Overview
- Presents methods and techniques used for measuring and testing of the electronic materials properties
- Presents an in-depth discussion of ceramic materials for RF/MW packaging
- Presents numerical simulation methods and techniques used in analysis of electronic devices and materials
- Discusses thermal management issues for RF/MW packaging
- Presents a RF/Microwave Packaging Roadmap for Portable Devices
- Includes supplementary material: sn.pub/extras
Access this book
Tax calculation will be finalised at checkout
Other ways to access
About this book
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Similar content being viewed by others
Table of contents (12 chapters)
-
Front Matter
-
Back Matter
Editors and Affiliations
Accessibility Information
Accessibility information for this book is coming soon. We're working to make it available as quickly as possible. Thank you for your patience.
Bibliographic Information
Book Title: RF and Microwave Microelectronics Packaging
Editors: Ken Kuang, Franklin Kim, Sean S. Cahill
DOI: https://doi.org/10.1007/978-1-4419-0984-8
Publisher: Springer New York, NY
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer-Verlag US 2010
Hardcover ISBN: 978-1-4419-0983-1Published: 17 November 2009
Softcover ISBN: 978-1-4899-8324-4Published: 05 September 2014
eBook ISBN: 978-1-4419-0984-8Published: 01 December 2009
Edition Number: 1
Number of Pages: XVI, 285
Topics: Electronics and Microelectronics, Instrumentation, Microwaves, RF and Optical Engineering, Circuits and Systems