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TWI792785B - Substrate bonding apparatus and substrate bonding method - Google Patents

Substrate bonding apparatus and substrate bonding method Download PDF

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Publication number
TWI792785B
TWI792785B TW110147809A TW110147809A TWI792785B TW I792785 B TWI792785 B TW I792785B TW 110147809 A TW110147809 A TW 110147809A TW 110147809 A TW110147809 A TW 110147809A TW I792785 B TWI792785 B TW I792785B
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camera unit
camera
substrate
chuck
frame
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TW110147809A
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TW202230577A (en
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金宰煥
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南韓商Ｔｅｓ股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput

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  • Condensed Matter Physics & Semiconductors (AREA)
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Abstract

本發明提供基板接合裝置及基板接合方法，更具體地涉及一種在相互接合基板的情況下，減少基板的接合不良的基板接合裝置及基板接合方法。The present invention provides a substrate bonding device and a substrate bonding method, and more specifically relates to a substrate bonding device and a substrate bonding method that reduce bonding defects of substrates when substrates are bonded to each other.

Description

基板接合裝置及基板接合方法Substrate bonding apparatus and substrate bonding method

本發明涉及基板接合裝置及基板接合方法，更具體地涉及一種在相互接合基板的情況下，減少基板的接合不良的基板接合裝置及基板接合方法。 The present invention relates to a substrate bonding apparatus and a substrate bonding method, and more particularly, to a substrate bonding apparatus and a substrate bonding method that reduce bonding failures of substrates when substrates are bonded to each other.

近來隨著技術及產業的發展而增加對半導體設備或基板(以下稱為‘基板’)的高集成化的要求。該情況，對於將高集成化基板配置在水平面內，而通過配線聯接而產品化的情況，而發生增加配線長度、增加配線阻抗及配線延遲等問題。 Recently, with the development of technology and industry, there is an increasing demand for high integration of semiconductor devices or substrates (hereinafter referred to as 'substrates'). In this case, when a highly integrated substrate is arranged in a horizontal plane and then commercialized by wiring connection, problems such as increased wiring length, increased wiring impedance, and wiring delay arise.

因此，提出使用將基板進行三維層疊的三維集成技術。對於該三維集成技術，例如，使用接合裝置而執行上下部兩枚基板的接合。 Therefore, a three-dimensional integration technique using three-dimensionally stacked substrates has been proposed. In this three-dimensional integration technique, for example, two upper and lower substrates are bonded using a bonding device.

為了接合上部基板和下部基板，重要的是排列上部基板和下部基板，為此，對於現有技術的裝置的情況，具有上部攝像機和下部攝像機。 In order to join the upper and lower substrates, it is important to align the upper and lower substrates, for which purpose, as is the case with prior art devices, there are upper and lower cameras.

通過上部攝像機識別下部基板而計算座標，而且，通過下 部攝像機識別上部基板而計算座標，沿著所述座標而移動上下部基板而進行排列。 Coordinates are calculated by recognizing the lower board with the upper camera, and, through the lower The upper camera recognizes the upper substrate to calculate coordinates, and the upper and lower substrates are moved and arranged along the coordinates.

但對於現有技術的裝置的情況，在上部攝像機和下部攝像機準確配置在垂直線上的情況下，未發生上下部基板的座標誤差。但對於現有技術的裝置的情況，上部攝像機及下部攝像機以水平方向或垂直方向反復移動而上部攝像機及下部攝像機的垂直方向排列發生錯位或扭曲而頻繁發生座標誤差。 However, in the case of the conventional device, when the upper camera and the lower camera are accurately arranged on the vertical line, no coordinate error between the upper and lower substrates occurs. However, in the case of the prior art device, the upper camera and the lower camera repeatedly move horizontally or vertically, and the vertical arrangement of the upper camera and the lower camera is misaligned or distorted, resulting in frequent coordinate errors.

並且，在現有技術的裝置中，該上部攝像機和下部攝像機的垂直方向排列依賴作業者的手工作業，根據作業者的熟練程度而極大發生垂直方向排列的偏差，而且，通過手工作業進行垂直方向排列，而極大降低接合裝置的效率。 In addition, in the prior art device, the vertical alignment of the upper camera and the lower camera depends on the manual work of the operator, and the deviation in the vertical alignment greatly occurs depending on the operator's proficiency, and the vertical alignment is performed manually. , which greatly reduces the efficiency of the coupling device.

本發明是為了如上所述問題，其目的在於提供一種基板接合裝置及基板接合方法，在相互接合基板的基板接合裝置中，執行垂直排列識別基板的排序鍵的攝像機單元的垂直排列步驟而縮小排序鍵的座標誤差。 The present invention is made to solve the above problems, and an object of the present invention is to provide a substrate bonding apparatus and a substrate bonding method, in which, in the substrate bonding apparatus for bonding substrates to each other, a step of vertically arranging camera units that identify the sort keys of the substrates is performed to reduce the size of the sequence. The coordinate error of the key.

如上所述的本發明的目的通過基板接合裝置實現，該基板接合裝置包括：腔體；第一卡盤，設置在所述腔體內部而吸附第 一基板；第二卡盤，以朝向所述第一卡盤的方式設置在所述腔體內部，相對於所述第一卡盤而以垂直及水平方向相對移動的方式設置而吸附第二基板；及排列模組，具有識別所述第一基板的第一排序鍵及第二基板的第二排序鍵的攝像機單元，並設置包含能夠上下移動的框架。 The object of the present invention as described above is achieved by a substrate bonding device, which includes: a cavity; a first chuck disposed inside the cavity to absorb the first A substrate; a second chuck, disposed inside the cavity in a manner facing the first chuck, and relatively moving relative to the first chuck in the vertical and horizontal directions to absorb the second substrate ; and an arrangement module, having a camera unit that recognizes the first sort key of the first substrate and the second sort key of the second substrate, and is provided with a frame capable of moving up and down.

在此，所述攝像機單元能夠相對於所述框架移動設置。 In this case, the camera unit is arranged displaceably relative to the frame.

並且，所述攝像機單元能夠在所述框架水平方向移動及斜置。 Also, the camera unit can move and tilt in the horizontal direction of the frame.

而且，所述框架包括：一對垂直部件，按提前規定的間距分隔配置；一對水平部件，相互連接所述垂直部件的上下端部並供設置所述攝像機單元，其中，所述一對水平部件中至少一個能夠相對於所述垂直部件而上下移動配置。 Moreover, the frame includes: a pair of vertical parts arranged at intervals specified in advance; a pair of horizontal parts connecting the upper and lower ends of the vertical parts and providing the camera unit, wherein the pair of horizontal parts At least one of the parts is configured to be movable up and down relative to the vertical part.

另外，所述攝像機單元包括：第一攝像機單元，識別所述第二排序鍵；第二攝像機單元，識別所述第一排序鍵，並與所述第一攝像機單元相對配置。 In addition, the camera unit includes: a first camera unit that identifies the second sort key; a second camera unit that identifies the first sort key and is configured opposite to the first camera unit.

並且，所述一對水平部件包括第一水平部件和第二水平部件，所述第一攝像機單元被設置在所述第一水平部件，所述第二攝像機單元被設置在所述第二水平部件。 And, the pair of horizontal members includes a first horizontal member and a second horizontal member, the first camera unit is installed on the first horizontal member, and the second camera unit is installed on the second horizontal member .

