomo Chemical, CY-281 from Ciba Geigy, DENTM 431, DENTM 438, and Quatrex 5010 from Dow Chemical, RE 305S from Nippon Kayaku, EpiclonTM N673 from DaiNippon Ink Chemistry or EpikoteTM 152 from Shell Chemical
  • melamine resins such as CymelTM 327 and 323 from Cytec, for example.
  • reactive resins it is also possible to use terpene-phenolic resins, such as NIREZTM 2019 from Arizona-Chemical, for example.
  • phenolic resins such as YP 50 from Toto Kasei, PKHC from Union Carbide Corp., and BKR 2620 from Showa Union Gosei Corp., for example.
  • reactive resins it is also possible to use polyisocyanates, such as CoronateTM L from Nippon Polyurethane Ind., DesmodurTM N3300 or MondurTM 489 from Bayer, for example.
  • polyisocyanates such as CoronateTM L from Nippon Polyurethane Ind., DesmodurTM N3300 or MondurTM 489 from Bayer, for example.
  • accelerants include imidazoles, available commercially as 2M7, 2E4MN, 2PZ-CN, 2PZ-CNS, P0505, and L07N from Shikoku Chem. Corp. or Curezol 2MZ from Air Products.
  • adhesives based on poly(meth)acrylate are employed.
  • monomers a3) used are acrylic monomers comprising acrylic and methacrylic esters having alkyl groups consisting of 1 to 14 carbon atoms.
  • Specific examples are methyl acrylate, methyl methacryl-ate, ethyl acrylate, ethyl methacrylate, propyl acrylate, propyl methacrylate, n-butyl acrylate, n-butyl methacrylate, n-pentyl acrylate, n-hexyl acrylate, n-hexyl methacrylate, n-heptyl acrylate, n-octyl acrylate, n-nonyl acrylate, lauryl acrylate, stearyl acrylate, stearyl methacrylate, behenyl acrylate, and the branched isomers thereof, such as 2-ethylhexyl acrylate.
  • component a4) are hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate, allyl alcohol, maleic anhydride, itaconic anhydride, itaconic acid, acrylamide, and glyceridyl methacrylate, benzyl acrylate, benzyl methacrylate, phenyl acrylate, phenyl methacrylate, tert-butylphenyl acrylate, tert-butylphenyl methacrylate, phenoxyethyl acrylate, phenoxyethyl methacrylate, 2-butoxyethyl methacrylate, 2-butoxyethyl acrylate, dimethylaminoethyl methacrylate, dimethylaminoethyl acrylate, diethylaminoethyl methacrylate, diethylaminoethyl acrylate, dieth
  • aromatic vinyl compounds are used for compound a4), the aromatic nuclei being composed preferably of C4 to C18 units and being able also to include hetero atoms.
  • Particularly preferred examples are styrene, 4-vinylpyridine, N-vinylphthalimide, methylstyrene, 3,4-dimethoxystyrene, and 4-vinylbenzoic acid, this enumeration not being conclusive.
  • the monomers are chosen such that the resultant polymers can be employed as heat-activatable adhesives, especially such that the resultant polymers have adhesive properties in accordance with the “Handbook of Pressure Sensitive Adhesive Technology” by Donatas Satas (van Nostrand, New York 1989).
  • the static glass transition temperature of the resultant polymer is advantageously above 30° C.
  • the monomers are very preferably selected, and the quantitative composition of the monomer mixture advantageously chosen, such that according to the Fox equation (E1) (cf. T.G. Fox, Bull. Am. Phys. Soc. 1 (1956) (123)) the desired T g,A value is produced for the polymer.
  • E1 Fox equation
  • n represents the serial number of the monomers employed, wn the mass fraction of the respective monomer n (% by weight), and T g,n the respective glass transition temperature of the homopolymer of the respective monomers n, in K.
  • polyolefins especially poly- ⁇ -olefins
  • polyolefins are used, in the sense of layer (ii), which have a softening range of more than 30° C. and less than 150° C. and which likewise solidify again after bonding, in the course of cooling.
  • the polyolefin-activatable pressure-sensitive adhesives have static glass transition temperatures T g,A or melting points T m,A , in one preferred embodiment, of +65° C. to 140° C.
  • the bond strength of these polymers can be increased by targeted additizing.
  • polyimine or polyvinylacetate copolymers can be used as bond strength promoter additives.
  • the monomers employed and also their amounts, here again, are preferably chosen again such that the desired temperature results when applying the Fox equation (E1).
  • the molecular weight can be varied.
  • polymers having a moderate or low molecular weight are used. It is also possible to mix together polymers of low and high molecular weight.
  • polyethylenes, polypropenes, polybutenes, polyhexenes or copolymers of polyethylene, polypropene, polybutene or polyhexene are employed.
  • VestoplastTM are various heat-activatable poly- ⁇ -olefins. Propene-rich grades are offered under the names VestoplastTM 703, 704, 708, 750, 751, 792, 828, 888 or 891. They possess melting points T m,A of 99 to 162° C. Furthermore, butene-rich grades are also available commercially, under the names VestoplastTM 308, 408, 508, 520, and 608. They possess melting points T m,A of 84 to 157° C.
