Overview
- Presents the current state of the art in wafer bonding - a technology important to microelectronic device manufacturing
- Includes supplementary material: sn.pub/extras
Part of the book series: Springer Series in Materials Science (SSMATERIALS, volume 75)
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About this book
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
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Table of contents (14 chapters)
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Front Matter
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Back Matter
Reviews
From the reviews:
"Wafer bonding, also known as direct wafer bonding or wafer fusion, has developed from an almost obscure niche technology in the 1980s … . Anyone interested in learning about the basics of wafer bonding and its various application areas, will likely be served by this outstanding volume while the researcher engaged in studies on applied and technological aspects of wafer bonding, will find up-to-date information about this fast-moving area, including relevant patent information." (Current Engineering Practice, Vol. 47 (3), 2004 - 2005)
Editors and Affiliations
Accessibility Information
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Bibliographic Information
Book Title: Wafer Bonding
Book Subtitle: Applications and Technology
Editors: Marin Alexe, Ulrich Gösele
Series Title: Springer Series in Materials Science
DOI: https://doi.org/10.1007/978-3-662-10827-7
Publisher: Springer Berlin, Heidelberg
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eBook Packages: Springer Book Archive
Copyright Information: Springer-Verlag Berlin Heidelberg 2004
Hardcover ISBN: 978-3-540-21049-8Published: 14 May 2004
Softcover ISBN: 978-3-642-05915-5Published: 30 September 2011
eBook ISBN: 978-3-662-10827-7Published: 09 March 2013
Series ISSN: 0933-033X
Series E-ISSN: 2196-2812
Edition Number: 1
Number of Pages: XV, 504
Number of Illustrations: 363 b/w illustrations, 20 illustrations in colour
Topics: Condensed Matter Physics, Characterization and Evaluation of Materials, Optical and Electronic Materials, Surfaces and Interfaces, Thin Films, Electrical Engineering