另外，所述攝像機單元設置：移動板，能夠相對於所述框架而水平方向移動設置；識別攝像機，設置在所述移動板而識別所述第一排序鍵或第二排序鍵；及排序攝像機，用於所述移動板的排列。 In addition, the camera unit is provided with: a moving plate capable of moving horizontally relative to the frame; a recognition camera disposed on the moving plate to identify the first sorting key or the second sorting key; and a sorting camera, Alignment for the mobile plate.

並且，所述移動板能夠相對於所述框架斜置設置。 Also, the moving plate can be arranged obliquely relative to the frame.

而且，在所述移動板還設置：攝像機排序鍵，通過相對的攝像機單元的排序攝像機識別。 Moreover, the mobile board is further provided with: a camera sorting key, which is identified by sorting cameras of the relative camera unit.

另外，在所述框架在中央以能夠移動所述第一卡盤及第二卡盤的方式形成中空部。 In addition, a hollow portion is formed in the center of the frame so that the first chuck and the second chuck can move.

另外，如上所述的本發明的目的涉及一種包括框架；在所述框架設置第一攝像機單元及第二攝像機單元的基板接合裝置的基板接合方法，該基板接合方法包括如下步驟：利用所述第二攝像機單元而識別第一基板的第一排序鍵；利用所述第一攝像機單元而識別第二基板的第二排序鍵；及排列所述第一基板和第二基板而接合，另外，在識別所述第一排序鍵的步驟之前，或在識別所述第一排序鍵的步驟和識別所述第二排序鍵的步驟之間，或在識別所述第二排序鍵的步驟之後，包括以垂直方向排列所述第一攝像機單元和第二攝像機單元的垂直排列步驟。 In addition, the object of the present invention as described above relates to a substrate bonding method including a frame; The first sort key of the first substrate is identified by two camera units; the second sort key of the second substrate is recognized by the first camera unit; and the first substrate and the second substrate are aligned for bonding, Before the step of the first sort key, or between the step of identifying the first sort key and the step of identifying the second sort key, or after the step of identifying the second sort key, comprising vertical A vertical alignment step for directional alignment of the first camera unit and the second camera unit.

並且，所述第一攝像機單元及第二攝像機單元對於所述框架而能夠以水平方向移動及斜置的方式設置，在所述垂直排列步驟中，通過所述第一攝像機單元及第二攝像機單元的水平方向移動或斜置而以垂直方向排列所述第一攝像機單元及第二攝像機單元。 In addition, the first camera unit and the second camera unit can be installed horizontally and obliquely with respect to the frame, and in the vertical arrangement step, the first camera unit and the second camera unit The first camera unit and the second camera unit are arranged vertically by moving or tilting in the horizontal direction.

而且，在識別所述第一排序鍵的步驟和識別所述第二排序鍵的步驟之間，還包括上下移動所述第一攝像機單元和第二攝像機單元的上下移動步驟。 Furthermore, between the step of identifying the first sort key and the step of identifying the second sort key, a vertical moving step of moving the first camera unit and the second camera unit up and down is further included.

並且，在識別所述第一排序鍵的步驟和識別所述第二排序鍵的步驟之間，還包括上下移動所述第一攝像機單元和第二攝像機單元中的至少一個的上下移動步驟。 Furthermore, between the step of identifying the first sort key and the step of identifying the second sort key, a step of moving up and down at least one of the first camera unit and the second camera unit is further included.

根據具有上述結構的本發明，在相互接合基板的基板接合裝置中執行垂直排列用於識別基板的排序鍵的攝像機單元的垂直排列步驟而減少排序鍵的座標誤差。 According to the present invention having the above structure, the coordinate error of the sort key is reduced by performing the vertical alignment step of vertically arranging the camera units of the sort key for recognizing the substrate in the substrate bonding apparatus for mutually bonding the substrates.

100:腔體 100: cavity

200:接合模組 200:Joint module

210:框架 210: frame

300:攝像機單元 300: Camera unit

410、420:驅動部 410, 420: drive unit

1000:接合裝置 1000: Engagement device

圖1為本發明的一實施例的基板接合裝置的側面圖；圖2為顯示圖1所示的基板接合裝置的內部結構的立體圖；圖3為顯示第一基板的平面圖；圖4為排列模組的正面圖及立體圖；圖5為顯示安裝在框架的攝像機單元的狀態的立體圖；圖6為另一實施例的攝像機單元的附圖；圖7為顯示識別第一基板的第一排序鍵的狀態的側面圖；圖8為顯示移送第一基板而垂直排列第一攝像機單元和第二攝像機單元的狀態的側面圖；圖9及圖10為顯示垂直排列攝像機單元的方法的附圖；圖11為顯示為了識別第二基板而向上部移動排列模組的狀 態的側面圖；圖12為顯示識別第二基板的第二排序鍵的狀態的側面圖；圖13為顯示第一水平部件上升的情況的側面圖；圖14為顯示移送第二基板而接合第一基板和第二基板的狀態的側面圖。 1 is a side view of a substrate bonding device according to an embodiment of the present invention; FIG. 2 is a perspective view showing the internal structure of the substrate bonding device shown in FIG. 1; FIG. 3 is a plan view showing a first substrate; FIG. A front view and a perspective view of the group; FIG. 5 is a perspective view showing a state of a camera unit installed in a frame; FIG. 6 is a drawing of a camera unit of another embodiment; FIG. A side view of the state; Fig. 8 is a side view showing the state of transferring the first substrate and vertically arranging the first camera unit and the second camera unit; Fig. 9 and Fig. 10 are drawings showing the method of vertically arranging the camera unit; Fig. 11 To show the status of moving the array module upwards to recognize the second board Fig. 12 is a side view showing the state of the second sort key for recognizing the second substrate; Fig. 13 is a side view showing the situation in which the first horizontal member is raised; Fig. 14 is a side view showing the state of transferring the second substrate to join A side view of a state of a substrate and a second substrate.

下面，參照附圖而對本發明的實施例的基板接合裝置的結構及基板接合方法進行具體說明。 Hereinafter, the structure of the substrate bonding apparatus and the substrate bonding method according to the embodiment of the present invention will be specifically described with reference to the drawings.

圖1為本發明的一實施例的基板接合裝置1000的側面圖，圖2為顯示圖1所示的基板接合裝置1000的內部結構的立體圖。 FIG. 1 is a side view of a substrate bonding apparatus 1000 according to an embodiment of the present invention, and FIG. 2 is a perspective view showing an internal structure of the substrate bonding apparatus 1000 shown in FIG. 1 .

參照圖1及圖2，所述基板接合裝置1000包括：腔體100；第一卡盤520，被設置在所述腔體100內部而吸附第一基板10；第二卡盤510，以朝向所述第一卡盤520的方式設置在所述腔體100內部，相對於所述第一卡盤520而以垂直及水平方向相對移動的方式設置，而吸附第二基板20；及排列模組200，具有識別所述第一基板10的第一排序鍵12及識別第二基板20的第二排序鍵22的攝像機單元300A、300B、300C、300D，並包含能夠上下移動設置的框架210。 Referring to FIGS. 1 and 2, the substrate bonding apparatus 1000 includes: a cavity 100; a first chuck 520 disposed inside the cavity 100 to absorb the first substrate 10; a second chuck 510 to face the The first chuck 520 is arranged inside the cavity 100 in the manner of the first chuck 520, and is arranged in a manner of relative movement in the vertical and horizontal directions relative to the first chuck 520, so as to absorb the second substrate 20; and the alignment module 200 , having camera units 300A, 300B, 300C, 300D for identifying the first sorting key 12 of the first substrate 10 and the second sorting key 22 for identifying the second substrate 20 , and including a frame 210 which can be moved up and down.