  • interlayers there may be one or more further layers (“interlayers”), particularly primer, barrier and/or carrier layers, it also being possible for these functions to be united in one or more of the further layers. It is particularly advantageous to provide an interlayer.
  • the interlayer must adhere well to adhesive layer (i) and (ii).
  • adhesive layer (i) and (ii) it is possible to use pressure-sensitive adhesive materials or thermoplastic materials.
  • primers are employed.
  • Suitable primers are all primers known to the skilled worker and available commercially. Thus in one preferred version use is made of Sarans, aziridines or isocyanates, also in combination with one another. As a reactive primer it is preferred to use a difunctional or polyfunctional aziridine or isocyanate, and the primers can be introduced by stirring in a matrix.
  • polymeric or prepolymeric compounds with primer suitability it is possible additionally to use compounds having carboxylic acid groups.
  • suitable polymers include polyurethanes, polyurethane/acrylate copolymers, copolymers or terpolymers of polyalkylenes, polyalkyldienes, polyacrylate esters, polyalkyl esters, polyvinyl esters, polyvinyls with acrylic acid or methacrylic acid.
  • copolymers are polyethylene/acrylic acid copolymers, polyethylene/methacrylic acid copolymers, polyethylene/methacrylic acid/acrylic acid terpolymers, methyl methacrylates/acrylic acid copolymers, polybutadiene/methacrylic acid copolymers, vinyl chlorides/acrylic copolymers, and mixtures thereof.
  • the preferred polymers and copolymers are polyurethanes, polyethylene/acrylic acid copolymers, and polyethylene/methacrylic acid copolymers.
  • the properties can be varied by way of the number of carboxylic acid groups.
  • the primers additionally, may possess reactive groups.
  • Crosslinking compounds for the corresponding blends possess preferably polyfunctional groups.
  • Polyfunctional means that the compounds possess a functionality of greater than or equal to 2.
  • Suitable crosslinkers comprise, for example, polyfunctional aziridines, polyfunctional carbodiimides, polyfunctional epoxy resins and melamine resins.
  • the preferred crosslinkers are polyfunctional aziridines, such as trimethylpropane tris(B-(N-aziridinyl)propionate, pentaerythritol tris(B-(aziridinyl)propionate, and 2-methyl-2-ethyl-2-((3-(2-methyl-1-aziridinyl)-1-oxopropoxy)methyl)-1,3-propanediyl ester.
  • primers having hydroxyl groups or amine groups are also possible.
  • binders For the purpose of solidification it is also possible, furthermore, to use binders.
  • Liquid binders can be applied in solution in water or organic solvents or as a dispersion.
  • binding dispersions are chosen predominantly: thermosets in the form of phenolic or melamine resin dispersions, elastomers as dispersions of natural or synthetic rubbers or, usually, dispersions of thermoplastics such as acrylates, vinyl acetates, polyurethanes, styrene-butadiene systems, PVC and the like, and also their copolymers.
  • the dispersions in question are anionically or nonionically stabilized dispersions, although in certain cases cationic dispersions may also be of advantage.
  • the interlayer(s) for example, it is possible in this context to use the materials that are customary and familiar to the skilled worker, such as films (polyesters, PET, PE, PP, BOPP, PVC, polyimide, polymethacrylate, PEN, PVB, PVF, polyamide), nonwovens, foams, woven fabrics, and woven films.
  • films polyyesters, PET, PE, PP, BOPP, PVC, polyimide, polymethacrylate, PEN, PVB, PVF, polyamide
  • nonwovens foams, woven fabrics, and woven films.
  • thermoplastic materials it is particularly preferred to use the following polymers, in an enumeration which makes no claim to completeness: polyurethanes, polyesters, polyamides, ethylene-vinyl acetates, synthetic rubbers, such as styrene-isoprene diblock and triblock copolymers (SIS), styrene-butadiene diblock and triblock copolymers (SBS), styrene-ethylene-butadiene diblock and triblock copolymer (SEBS), polyvinyl acetate, polyimides, polyethers, copolyamides, copolyesters, polyolefins, such as polyethylene, polypropylene or poly(meth)acrylates.
  • polyurethanes polyesters, polyamides, ethylene-vinyl acetates, synthetic rubbers, such as styrene-isoprene diblock and triblock copolymers (SIS), styrene-butadiene diblock
  • the interlayer (primer/barrier layer/carrier) further comprises adhesives which become tacky under temperature exposure and optional pressure and which after bonding and cooling exhibit, as a result of the solidification, high bond strength to adhesive layers (i) and (ii).
  • These heat-activatable adhesives possess different static glass transition temperatures T g,A or melting points T m,A .
  • T g,A or T m,A is situated within a range between +25° C. and 250° C.
  • Tackifying resins for addition which can be used are the tackifier resins already known and described in the literature. Representatives that may be mentioned include pinene resins, indene resins, and rosins, their disproportionated, hydrogenated, polymerized, and esterified derivatives and salts, the aliphatic and aromatic hydrocarbon resins, terpene resins and terpene-phenolic resins, and also C5, C9, and other hydrocarbon resins. Any desired combinations of these and further resins may be used in order to adjust the properties of the resultant adhesive in accordance with requirements.
  • heat-activatable adhesives for the interlayer which are composed of an elastomer and at least one reactive resin.
  • Elastomers used in this case are preferably rubbers, polychloroisoprenes, polyacrylates, nitrile rubbers, epoxidized nitrile rubbers, etc.
  • suitable reactive resins include phenolic resins, epoxy resins, melamine resins, resins having isocyanate functions, or mixtures of the aforementioned resins. In combination with the reactive systems it is also possible to add a multiplicity of other resins, filler materials, catalysts, ageing inhibitors, etc.
  • One very preferred group comprises epoxy resins.
  • the molecular weight (weight average Mw) of the epoxy resins varies from 100 g/mol up to a maximum of 10,000 g/mol for polymeric epoxy resins.
  • the epoxy resins comprise, for example, the reaction product of bisphenol A and epichlorohydrin, the reaction product of phenol and formaldehyde (Novolak resins) and epichlorohydrin, glycidyl esters, the reaction product of epichlorohydrin and p-aminophenol.
  • Preferred commercial examples are AralditeTM 6010, CY-281TM, ECNTM 1273, ECNTM 1280, MY 720, RD-2 from Ciba Geigy, DERTM 331, DERTM 732, DERTM 736, DENTM 432, DENTM 438, DENTM 485 from Dow Chemical, EponTM 812, 825, 826, 828, 830, 834, 836, 871, 872, 1001, 1004, 1031 etc. from Shell Chemical, and HPTTM 1071 and HPTTM 1079, likewise from Shell Chemical.
  • Examples of commercial aliphatic epoxy resins are vinylcyclohexane dioxides, such as ERL-4206, ERL-4221, ERL 4201, ERL-4289 or ERL-0400 from Union Carbide Corp.
  • Novolak resins which can be used include Epi-RezTM 5132 from Celanese, ESCN-001 from Sumitomo Chemical, CY-281 from Ciba Geigy, DENTM 431, DENTM 438, and Quatrex 5010 from Dow Chemical, RE 305S from Nippon Kayaku, EpiclonTM N673 from DaiNippon Ink Chemistry or EpikoteTM 152 from Shell Chemical.
  • melamine resins such as CymelTM 327 and 323 from Cytec, for example.
  • reactive resins it is also possible to use terpene-phenolic resins, such as NIREZTM 2019 from Arizona Chemical, for example.
  • phenolic resins such as YP 50 from Toto Kasei, PKHC from Union Carbide Corp., and BKR 2620 from Showa Union Gosei Corp., for example.
  • reactive resins it is also possible to use polyisocyanates, such as CoronateTM L from Nippon Polyurethane Ind., DesmodurTM N3300 or MondurTM 489 from Bayer, for example.
  • polyisocyanates such as CoronateTM L from Nippon Polyurethane Ind., DesmodurTM N3300 or MondurTM 489 from Bayer, for example.
  • accelerants include imidazoles, available commercially as 2M7, 2E4MN, 2PZ-CN, 2PZ-CNS, P0505, and L07N from Shikoku Chem. Corp. or Curezol 2MZ from Air Products.
  • interlayer adhesives or heat-activatable adhesives based on poly(meth)acrylate are employed.
  • monomers a5) used are acrylic monomers comprising acrylic and methacrylic esters having alkyl groups consisting of 1 to 14 carbon atoms.
  • Specific examples are methyl acrylate, methyl methacryl-ate, ethyl acrylate, ethyl methacrylate, propyl acrylate, propyl methacrylate, n-butyl acrylate, n-butyl methacrylate, n-pentyl acrylate, n-hexyl acrylate, n-hexyl methacrylate, n-heptyl acrylate, n-octyl acrylate, n-nonyl acrylate, lauryl acrylate, stearyl acrylate, stearyl methacrylate, behenyl acrylate, and the branched isomers thereof, such as 2-ethylhexyl acrylate.
  • component a6) are hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate, allyl alcohol, maleic anhydride, itaconic anhydride, itaconic acid, acrylamide, and glyceridyl methacrylate, benzyl acrylate, benzyl methacrylate, phenyl acrylate, phenyl methacrylate, tert-butylphenyl acrylate, tert-butylphenyl methacrylate, phenoxyethyl acrylate, phenoxyethyl methacrylate, 2-butoxyethyl methacrylate, 2-butoxyethyl acrylate, dimethylaminoethyl methacrylate, dimethylaminoethyl acrylate, diethylaminoethyl methacrylate, diethylaminoethyl acrylate, dieth
  • aromatic vinyl compounds are used for compound a6), the aromatic nuclei being composed preferably of C 4 to C 18 units and being able also to include hetero atoms.
  • Particularly preferred examples are styrene, 4-vinylpyridine, N-vinylphthalimide, methylstyrene, 3,4-dimethoxystyrene, and 4-vinylbenzoic acid, this enumeration not being conclusive.