所述腔體100在內部提供容納第一基板10及第二基板20的空間102。所述腔體100例如由腔體主體(未圖示)和密封所述腔 體主體的開口的上部的腔體導件(未圖示)構成。該腔體100的結構僅用於舉例說明，並能夠適當變形。 The cavity 100 internally provides a space 102 for accommodating the first substrate 10 and the second substrate 20 . The cavity 100 is, for example, composed of a cavity body (not shown) and seals the cavity The upper part of the opening of the main body is composed of a cavity guide (not shown). The structure of the cavity 100 is only for illustration and can be deformed appropriately.

在所述腔體100內部設置吸附要相互接合的基板10、20而固定的第一卡盤520及第二卡盤510。所述第一卡盤520及第二卡盤510由真空卡盤、靜電卡盤及機構式夾緊卡盤等實現，下面，假定所述第一卡盤520及第二卡盤510由真空卡盤構成的情況進行說明。 A first chuck 520 and a second chuck 510 are provided inside the cavity 100 to absorb and fix the substrates 10 and 20 to be bonded to each other. The first chuck 520 and the second chuck 510 are realized by vacuum chucks, electrostatic chucks, and mechanical clamping chucks. Below, it is assumed that the first chuck 520 and the second chuck 510 are made of vacuum chucks. The disk configuration will be described.

所述第一卡盤520在所述腔體100內部而配置在所述排列模組200的內側下部，通過機械臂(未圖示)等而吸附引入所述腔體100的內部的第一基板10而固定。 The first chuck 520 is disposed in the inner lower part of the alignment module 200 inside the cavity 100, and absorbs the first substrate introduced into the cavity 100 by a robot arm (not shown) or the like. 10 while fixed.

圖3為顯示所述第一基板10的平面圖。 FIG. 3 is a plan view showing the first substrate 10 .

參照圖3，所述第一基板10在上面或第一面形成圖案14，而且，形成用於與第二基板20接合的第一排序鍵12。所述第一排序鍵12具有多個，為了準確排列基板，而以基板的中央部為中心對稱配置。所述第一排序鍵12的數量及位置適當變形。另外，第二基板20因具有與所述第一基板10相同的結構而省略反復的說明。 Referring to FIG. 3 , the first substrate 10 has a pattern 14 formed on the upper surface or a first surface, and a first sort key 12 for bonding with the second substrate 20 is formed. There are multiple first sort keys 12, and they are arranged symmetrically around the center of the board in order to arrange the board accurately. The quantity and position of the first sort key 12 are appropriately modified. In addition, since the second substrate 20 has the same structure as the first substrate 10 , repeated descriptions are omitted.

再次參照圖1及圖2，所述第一卡盤520通過負壓吸附固定所述第一基板10的第二面，即未形成圖案14的第二面。 Referring to FIG. 1 and FIG. 2 again, the first chuck 520 fixes the second surface of the first substrate 10 , that is, the second surface on which the pattern 14 is not formed, by negative pressure adsorption.

另外，第二卡盤510在所述腔體100內部配置在所述排列模組200的內側上部。所述第二卡盤510朝向所述第一卡盤520配置。即，所述第二卡盤510與所述第一卡盤520相對配置，相 對於所述第一卡盤520而能夠以垂直及水平方向相對移動設置。例如，所述第一卡盤520及第二卡盤510能夠全部以垂直及水平方向移動設置。 In addition, the second chuck 510 is disposed on the upper inner side of the alignment module 200 inside the cavity 100 . The second chuck 510 is disposed facing the first chuck 520 . That is, the second chuck 510 is arranged opposite to the first chuck 520, and The first chuck 520 can be relatively movable in the vertical and horizontal directions. For example, the first chuck 520 and the second chuck 510 can all be moved vertically and horizontally.

所述第二基板20上下顛倒，即形成第二排序鍵22的第一面以朝向下部的方式引入至所述腔體100內部。所述第二卡盤510吸附固定未形成所述第二基板20的第二排序鍵22的第二面。對於該情況，所述第二基板20的第二排序鍵22朝向所述第一基板10配置。 The second substrate 20 is turned upside down, that is, the first surface forming the second sort key 22 is introduced into the cavity 100 in a downward direction. The second chuck 510 absorbs and fixes the second surface where the second sort key 22 of the second substrate 20 is not formed. In this case, the second sort key 22 of the second substrate 20 is arranged facing the first substrate 10 .

另外，在所述腔體100的內側設置具有攝像機單元300A、300B、300C、300D的排列模組200。 In addition, an arrangement module 200 having camera units 300A, 300B, 300C, and 300D is provided inside the cavity 100 .

所述攝像機單元300A、300B、300C、300D識別所述第一基板10的第一排序鍵12及第二基板20的第二排序鍵22。對於該情況，所述排列模組200具有框架210，在所述框架210設置所述攝像機單元300A、300B、300C、300D。 The camera units 300A, 300B, 300C, 300D recognize the first sort key 12 of the first substrate 10 and the second sort key 22 of the second substrate 20 . In this case, the arrangement module 200 has a frame 210 on which the camera units 300A, 300B, 300C, 300D are arranged.

即，在本發明中，所述攝像機單元300A、300B、300C、300D被設置在框架210而最大化防止所述攝像機單元300A、300B、300C、300D之間的誤排或扭轉等。 That is, in the present invention, the camera units 300A, 300B, 300C, and 300D are disposed on the frame 210 to prevent misalignment or twisting among the camera units 300A, 300B, 300C, and 300D to the greatest extent.

並且，所述框架210上下移動設置。為此，在所述腔體100的內側設置驅動部410、420，在所述驅動部410、420連接所述框架210而上下移動。 And, the frame 210 is set to move up and down. For this purpose, driving parts 410 and 420 are provided inside the cavity 100 , and the driving parts 410 and 420 are connected to the frame 210 to move up and down.

在所述框架210上下移動的情況下，安裝在所述框架210的所述攝像機單元300A、300B、300C、300D一起移動而最大化 抑制所述攝像機單元300A、300B、300C、300D之間的誤排等。 When the frame 210 moves up and down, the camera units 300A, 300B, 300C, and 300D mounted on the frame 210 move together to maximize Misalignment and the like between the camera units 300A, 300B, 300C, and 300D are suppressed.

對於該情況，所述攝像機單元300A、300B、300C、300D包括：第一攝像機單元300A、300B，識別所述第二基板20的第二排序鍵22；第二攝像機單元300C、300D，識別所述第一基板10的第一排序鍵12，並與所述第一攝像機單元300A、300B相對配置。 For this case, the camera units 300A, 300B, 300C, 300D comprise: a first camera unit 300A, 300B identifying the second sort key 22 of the second substrate 20; a second camera unit 300C, 300D identifying the The first sort key 12 of the first substrate 10 is disposed opposite to the first camera units 300A and 300B.