  • the monomers are chosen such that the resultant polymers can be employed as heat-activatable adhesives, especially such that the resultant polymers have adhesive properties in accordance with the “Handbook of Pressure Sensitive Adhesive Technology” by Donatas Satas (van Nostrand, New York 1989).
  • the static glass transition temperature of the resultant polymer is advantageously above 30° C.
  • the desired glass transition temperature T g,A is below 15° C.
  • the monomers are very preferably selected, and the quantitative composition of the monomer mixture advantageously chosen, such that according to the Fox equation (E1) (cf. T.G. Fox, Bull. Am. Phys. Soc. 1 (1956) (123)) the desired Tg,A value is produced for the polymer.
  • E1 Fox equation
  • n represents the serial number of the monomers employed, w n the mass fraction of the respective monomer n (% by weight), and T g,n the respective glass transition temperature of the homopolymer of the respective monomers n, in K.
  • the polymer is corona- or plasma-treated prior to coating.
  • Apparatus suitable for atmospheric plasma treatment includes, for example, those from Plasmatreat.
  • the interlayer of polyolefins especially poly- ⁇ -olefins, which preferably have a softening range of more than 30° C. and less than 150° C. and which likewise solidify again after bonding, in the course of cooling.
  • the polyolefin-activatable adhesives have static glass transition temperatures T g,A or melting points T m,A , in one preferred embodiment, of +65° C. to 140° C.
  • the bond strength of these polymers can be increased by targeted additizing.
  • polyimine or polyvinylacetate copolymers can be used as bond strength promoter additives.
  • the monomers employed and also their amounts, here again, are preferably chosen again such that the desired temperature results when applying the Fox equation (E1).
  • the molecular weight can be varied.
  • polymers having a moderate or low molecular weight are used. It is also possible to mix together polymers of low and high molecular weight.
  • polyethylenes, polypropenes, polybutenes, polyhexenes or copolymers of polyethylene, polypropene, polybutene or polyhexene are employed.
  • VestoplastTM are various heat-activatable poly- ⁇ -olefins. Propene-rich grades are offered under the names VestoplastTM 703, 704, 708, 750, 751, 792, 828, 888 or 891. They possess melting points T m,A of 99 to 162° C. Furthermore, butene-rich grades are also available commercially, under the names VestoplastTM 308, 408, 508, 520, and 608. They possess melting points T m,A of 84 to 157° C.
  • the multilayer heat-activatable adhesive can be produced by a variety of processes.
  • the layers (i) and (ii) and the interlayer(s) are brought together simultaneously in a coextrusion process, using a coextrusion die.
  • the coextrusion of the interlayer(s) is—depending on product construction—optional.
  • the adhesive (i), (ii) and the interlayer(s) are applied separately.
  • the adhesive (i) is coated onto a release paper or release liner or in-process liner. Coating may take place from solution or from the melt. In the case of coating from solution it is preferred—as is usual with the processing of adhesives from solution—to operate with the doctor blade technique, in which case all doctor blade techniques known to the skilled worker may be used.
  • the solvent if the polymer is in solution—is stripped off preferably in a concentrating extruder under reduced pressure, something which can be accomplished using, for example, single-screw or twin-screw extruders, which preferably distil off the solvent in different or identical vacuum stages and which possess a feed preheater. Coating then takes place via a melt die or an extrusion die, with the film of adhesive being drawn if desired, in order to achieve the optimum coating thickness.
  • the adhesive (ii) is applied from solution or from the melt to the adhesive (i).
  • solvents which do not activate or dissolve the layer (i).
  • the solvent if the polymer is in solution—is stripped off preferably in a concentrating extruder under reduced pressure, something which can be accomplished using, for example, single-screw or twin-screw extruders, which preferably distil off the solvent in different or identical vacuum stages and which possess a feed preheater.
  • Coating then takes place via a melt die or an extrusion die, with the film of adhesive being drawn if desired, in order to achieve the optimum coating thickness.
  • the interlayer(s) is/are coated onto the adhesive layer (i) from solution or from the melt.
  • the adhesive layer (ii) is also coated onto the adhesive layer (ii) from solution or from the melt, and then lamination to the adhesive layer (i).
  • the individual layers are coated separately and then laminated together.
  • the separate coating of the adhesives (-i) and (ii) and of the interlayer(s) may take place from solution or else from the melt and in accordance with the processes already described above. Thereafter the layers are laminated together.
  • the adhesive layers (i) and (ii) and, where used, the interlayer(s) become tacky and anchoring is significantly improved.
  • UV-absorbing photoinitiators are added to the adhesives for layers (i) and/or (ii) and/or the interlayer(s).
  • Useful photoinitiators whose use is very effective are benzoin ethers, such as benzoin methyl ether and benzoin isopropyl ether, substituted acetophenones, such as 2,2-diethoxyacetophenone (available as Irgacure 651® from Ciba Geigy), 2,2-dimethoxy-2-phenyl-1-phenylethanone, dimethoxyhydroxyacetophenone, substituted ⁇ -ketols, such as 2-methoxy-2-hydroxy -propiophenone, aromatic sulfonyl chlorides, such as 2-naphthylsulfonyl chloride, and photoactive oximes, such as 1-phenyl-1,2-propanedione 2-(O-ethoxycarbonyl)oxime.
  • the abovementioned photoinitiators and others which may be used, and others of the Norrish I or Norrish II type, may contain the following radicals: benzophenone, acetophenone, benzil, benzoin, hydroxyalkylphenone, phenyl cyclohexyl ketone, anthraquinone, trimethylbenzoylphosphine oxide, methylthiophenyl morpholine ketone, aminoketone, azobenzoin, thioxanthone, hexaaryl bisimidazole, triazine or fluorenone radicals, it being possible for each of these radicals to be additionally substituted by one or more halogen atoms and/or one or more alkyloxy groups and/or one or more amino groups or hydroxyl groups.
  • Typical irradiation equipment which can be employed includes linear cathode systems, scanner systems or segmented cathode systems where they comprise electron beam accelerators.
  • An exhaustive description of the state of the art and the most important process parameters are found in Skelhorne, E1ectron Beam Processing, in Chemistry and Technology of UV and EB Formulation for Coatings, Inks and Paints, Vol. 1, 1991, SITA, London.
  • the typical acceleration voltages are in the range between 50 kV and 500 kV, preferably 80 kV and 300 kV.
  • the scatter doses employed range between 5 to 150 kGy, in particular between 20 and 100 kGy.
  • Backing materials used for the multilayer adhesives are the customary materials familiar to the skilled worker, such as films (polyesters, PET, PE, PP, BOPP, PVC, polyimide), nonwovens, foams, woven fabrics and woven films, and also release paper (glassine, HDPE, LDPE).
  • the backing materials ought to be provided with a release layer.
  • the release layer is composed of a silicone release varnish or of a fluorinated release varnish.
  • a component of the invention is the use of the inventive multilayer adhesive film for bonding chip modules in card bodies, the card bodies used being, in particular, PVC, ABS, PET, PC, PE, PP and the like.
  • a further component of the present invention is an adhesively bonded unit comprising a card body, an at least two-layer adhesive film as described above, and a chip module.
  • the Iso bending test is carried out in analogy to Iso/IEC 10373: 1993 (E) Section 6.1. The test is passed if a total of more than 4000 bends are attained.
  • the chip card is bent by hand, via one of the two corners lying nearer to the electrical module, to an extent such that the card breaks or the module breaks. The test is then passed. If the electrical module parts or jumps out, the test is failed.
  • the layer thickness of the copolyester is subsequently 50 ⁇ m.
  • the assembly Before being wound up, the assembly is passed over a chill roll.
  • the layer thickness of the adhesive layer (ii) after coating was 40 ⁇ m.
  • the assembly Before being wound up, the assembly is passed over a chill roll.
  • the electrical modules were implanted in the card body using an implanter from Ruhlamat Testplatz Modul.
  • Examples 1 to 3 are laminated onto the Nedcard module belt using a two-roll laminating unit from Storck GmbH. It should be ensured here that the adhesive layer (i) is coated directly onto the module belt.
  • the electrical modules are then implanted into the matching cavity in the card body.
  • test method A Test method B
  • Test method C 1 passed passed passed passed 2 passed passed passed 3 passed passed passed passed
  • Table 1 reveals that all of the inventive examples passed the most important criteria for a chip card and are therefore highly suitable for the adhesive bonding of electrical modules to card bodies.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Credit Cards Or The Like (AREA)
US10/569,353 2003-08-22 2004-08-20 Adhesive film comprising at least two layers Abandoned US20070137775A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10339199.1 2003-08-22
DE10339199 2003-08-22
PCT/EP2004/009344 WO2005021670A2 (fr) 2003-08-22 2004-08-20 Film adhesif a au moins deux couches