所述第一攝像機單元300A、300B提供為一對，如附圖所示，處於所述框架210的下部而朝向上部配置。並且，所述第二攝像機單元300C、300D同樣也提供為一對，如附圖所示，處於所述框架210的上部而朝向下部配置。 The first camera units 300A, 300B are provided as a pair, and as shown in the drawing, are located at the lower portion of the frame 210 and are disposed toward the upper portion. In addition, the second camera units 300C and 300D are also provided as a pair, and as shown in the drawing, they are located on the upper portion of the frame 210 and are disposed toward the lower portion.

圖4為所述排列模組200的正面圖及立體圖。圖4(A)為所述排列模組200的正面圖，圖4(B)為所述排列模組200的立體圖。 FIG. 4 is a front view and a perspective view of the arrangement module 200 . FIG. 4(A) is a front view of the arrangement module 200, and FIG. 4(B) is a perspective view of the arrangement module 200.

參照圖4，所述排列模組200的框架210包括：一對垂直部件213、214，按提前規定的間距分隔配置；一對水平部件211、212，相互連接所述垂直部件213、214的上下端部。對於該情況，所述一對水平部件211、212中的至少一個能夠相對於所述垂直部件213、214而上下移動配置。 Referring to Fig. 4, the frame 210 of the arrangement module 200 includes: a pair of vertical components 213, 214, which are separated and arranged according to a predetermined distance in advance; Ends. In this case, at least one of the pair of horizontal members 211 , 212 is arranged to be movable up and down relative to the vertical members 213 , 214 .

例如，處於下部的第一水平部件212相對於所述一對垂直部件213、214而上下移動配置，或處於上部的第二水平部件211能夠相對於所述一對垂直部件213、214而上下移動配置。並且，所述第一水平部件212和第二水平部件211能夠全部相對於所述 一對垂直部件213、214而上下移動配置。下面，假定所述第一水平部件212上下移動配置的情況進行說明。 For example, the lower first horizontal member 212 is arranged to move up and down relative to the pair of vertical members 213 and 214, or the upper second horizontal member 211 can move up and down relative to the pair of vertical members 213 and 214. configuration. Moreover, the first horizontal member 212 and the second horizontal member 211 can all be relative to the A pair of vertical members 213 and 214 are arranged to move up and down. Hereinafter, description will be made assuming that the first horizontal member 212 is arranged to move up and down.

另外，所述第一攝像機單元300A、300B被設置在所述第一水平部件212，所述第二攝像機單元300C、300D被設置在所述第二水平部件211。所述第一攝像機單元300A、300B被配置在所述第一水平部件212的上面而朝向上部配置。一對第一攝像機單元300A、300B相互間分隔提前規定的間距而配置。 In addition, the first camera units 300A, 300B are installed on the first horizontal member 212 , and the second camera units 300C, 300D are installed on the second horizontal member 211 . The first camera units 300A and 300B are arranged on the upper surface of the first horizontal member 212 facing upward. A pair of 1st camera unit 300A, 300B is mutually arrange|positioned at predetermined intervals apart.

並且，所述第二攝像機單元300C、300D被配置在所述第二水平部件211的下面而朝向下部配置。一對第二攝像機單元300C、300D按相互間提前規定的間距分隔配置。 In addition, the second camera units 300C and 300D are arranged on the lower surface of the second horizontal member 211 so as to face downward. A pair of 2nd camera unit 300C, 300D is spaced apart and arrange|positioned at the mutually predetermined distance.

如上所示，為了匹配所述第一攝像機單元300A、300B或所述第二攝像機單元300C、300D的焦距而所述框架210本身上下移動而匹配焦距。但，基板接合裝置1000的內部一般比較狹小，並因其它構成要素，而所述框架210的上下移動距離不充足。對於該情況，與所述框架210的上下移動一起，所述水平部件211、212上下移動而匹配焦距。 As described above, in order to match the focal length of the first camera unit 300A, 300B or the second camera unit 300C, 300D, the frame 210 itself moves up and down to match the focal length. However, the interior of the substrate bonding apparatus 1000 is generally relatively small, and the vertical movement distance of the frame 210 is insufficient due to other components. For this case, together with the vertical movement of the frame 210, the horizontal members 211, 212 move up and down to match the focal length.

另外，所述一對第一攝像機單元300A、300B之間的距離和所述一對第二攝像機單元300C、300D之間的距離相同。在因為相對的所述第一攝像機單元300A、300B和第二攝像機單元300C、300D相互排列在垂直線的情況下，能準確識別所述第一排序鍵12和第二排序鍵22的座標。 In addition, the distance between the pair of first camera units 300A, 300B and the distance between the pair of second camera units 300C, 300D are the same. Because the relative first camera units 300A, 300B and second camera units 300C, 300D are arranged in vertical lines, the coordinates of the first sort key 12 and the second sort key 22 can be accurately identified.

並且，在所述排列模組200的中央部形成開口部220。即 在所述一對垂直部件213、214和水平部件211、212的中央部形成所述開口部220。貫通所述開口部220而上述第一卡盤520及第二卡盤510以水平方向移動配置。 In addition, an opening 220 is formed at the center of the array module 200 . Right now The opening 220 is formed at the center of the pair of vertical members 213 , 214 and the horizontal members 211 , 212 . The first chuck 520 and the second chuck 510 pass through the opening 220 and are arranged to move in the horizontal direction.

另外，如上所示，在所述第一攝像機單元300A、300B和第二攝像機單元300C、300D設置在框架210的情況下，在反復進行所述框架210的上下方向移動或所述水平部件211、212的上下方向移動的情況下，發生所述第一攝像機單元300A、300B和第二攝像機單元300C、300D的垂直方向位置誤差或所述第一攝像機單元300A、300B和第二攝像機單元300C、300D的扭轉。該情況，在所述第一基板10及第二基板20的排序鍵的座標值發生誤差而最終發生所述第一基板10和第二基板20的誤排而引發接合不良。 In addition, as described above, when the first camera units 300A, 300B and the second camera units 300C, 300D are installed on the frame 210, when the vertical movement of the frame 210 is repeated or the horizontal member 211, 212, when the vertical direction position error of the first camera unit 300A, 300B and the second camera unit 300C, 300D occurs or the first camera unit 300A, 300B and the second camera unit 300C, 300D twist. In this case, an error occurs in the coordinate values of the sort keys of the first substrate 10 and the second substrate 20 , and eventually misalignment of the first substrate 10 and the second substrate 20 occurs, resulting in poor bonding.

因此，在本發明中，為了解決該問題，上述攝像機單元300A、300B、300C、300D能夠相對所述框架210移動設置。例如，所述攝像機單元300A、300B、300C、300D在所述框架210能夠以水平方向移動及斜置設置。在所述攝像機單元300A、300B、300C、300D相對所述框架210移動配置的情況下，能夠進行所述第一攝像機單元300A、300B和第二攝像機單元300C、300D的垂直方向排列而解決上述問題。 Therefore, in the present invention, in order to solve this problem, the camera units 300A, 300B, 300C, and 300D are installed so as to be movable relative to the frame 210 . For example, the camera units 300A, 300B, 300C, and 300D can be moved horizontally and installed obliquely on the frame 210 . In the case where the camera units 300A, 300B, 300C, and 300D are arranged to move relative to the frame 210, the first camera units 300A, 300B and the second camera units 300C, 300D can be arranged vertically to solve the above problems. .

圖5為顯示安裝在所述框架210的第一攝像機單元300A、300B的狀態的立體圖。圖5(A)顯示設定在所述框架210的一對第一攝像機單元300A、300B，圖5(B)顯示所述一對第一攝像機單元300A、300B中的一個第一攝像機單元300A。 FIG. 5 is a perspective view showing a state of the first camera units 300A, 300B mounted on the frame 210 . FIG. 5(A) shows a pair of first camera units 300A, 300B set on the frame 210, and FIG. 5(B) shows one first camera unit 300A of the pair of first camera units 300A, 300B.

參照圖5，所述第一攝像機單元300A包括：移動板310A，能夠相對所述框架210而以水平方向移動設置；第一識別攝像機320A，設置在所述移動板310A而識別所述第二排序鍵22；及第一排序攝像機330A，用於所述移動板310A的排列。 Referring to Fig. 5, the first camera unit 300A includes: a moving plate 310A, which can be moved in a horizontal direction relative to the frame 210; a first identification camera 320A, which is arranged on the moving plate 310A to identify the second sequence key 22; and a first sorting camera 330A for the sorting of said moving plate 310A.

所述移動板310A被設置在所述第一水平部件212的凹槽部210A的內側。所述移動板310A也能夠從所述第一水平部件212突出配置，但對於本實施例的情況，所述移動板310A插入所述凹槽部210A而配置。該情況，所述移動板310A的上面處於與所述第一水平部件212的上面相同的平面。 The moving plate 310A is provided inside the groove portion 210A of the first horizontal member 212 . The moving plate 310A can also be arranged to protrude from the first horizontal member 212 , but in the case of the present embodiment, the moving plate 310A is inserted into the groove portion 210A and arranged. In this case, the upper surface of the moving plate 310A is on the same plane as the upper surface of the first horizontal member 212 .

另外，所述移動板310A相對所述框架210而以水平方向移動配置。例如，所述移動板310A在所述凹槽部210A的內側按水平方向沿著x軸及y軸而能夠直線移動配置。為此，所述凹槽部210A在平面上與所述移動板310A相比而以x軸及y軸為方向而進一步形成。由此，所述移動板310A提供沿著x軸及y軸方向而移動的餘留空間。 In addition, the moving plate 310A is arranged to move in the horizontal direction relative to the frame 210 . For example, the moving plate 310A is disposed linearly movable along the x-axis and the y-axis in the horizontal direction inside the groove portion 210A. For this reason, the groove portion 210A is further formed in directions of the x-axis and the y-axis compared with the moving plate 310A on a plane. Thus, the moving plate 310A provides a remaining space for moving along the x-axis and y-axis directions.

所述移動板310A通過由線性電機(linear motor)、壓電致動器(piezo actuator)等構成的水平方向驅動部(未圖示)而按水平方向移動。所述水平方向驅動部的結構能夠以各種形式實現。 The moving plate 310A is moved in the horizontal direction by a horizontal driving unit (not shown) composed of a linear motor, a piezoelectric actuator, and the like. The structure of the horizontal direction driving unit can be implemented in various forms.

另外，所述移動板310A能夠相對於所述框架210斜置(tilting)配置。例如，所述移動板310A能夠以x軸及y軸中至少一個軸為中心進行斜置配置。 In addition, the moving plate 310A can be arranged in a tilting manner with respect to the frame 210 . For example, the moving plate 310A can be arranged obliquely around at least one of the x-axis and the y-axis.

所述移動板310A能夠通過旋轉驅動部(未圖示)而斜置配 置。所述旋轉驅動部的結構由各種形式實現。 The moving plate 310A can be tilted by a rotating drive unit (not shown). place. The structure of the rotation driving part is realized in various forms.

另外，在所述移動板310A設置識別所述第二排序鍵22的第一識別攝像機320A。 In addition, a first recognition camera 320A for recognizing the second sort key 22 is installed on the moving plate 310A.

所述第一識別攝像機320A識別上述第二基板20的第二排序鍵22。並且，如圖4顯示所示，所述第二攝像機單元300C、300D的第二識別攝像機320C、320D識別第一基板10的第一排序鍵12。 The first recognition camera 320A recognizes the second sort key 22 of the second substrate 20 described above. Moreover, as shown in FIG. 4 , the second recognition cameras 320C, 320D of the second camera units 300C, 300D recognize the first sort key 12 of the first substrate 10 .

另外，對於接合所述第一基板10和第二基板20的情況，要求非常高的精密度，由此，所述識別攝像機320A、320B、320C、320D的倍率也相對變高。對於該情況，所述識別攝像機320A、320B、320C、320D的倍率越高而焦距非常短。 In addition, when bonding the first substrate 10 and the second substrate 20 , very high precision is required, so the magnification of the recognition cameras 320A, 320B, 320C, and 320D is relatively high. For this case, the recognition cameras 320A, 320B, 320C, 320D have a higher magnification and a very short focal length.

因此，如圖4顯示所示，在進行所述第一攝像機單元300A、300B和第二攝像機單元300C、300D的垂直方向排列時，難以通過所述識別攝像機320A、320B、320C、320D而識別相對的攝像機單元而排列的情況。 Therefore, as shown in FIG. 4, when the first camera units 300A, 300B and the second camera units 300C, 300D are arranged vertically, it is difficult to identify the relative The case where the camera unit is arranged.

因此，對於本實施例的情況，在所述攝像機單元300A、300B、300C、300D設置排序攝像機330A、330B、330C、330D。所述排序攝像機330A、330B、330C、330D為了進行所述第一攝像機單元300A、300B和第二攝像機單元300C、300D的垂直方向排列而使用。對於該情況，所述排序攝像機330A、330B、330C、330D與所述識別攝像機320A、320B、320C、320D相比而倍率相對較低，相反識別焦距變長而相對的攝像機單元。 Therefore, for the case of this embodiment, sorting cameras 330A, 330B, 330C, and 330D are provided in the camera units 300A, 300B, 300C, and 300D. The sequence cameras 330A, 330B, 330C, and 330D are used for vertical alignment of the first camera units 300A, 300B and the second camera units 300C, 300D. In this case, the sorting cameras 330A, 330B, 330C, and 330D have relatively lower magnifications than the identification cameras 320A, 320B, 320C, and 320D, and instead identify camera units with longer focal lengths.

例如，如圖4及圖5顯示所示，所述第一排序攝像機330A、330B與相對的第二攝像機單元300C、300D的第二排序攝像機330C、330D相對配置。對於該情況，所述第一排序攝像機330A、330B和第二排序攝像機330C、330D相互識別，通過此，以所述第一攝像機單元300A、300B和第二攝像機單元300C、300D準確進行垂直方向排列的方式將所述第一攝像機單元300A、300B和第二攝像機單元300C、300D中的至少一個進行水平方向移動或斜置。 For example, as shown in FIG. 4 and FIG. 5 , the first sorting cameras 330A, 330B are arranged opposite to the second sorting cameras 330C, 330D of the opposing second camera units 300C, 300D. In this case, the first sorting cameras 330A, 330B and the second sorting cameras 330C, 330D recognize each other, and through this, the vertical alignment is accurately performed with the first camera units 300A, 300B and the second camera units 300C, 300D At least one of the first camera unit 300A, 300B and the second camera unit 300C, 300D is moved horizontally or tilted in a manner.