Publications (1)

Publication Number Publication Date
US20070137775A1 true US20070137775A1 (en) 2007-06-21

Family

ID=34258221

Family Applications (2)

Application Number Title Priority Date Filing Date
US10/569,339 Expired - Fee Related US7562827B2 (en) 2003-08-22 2004-08-20 Use of an adhesive film for implanting electrical modules into a card body
US10/569,353 Abandoned US20070137775A1 (en) 2003-08-22 2004-08-20 Adhesive film comprising at least two layers

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US10/569,339 Expired - Fee Related US7562827B2 (en) 2003-08-22 2004-08-20 Use of an adhesive film for implanting electrical modules into a card body

Country Status (8)

Country Link
US (2) US7562827B2 (fr)
EP (2) EP1658346B1 (fr)
JP (2) JP2007514006A (fr)
KR (2) KR20060118408A (fr)
CN (2) CN1839188A (fr)
DE (1) DE502004009363D1 (fr)
ES (2) ES2324218T3 (fr)
WO (2) WO2005021671A2 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100068514A1 (en) * 2008-09-18 2010-03-18 Tesa Se Method for encapsulating an electronic arrangement
US20110039107A1 (en) * 2007-11-30 2011-02-17 Andre Buchholz Film primer with improved adhesion
US20150240128A1 (en) * 2014-02-26 2015-08-27 H.B. Fuller Company Tacky, heat curable multi-layer adhesive films
CN107207896A (zh) * 2015-02-05 2017-09-26 Sika技术股份公司 用于聚碳酸酯和聚碳酸酯共混物的水基底漆组合物
US9914854B2 (en) 2011-07-29 2018-03-13 3M Innovative Properties Company Multilayer film having at least one thin layer and continuous process for forming such a film
US20220041903A1 (en) * 2020-08-04 2022-02-10 Samsung Sdi Co., Ltd. Adhesive film, optical member including the same, and optical display including the same
US20220340789A1 (en) * 2019-08-20 2022-10-27 3M Innovative Properties Company Film including hybrid solvent barrier and primer layer

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10361537A1 (de) * 2003-12-23 2005-07-28 Tesa Ag Thermoplastische Blends zur Implantierung von elektrischen Modulen in einen Kartenkörper
DE10361538A1 (de) * 2003-12-23 2005-07-28 Tesa Ag Schmelzkleber zur Implantierung von elektrischen Modulen in einen Kartenkörper
DE102004044086A1 (de) 2004-09-09 2006-03-16 Tesa Ag Thermisch vernetzte Acrylat-Hotmelts
DE102006047735A1 (de) * 2006-10-06 2008-04-10 Tesa Ag Hitzeaktivierbares Klebeband insbesondere für die Verklebung von elektronischen Bauteilen und Leiterbahnen
EP2074188A1 (fr) * 2006-10-13 2009-07-01 Sunwoo AMC Co., Ltd. Pellicule de revêtement de plastique/téflon-silicium et procédé de préparation correspondant
KR100871608B1 (ko) * 2006-10-13 2008-12-02 선우에이엠씨주식회사 테프론-실리콘 접착 필름 및 그 제조방법
DE102006055093A1 (de) * 2006-11-21 2008-06-19 Tesa Ag Hitze-aktiviert verklebbares Flächenelement
US20090187507A1 (en) * 2006-12-20 2009-07-23 Brown Kerry D Secure financial transaction network
US7845755B2 (en) * 2008-03-17 2010-12-07 Silverbrook Research Pty Ltd Printhead integrated circuit attachment film having differentiated adhesive layers
US9694560B2 (en) 2008-06-23 2017-07-04 The Boeing Company Multi-layer film adhesive
DE102010011517A1 (de) * 2010-03-15 2011-09-15 Smartrac Ip B.V. Laminataufbau für eine Chipkarte und Verfahren zu dessen Herstellung
US20140083608A1 (en) * 2011-05-06 2014-03-27 Tesa Se Method for increasing the adhesive properties of pressure-sensitive adhesive compounds on substrates by way of plasma treatment
KR101409832B1 (ko) * 2011-07-26 2014-06-30 에스케이종합화학 주식회사 자기 접착 조성물 및 이로부터 제조된 유리용 자기 접착 필름
KR102030212B1 (ko) * 2012-03-30 2019-10-08 키모토 컴파니 리미티드 이박리성 점착 필름 및 금속판의 가공방법
EP2735595A1 (fr) 2012-11-23 2014-05-28 3M Innovative Properties Company Film adhésif multicouche sensible à la pression
EP2808371B1 (fr) 2013-05-28 2019-09-18 3M Innovative Properties Company Additif de dégazage pour adhésifs sensibles à la pression
DE102013106181A1 (de) * 2013-06-13 2014-12-18 Bundesdruckerei Gmbh Chipkarte und Verfahren zum Herstellen einer Chipkarte
DE102016202479A1 (de) * 2016-02-18 2017-08-24 Tesa Se Haftklebestreifen
KR102112359B1 (ko) * 2016-02-24 2020-05-18 주식회사 엘지화학 반도체 웨이퍼 표면 보호용 점착 필름
CN106276972A (zh) * 2016-08-25 2017-01-04 昆明理工大学 一种利用氮气和水合成氨的方法
KR102170378B1 (ko) * 2019-02-19 2020-10-27 테사 소시에타스 유로파에아 Uv 경화 방식을 이용한 다층구조형 기능성 고방열 점착테이프의 제조방법
CN113402789B (zh) * 2020-03-17 2022-10-21 中国石油化工股份有限公司 阻燃丁腈橡胶组合物、阻燃丁腈橡胶/木质素复合材料及其制备方法和应用