與所述第一攝像機單元300A、300B相對的第二攝像機單元300C、300D因具有與上述的第一攝像機單元300A、300B相同的結構而省略反復的說明。 Since the second camera units 300C and 300D facing the first camera units 300A and 300B have the same configuration as the above-mentioned first camera units 300A and 300B, repeated description thereof will be omitted.

另外，圖6顯示另一實施例的第一攝像機單元3000A。圖6(A)為所述第一攝像機單元3000A的平面圖，圖6(B)為顯示所述第一攝像機單元3000A和第二攝像機單元3000B的配置的側面圖。 In addition, FIG. 6 shows a first camera unit 3000A of another embodiment. FIG. 6(A) is a plan view of the first camera unit 3000A, and FIG. 6(B) is a side view showing the configuration of the first camera unit 3000A and the second camera unit 3000B.

參照圖6，本實施例的第一攝像機單元3000A與上述實施例對比，還設置第一攝像機排序鍵3400A。 Referring to FIG. 6 , the first camera unit 3000A of this embodiment is compared with the above embodiment, and a first camera sort key 3400A is also set.

即，所述第一攝像機單元3000A在移動板3100A一起設置第一識別攝像機3200A及第一排序攝像機3300A及第一攝像機排序鍵3400A。 That is, the first camera unit 3000A is provided with a first recognition camera 3200A, a first sorting camera 3300A, and a first camera sorting key 3400A on the moving plate 3100A.

所述第一攝像機排序鍵3400A通過相對的攝像機單元，即第二攝像機單元3000B的第二排序攝像機3300B識別。並且， 所述第二攝像機單元3000B的第二攝像機排序鍵3400B通過第一攝像機單元3000A的第一排序攝像機3300A識別。 The first camera sort key 3400A is identified by the opposite camera unit, ie the second sort camera 3300B of the second camera unit 3000B. and, The second camera sort key 3400B of the second camera unit 3000B is recognized by the first sort camera 3300A of the first camera unit 3000A.

如圖6(B)顯示所示，所述第一攝像機單元3000A的第一排序攝像機3300A與所述第二攝像機單元3000B的第二攝像機排序鍵3400B相對配置。並且，所述第一攝像機單元3000A的第一攝像機排序鍵3400A與所述第二攝像機單元3000B的第二排序攝像機3300B相對配置。 As shown in FIG. 6(B), the first sorting camera 3300A of the first camera unit 3000A is arranged opposite to the second camera sorting key 3400B of the second camera unit 3000B. Furthermore, the first camera sorting key 3400A of the first camera unit 3000A is arranged opposite to the second sorting camera 3300B of the second camera unit 3000B.

因此，通過所述第一排序攝像機3300A而識別所述第二攝像機排序鍵3400B而檢測座標，而且，通過所述第二排序攝像機3300B而識別所述第一攝像機排序鍵3400A而檢測座標。 Therefore, the coordinates are detected by recognizing the second camera sort key 3400B by the first sort camera 3300A, and the coordinates are detected by recognizing the first camera sort key 3400A by the second sort camera 3300B.

在檢測所述第一攝像機排序鍵3400A及第二攝像機排序鍵3400B的座標之後，水準移動或斜置所述第一攝像機單元3000A或第二攝像機單元3000B中的至少一個，而排列所述第一攝像機單元3000A和第二攝像機單元3000B的垂直方向。 After detecting the coordinates of the first camera sorting key 3400A and the second camera sorting key 3400B, at least one of the first camera unit 3000A or the second camera unit 3000B is moved horizontally or tilted to arrange the first camera unit 3000A or the second camera unit 3000B. The vertical direction of the camera unit 3000A and the second camera unit 3000B.

下面對利用具有上述結構的基板接合裝置1000而接合基板的方法進行研究。 Next, a method of bonding substrates using the substrate bonding apparatus 1000 having the above configuration will be studied.

首先，所述基板接合方法包括如下步驟：利用所述第二攝像機單元300C、300D而識別所述第一基板10的第一排序鍵12；利用所述第一攝像機單元300A、300B而識別第二基板20的第二排序鍵22；及排列所述第一基板10和第二基板20而接合。 First, the substrate bonding method includes the following steps: using the second camera unit 300C, 300D to identify the first sort key 12 of the first substrate 10; using the first camera unit 300A, 300B to identify the second The second sort key 22 of the substrate 20; and the first substrate 10 and the second substrate 20 are aligned and bonded.

該情況，所述基板接合方法包括將所述第一攝像機單元300A、300B和第二攝像機單元300C、300D按垂直方向排列的垂 直排列步驟。該垂直排列步驟在識別所述第一排序鍵12的步驟之前或在識別所述第一排序鍵12的步驟和識別所述第二排序鍵22的步驟之間或在識別所述第二排序鍵22的步驟之後執行。下面，對所述垂直排列步驟在識別所述第一排序鍵12的步驟和識別所述第二排序鍵22的步驟之間執行的情況進行研究。 In this case, the substrate bonding method includes vertically arranging the first camera units 300A, 300B and the second camera units 300C, 300D in the vertical direction. Arrange the steps in a straight line. This vertical alignment step is before the step of identifying said first sort key 12 or between the step of identifying said first sort key 12 and the step of identifying said second sort key 22 or after identifying said second sort key Execute after step 22. Next, the case where the vertical alignment step is performed between the step of identifying the first sort key 12 and the step of identifying the second sort key 22 is considered.

圖7為顯示識別所述第一基板10的第一排序鍵12的狀態的側面圖。如圖7顯示所示，在上述腔體100的內側中，以所述排列模組200為基準，右側與在所述第一卡盤520及第二卡盤510分別裝入所述第一基板10及第二基板20的裝入區域106對應，所述排列模組200的左側與接合所述第一基板10及第二基板20的接合區域104對應。該區域區分僅用於方便設定，並適當變形。 FIG. 7 is a side view showing a state of recognizing the first sort key 12 of the first substrate 10. Referring to FIG. As shown in FIG. 7, in the inner side of the cavity 100, with the alignment module 200 as a reference, the first substrate is loaded into the first chuck 520 and the second chuck 510 on the right side, respectively. 10 and the loading area 106 of the second substrate 20 correspond, and the left side of the arrangement module 200 corresponds to the bonding area 104 for bonding the first substrate 10 and the second substrate 20 . This area distinction is only for convenient setting and proper deformation.

參照圖7，在上述裝入區域106中，在所述第一卡盤520的上部吸附及固定所述第一基板10。進而，所述第一卡盤520被插入所述排列模組200的中空部220。對於該情況，所述第二卡盤510與所述排列模組200分隔而在所述接合區域104待機。 Referring to FIG. 7 , in the loading area 106 , the first substrate 10 is sucked and fixed on the upper portion of the first chuck 520 . Furthermore, the first chuck 520 is inserted into the hollow portion 220 of the alignment module 200 . For this case, the second chuck 510 is separated from the alignment module 200 and stands by in the bonding area 104 .

另外，對於所述第一卡盤520插入所述中空部220的情況，通過所述第二攝像機單元300C而識別所述第一基板10的第一排序鍵12。 In addition, when the first chuck 520 is inserted into the hollow portion 220, the first sort key 12 of the first substrate 10 is recognized by the second camera unit 300C.

進而，如圖8顯示所示，所述第一卡盤520在所述排列模組200以水平方向移送而移動至所述接合區域104。 Furthermore, as shown in FIG. 8 , the first chuck 520 is transferred in the horizontal direction in the alignment module 200 to move to the bonding area 104 .

在所述第一卡盤520脫離所述排列模組200之後，執行 以垂直方向排列所述第一攝像機單元300A和第二攝像機單元300C的垂直排列步驟。 After the first chuck 520 is separated from the alignment module 200, perform A vertical arrangement step in which the first camera unit 300A and the second camera unit 300C are arranged in a vertical direction.

對於該情況，所述第一攝像機單元300A的第一排序攝像機330A和第二攝像機單元300C的第二排序攝像機330C相互識別而檢測座標而水平方向移動或斜置所述第一攝像機單元300A和第二攝像機單元300C而進行垂直方向排列。 For this case, the first sorting camera 330A of the first camera unit 300A and the second sorting camera 330C of the second camera unit 300C recognize each other to detect coordinates and move or tilt the first camera unit 300A and the second camera unit 300A horizontally. The two camera units 300C are arranged vertically.

圖9及圖10為顯示所述第一攝像機單元300A和第二攝像機單元300C的垂直排列步驟的附圖。 9 and 10 are diagrams showing steps of vertically arranging the first camera unit 300A and the second camera unit 300C.

如圖9(A)顯示所示，對於通過所述第一攝像機單元300A和第二攝像機單元300C相互識別的情況，所述第一攝像機單元300A和第二攝像機單元300C從垂直線上脫離而沿著水平面發生距離誤差。 As shown in FIG. 9(A), for the situation of identifying each other through the first camera unit 300A and the second camera unit 300C, the first camera unit 300A and the second camera unit 300C are separated from the vertical line along the A distance error occurred on the horizontal plane.

對於該情況，將所述第一攝像機單元300A和第二攝像機單元300C中至少一個按水平方向移動，如圖9(B)所示，將所述第一攝像機單元300A和第二攝像機單元300C在垂直線上配置而進行垂直方向排列。 For this case, at least one of the first camera unit 300A and the second camera unit 300C is moved horizontally, as shown in FIG. 9(B), the first camera unit 300A and the second camera unit 300C are Arranged on a vertical line and arranged in a vertical direction.

並且，如圖10(A)顯示所示，對於通過所述第一攝像機單元300A和第二攝像機單元300C相互識別的情況，所述第一攝像機單元300A和第二攝像機單元300C在垂直線上至少一個發生扭轉而在垂直方向發生角度誤差。 And, as shown in FIG. 10(A), for the situation of identifying each other through the first camera unit 300A and the second camera unit 300C, at least one of the first camera unit 300A and the second camera unit 300C on the vertical line Torsion occurs and an angular error occurs in the vertical direction.

對於該情況，斜置所述第一攝像機單元300A和第二攝像機單元300C中至少一個，如圖10(B)所示，將所述第一攝像機單 元300A和第二攝像機單元300C在垂直線上配置而進行垂直方向排列。 For this case, tilt at least one of the first camera unit 300A and the second camera unit 300C, as shown in FIG. The cell 300A and the second camera unit 300C are arranged on a vertical line and arranged vertically.

另外，識別所述第一排序鍵12而檢測座標，在識別所述第二排序鍵22之前，通過執行所述第一攝像機單元300A和第二攝像機單元300C的垂直方向排列，而在檢測所述第二排序鍵22的座標的情況下，減少所述第一排序鍵12和第二排序鍵22的座標誤差。 In addition, by recognizing the first sort key 12 to detect the coordinates, before recognizing the second sort key 22, by performing the vertical alignment of the first camera unit 300A and the second camera unit 300C, while detecting the In the case of the coordinates of the second sort key 22, the coordinate error between the first sort key 12 and the second sort key 22 is reduced.

進而，如圖11顯示所示，所述第二卡盤510移動至所述裝入區域106而吸附第二基板20而進行固定。對於該情況，所述第二基板20上下顛倒而所述第二排序鍵22向下部配置。 Furthermore, as shown in FIG. 11 , the second chuck 510 moves to the loading area 106 to absorb and fix the second substrate 20 . In this case, the second substrate 20 is turned upside down and the second sort key 22 is arranged downward.

進而，執行所述框架210上下移動提前規定的距離的上下移動步驟。 Furthermore, a step of moving the frame 210 up and down by a predetermined distance in advance is performed.

即，如上所示，所述第一攝像機單元300A的第一識別攝像機320A和所述第二攝像機單元300C的所述第二識別攝像機320B的焦距相對較短而識別所述第一排序鍵12，之後，為了識別所述第二排序鍵22而需要所述第一攝像機單元300A向所述第二基板20上升。 That is, as shown above, the focal lengths of the first recognition camera 320A of the first camera unit 300A and the second recognition camera 320B of the second camera unit 300C are relatively short to recognize the first sort key 12, Thereafter, in order to recognize the second sort key 22 , it is necessary for the first camera unit 300A to ascend toward the second substrate 20 .

對於該情況，設置在所述框架210的所述第一攝像機單元300A和第二攝像機單元300C與所述框架210一起上下移動。 In this case, the first camera unit 300A and the second camera unit 300C provided on the frame 210 move up and down together with the frame 210 .

在所述框架210上下移動之後，如圖12顯示所示，所述第二卡盤510插入所述排列模組200的中空部220。 After the frame 210 moves up and down, as shown in FIG. 12 , the second chuck 510 is inserted into the hollow portion 220 of the alignment module 200 .

對於所述第二卡盤510插入所述中空部220的情況，通 過所述第一攝像機單元300A而識別所述第二基板20的第二排序鍵22。 For the case where the second chuck 510 is inserted into the hollow portion 220, usually The second sort key 22 of the second substrate 20 is identified through the first camera unit 300A.

另外，圖13顯示所述第一水平部件212上升而移動的情況。 In addition, FIG. 13 shows a situation in which the first horizontal member 212 rises and moves.

參照圖13，在所述框架210上下移動的情況下，在無法匹配所述第一攝像機單元300A的第一識別攝像機320A的焦距的情況下，所述第一水平部件212上下移動而匹配焦距。 Referring to FIG. 13 , when the frame 210 moves up and down, if the focal length of the first recognition camera 320A of the first camera unit 300A cannot be matched, the first horizontal member 212 moves up and down to match the focal length.

對於本實施例的情況，對所述第一水平部件212上下移動的情況進行說明，如上所示，上下移動所述第一水平部件212及第二水平部件211中至少一個。因此，上下移動所述第一攝像機單元300A、300B和第二攝像機單元300C、300D中至少一個而匹配焦距。 For the case of this embodiment, the case where the first horizontal member 212 moves up and down will be described. As above, at least one of the first horizontal member 212 and the second horizontal member 211 is moved up and down. Accordingly, at least one of the first camera unit 300A, 300B and the second camera unit 300C, 300D is moved up and down to match the focal length.