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3326741A (en) * 1962-05-18 1967-06-20 Minnesota Mining & Mfg Adhesive-coated sheet material
US3639500A (en) * 1968-05-09 1972-02-01 Avery Products Corp Curable pressure sensitive adhesive containing a polyepoxide a carboxylated diene polymer and an acrylic ester tackifier
US4060664A (en) * 1975-12-08 1977-11-29 Minnesota Mining And Manufacturing Company Bonded composite structures
US4404246A (en) * 1982-09-22 1983-09-13 Minnesota Mining And Manufacturing Company Storable, crosslinkable pressure-sensitive adhesive tape
US4452955A (en) * 1981-09-16 1984-06-05 Minnesota Mining & Manufacturing Company Novel adhesive compositions
US4545843A (en) * 1982-09-01 1985-10-08 David Bray Method of manufacturing adhesive tape
US4814227A (en) * 1985-08-19 1989-03-21 Nichiban Company Limited Adhesive sheet for preventing aquatic growths and method for preventing aquatic growths
US4880683A (en) * 1981-12-28 1989-11-14 Minnesota Mining And Manufacturing Company Hot-tackifying adhesive tape
US5085655A (en) * 1990-07-19 1992-02-04 Avery Dennison Corporation Cohesive tape system
US5593759A (en) * 1992-10-20 1997-01-14 Avery Dennison Corporation Pressure-sensitive structural adhesive
US6210522B1 (en) * 1999-06-15 2001-04-03 Lexmark International, Inc. Adhesive bonding laminates
US6565969B1 (en) * 1999-10-21 2003-05-20 3M Innovative Properties Company Adhesive article
US20030124347A1 (en) * 2001-12-28 2003-07-03 Sun Sasongko Coextruded adhesive film to bond non-polar soles to polar uppers

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4404345A (en) 1981-09-16 1983-09-13 Minnesota Mining And Manufacturing Company Novel adhesive compositions
DE19519499B4 (de) 1995-05-27 2005-05-25 Tesa Ag Thermoplastische Klebstoffolie und deren Verwendung
DE19906589A1 (de) * 1999-02-17 2000-08-24 Basf Ag Cholesterisches Schichtmaterial und Verfahren zu dessen Herstellung
DE19940340B4 (de) 1999-08-25 2006-10-26 Lohmann Gmbh & Co Kg Thermoaktivierbare Haftklebefolie, Verfahren zu deren Herstellung und Verwendung struktureller Klebeverbindungen
DE19948560A1 (de) 1999-10-08 2001-08-23 Atp Alltape Klebetechnik Gmbh Klebstoffolie zum Implantieren von elektrischen Modulen in einen Kartenkörper und Verfahren zu deren Herstellung
JP2001311056A (ja) * 2000-04-28 2001-11-09 Kanegafuchi Chem Ind Co Ltd 被着体の接着方法

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3326741A (en) * 1962-05-18 1967-06-20 Minnesota Mining & Mfg Adhesive-coated sheet material
US3639500A (en) * 1968-05-09 1972-02-01 Avery Products Corp Curable pressure sensitive adhesive containing a polyepoxide a carboxylated diene polymer and an acrylic ester tackifier
US4060664A (en) * 1975-12-08 1977-11-29 Minnesota Mining And Manufacturing Company Bonded composite structures
US4452955A (en) * 1981-09-16 1984-06-05 Minnesota Mining & Manufacturing Company Novel adhesive compositions
US4880683A (en) * 1981-12-28 1989-11-14 Minnesota Mining And Manufacturing Company Hot-tackifying adhesive tape
US4545843A (en) * 1982-09-01 1985-10-08 David Bray Method of manufacturing adhesive tape
US4404246A (en) * 1982-09-22 1983-09-13 Minnesota Mining And Manufacturing Company Storable, crosslinkable pressure-sensitive adhesive tape
US4814227A (en) * 1985-08-19 1989-03-21 Nichiban Company Limited Adhesive sheet for preventing aquatic growths and method for preventing aquatic growths
US5085655A (en) * 1990-07-19 1992-02-04 Avery Dennison Corporation Cohesive tape system
US5593759A (en) * 1992-10-20 1997-01-14 Avery Dennison Corporation Pressure-sensitive structural adhesive
US6210522B1 (en) * 1999-06-15 2001-04-03 Lexmark International, Inc. Adhesive bonding laminates
US6565969B1 (en) * 1999-10-21 2003-05-20 3M Innovative Properties Company Adhesive article
US20030124347A1 (en) * 2001-12-28 2003-07-03 Sun Sasongko Coextruded adhesive film to bond non-polar soles to polar uppers