進而，如圖14顯示所示，所述第二卡盤510向所述接合區域104移送。對於該情況，在所述接合區域已有第一卡盤520進行待機。 Furthermore, as shown in FIG. 14 , the second chuck 510 is moved to the joining area 104 . For this case, the first chuck 520 is already on standby in the joining area.

因此，在將所述第二卡盤510向所述第一卡盤520的上部移送之後，通過所述第一排序鍵12和第二排序鍵22的座標而精密排列所述第一卡盤520及第二卡盤510之後，而將所述第二卡盤510向下部移送而接合所述第一基板10和第二基板20。 Therefore, after the second chuck 510 is transferred to the upper part of the first chuck 520, the coordinates of the first sort key 12 and the second sort key 22 are used to precisely arrange the first chuck 520 and the second chuck 510 , the second chuck 510 is moved downward to join the first substrate 10 and the second substrate 20 .

另外，上述垂直排列步驟在識別所述第一排序鍵12的步驟之前執行的情況下，也能夠減少所述第一排序鍵12和第二排序鍵22的座標誤差。 In addition, if the above-mentioned vertical arrangement step is performed before the step of identifying the first sort key 12 , the coordinate error between the first sort key 12 and the second sort key 22 can also be reduced.

並且，對於上述垂直排列步驟在識別所述第二排序鍵22的步驟之後執行的情況，在提前檢測所述第一排序鍵12及第二排序鍵22的座標之後，執行垂直排列步驟。因此，在該情況下，在所述垂直排列步驟中，經過根據所述第一攝像機單元300A、300B或第二攝像機單元300C、300D的水平方向移動量或斜置程度而補正所述第一排序鍵12及第二排序鍵22的座標的步驟，而計算所述第一排序鍵12及第二排序鍵22的準確座標。 Moreover, for the case where the above-mentioned vertical arrangement step is performed after the step of identifying the second sort key 22, the vertical arrangement step is performed after detecting the coordinates of the first sort key 12 and the second sort key 22 in advance. Therefore, in this case, in the vertically arranging step, the first arrangement is corrected according to the amount of movement in the horizontal direction or the degree of inclination of the first camera unit 300A, 300B or the second camera unit 300C, 300D. The step of calculating the coordinates of the key 12 and the second sort key 22, and calculating the exact coordinates of the first sort key 12 and the second sort key 22.

綜上，參照本發明的優選的實施例進行了說明，但本技術領域的技術人員在不脫離權利要求範圍記載的本發明的思想及領域的範圍內能夠對本發明進行各種修正及變形實施。因此，在變形的實施基本上包含本發明的權利要求範圍的構成要素的情況下，應視為全部包含于本發明的技術範圍內。 In summary, the present invention has been described with reference to preferred embodiments, but those skilled in the art can implement various modifications and variations of the present invention without departing from the spirit and scope of the present invention described in the claims. Therefore, when the modified implementation basically includes the constituent elements within the scope of the claims of the present invention, it should be considered that all of them are included within the technical scope of the present invention.

100:腔體 100: cavity

200:接合模組 200:Joint module

210:框架 210: frame

410、420:驅動部 410, 420: drive unit

1000:接合裝置 1000: Engagement device

Claims (9)

一種基板接合裝置，其特徵在於，包括：腔體；第一卡盤，設置在所述腔體內部而吸附第一基板；第二卡盤，以朝向所述第一卡盤的方式設置在所述腔體內部，相對於所述第一卡盤而以垂直及水平方向相對移動的方式設置而吸附第二基板；及排列模組，設置識別所述第一基板的第一排序鍵及所述第二基板的第二排序鍵的攝像機單元，並包含能夠上下移動的框架，其中所述攝像機單元設置：移動板，能夠相對於所述框架而沿水平方向移動設置；識別攝像機，設置在所述移動板而識別所述第一排序鍵或第二排序鍵；及排序攝像機，用於所述移動板的排列。 A substrate bonding device, characterized by comprising: a cavity; a first chuck disposed inside the cavity to absorb a first substrate; a second chuck disposed on the first chuck in a manner facing the first chuck. The interior of the cavity is arranged in a manner of relative movement in the vertical and horizontal directions relative to the first chuck to absorb the second substrate; and an arrangement module is provided with a first sort key for identifying the first substrate and the The camera unit of the second sorting key of the second substrate, and includes a frame capable of moving up and down, wherein the camera unit is provided with: a moving plate capable of moving in a horizontal direction relative to the frame; an identification camera provided on the moving a board to identify the first sort key or the second sort key; and a sorting camera for alignment of the moving board. 如請求項1所述的基板接合裝置，其中所述攝像機單元能夠相對於所述框架移動設置。 The substrate bonding apparatus according to claim 1, wherein the camera unit is movably arranged relative to the frame. 如請求項1所述的基板接合裝置，其中所述攝像機單元能夠在所述框架水平方向移動及斜置。 The substrate bonding apparatus according to claim 1, wherein the camera unit is capable of moving and tilting in the horizontal direction of the frame. 如請求項3所述的基板接合裝置，其中所述框架包括：一對垂直部件，按提前規定的間距分隔配置； 一對水平部件，相互連接所述垂直部件的上下端部並供設置所述攝像機單元，所述一對水平部件中的至少一個能夠相對於所述垂直部件而上下移動配置。 The substrate bonding apparatus according to claim 3, wherein the frame includes: a pair of vertical members spaced apart at a predetermined interval; A pair of horizontal members connects upper and lower ends of the vertical member to accommodate the camera unit, and at least one of the pair of horizontal members is arranged to be movable up and down relative to the vertical member. 如請求項1至4中任一項所述的基板接合裝置，其中所述攝像機單元包括：第一攝像機單元，識別所述第二排序鍵；第二攝像機單元，識別所述第一排序鍵，並與所述第一攝像機單元相對配置。 The substrate bonding apparatus according to any one of claims 1 to 4, wherein the camera unit includes: a first camera unit that recognizes the second sort key; a second camera unit that recognizes the first sort key, And it is arranged opposite to the first camera unit. 如請求項5所述的基板接合裝置，其中所述一對水平部件包括第一水平部件和第二水平部件，所述第一攝像機單元被設置在所述第一水平部件，所述第二攝像機單元被設置在所述第二水平部件。 The substrate bonding apparatus according to claim 5, wherein the pair of horizontal members includes a first horizontal member and a second horizontal member, the first camera unit is provided on the first horizontal member, and the second camera unit A unit is provided on the second horizontal member. 如請求項1所述的基板接合裝置，其中所述移動板能夠相對於所述框架斜置設置。 The substrate bonding apparatus according to claim 1, wherein the moving plate can be arranged obliquely with respect to the frame. 如請求項7所述的基板接合裝置，其中在所述移動板還設置：攝像機排序鍵，通過相對的所述攝像機單元的所述排序攝像機識別。 The substrate bonding device according to claim 7, wherein the moving plate is further provided with: a camera sorting key, which is identified by the sorting cameras of the opposing camera units. 如請求項4所述的基板接合裝置，其中在所述框架的中央以能夠移動所述第一卡盤及第二卡盤的方式形成中空部。 The substrate bonding apparatus according to claim 4, wherein a hollow portion is formed in the center of the frame so that the first chuck and the second chuck can move.
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