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110039107A1 (en) * 2007-11-30 2011-02-17 Andre Buchholz Film primer with improved adhesion
US20100068514A1 (en) * 2008-09-18 2010-03-18 Tesa Se Method for encapsulating an electronic arrangement
US9627646B2 (en) 2008-09-18 2017-04-18 Tesa Se Method for encapsulating an electronic arrangement
US9914854B2 (en) 2011-07-29 2018-03-13 3M Innovative Properties Company Multilayer film having at least one thin layer and continuous process for forming such a film
US20150240128A1 (en) * 2014-02-26 2015-08-27 H.B. Fuller Company Tacky, heat curable multi-layer adhesive films
US9481814B2 (en) * 2014-02-26 2016-11-01 H.B. Fuller Company Tacky, heat curable multi-layer adhesive films
CN107207896A (zh) * 2015-02-05 2017-09-26 Sika技术股份公司 用于聚碳酸酯和聚碳酸酯共混物的水基底漆组合物
US20220340789A1 (en) * 2019-08-20 2022-10-27 3M Innovative Properties Company Film including hybrid solvent barrier and primer layer
US20220041903A1 (en) * 2020-08-04 2022-02-10 Samsung Sdi Co., Ltd. Adhesive film, optical member including the same, and optical display including the same

Also Published As

Publication number Publication date
CN1863884A (zh) 2006-11-15
EP1658345B1 (fr) 2013-10-16
KR20060118409A (ko) 2006-11-23
US7562827B2 (en) 2009-07-21
DE502004009363D1 (de) 2009-05-28
ES2324218T3 (es) 2009-08-03
JP2007514006A (ja) 2007-05-31
EP1658345A2 (fr) 2006-05-24
EP1658346B1 (fr) 2009-04-15
WO2005021671A2 (fr) 2005-03-10
US20070138296A1 (en) 2007-06-21
KR20060118408A (ko) 2006-11-23
WO2005021670A2 (fr) 2005-03-10
WO2005021671A3 (fr) 2005-04-28
WO2005021670A3 (fr) 2005-05-19
ES2435849T3 (es) 2013-12-23
JP2007503478A (ja) 2007-02-22
EP1658346A2 (fr) 2006-05-24
CN1839188A (zh) 2006-09-27

Similar Documents

Publication Publication Date Title
US7562827B2 (en) Use of an adhesive film for implanting electrical modules into a card body
TWI414010B (zh) Crystalline crystal / sticky ribbon and semiconductor wafer manufacturing method
US20100252185A1 (en) Removable pressure sensitive adhesive sheet and method for processing adherend using the same
KR20100014630A (ko) 열-활성화된 접착성 평면 엘리먼트
JP2002088320A (ja) 加熱剥離型粘着テープ・シート及びその製造方法
US8062458B2 (en) Method for stamping thermally activatable adhesive materials which are not tacky at room temperature
WO2009144985A1 (fr) Procédé de découpage en dés
US20150159052A1 (en) Light-absorbing heat-activable adhesive compound and adhesive tape containing such adhesive compound
US20080115888A1 (en) Heat-activatedly bondable 2d element
CN102382590A (zh) 热固型胶粘带或胶粘片
US7569640B2 (en) Nitrile rubber blends for fixing metal parts to plastics
KR20170115048A (ko) 수지막 형성용 복합 시트, 및 수지막을 갖는 칩의 제조 방법
US7923510B2 (en) Adhesive sheet based on nitrile rubber blends for attaching metal parts to plastics
JP2011044444A (ja) 多層粘着シート及び多層粘着シートを用いた電子部品の製造方法。
US20110171472A1 (en) Adhesive With a High Resistance
US20110159307A1 (en) Method for Gluing Two Plastic Surfaces Together
MXPA06007085A (es) Pelicula adhesiva utilizada para implantar modulos electricos en un cuerpo de tarjeta.
EP4276155A1 (fr) Bande multicouche et procédé de décollage de la bande multicouche
US20080026186A1 (en) Hot-Melt Adhesive
JP4410366B2 (ja) カバーテープ
JP2009295864A (ja) 基材フィルムの製造方法及びダイシング・ダイボンディングテープ
JP3659796B2 (ja) 粘着シート
JP4666550B2 (ja) 剥離ライナー付き加熱接着シート
CN113227285A (zh) 耐热层压件和耐热粘合剂
JPH10292161A (ja) ポリオレフィン用接着テープ

Legal Events

Date Code Title Description
AS Assignment

Owner name: TESA AG, GERMANY

Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE THE ASSIGNMENT RECORDED ON 1//23/07 INCORRECTLY RECORDED TO SERIAL NO. 11/569353 AND SHOULD HAVE BEEN RECORDED TO 10/569353 PREVIOUSLY RECORDED ON REEL 018794 FRAME 0950;ASSIGNORS:BARGMANN, RENKE;HUSEMANN, MARC;REEL/FRAME:018912/0143;SIGNING DATES FROM 20060831 TO 20060904

AS Assignment

Owner name: TESA SE, GERMANY

Free format text: CHANGE OF NAME;ASSIGNOR:TESA AG;REEL/FRAME:025105/0146

Effective date: 20090331

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION