UAI 1206 瑞士SCHURTER硕特，熔断器北京冠宇铭通原厂授权一级代理

UAI 1206 
Pulse proof SMD fuse, 1206, 32 VDC, max. ambient temperature of 140 °C
UL 248-14 · 32VDC · Time-Lag T
Description
- Chipfuse for highest demandsregarding pulse resistant, temperature 
resistant and mechanical strength
- Impermeable to potting compound
Unique Selling Proposition
- AEC-Q200 qualified
- Pulse and temperature resistant
- Mechanical Shock proved with 1'500 g
Technical Data
Rated Voltage 32VDC
Rated current 5.3 - 7.5A
Breaking Capacity 100A
Characteristic Time-Lag T
Mounting PCB,SMT
Admissible Ambient Air Temp. -40°C to 140°C
Material: Housing Fiber-reinforced plastic, UL 94V-0
Material: Terminals Copper, Ni/Au-plated
Unit Weight 0.01 g
Storage Conditions 0°C to 40°C, max. 70% r.h.
Storage Capability max. 3years?@ 25°C in original packaging
Product Marking Rated curren
Soldering Methods Reflow
Soldering Profile
Solderability 245°C / 3sec acc. to IEC 60068-2-58, 
Test Td
Resistance to Soldering Heat 250 ±5°C / 30 ±5sec acc. to JEDEC 
J-STD-020
Moisture Sensitivity Level MSL 1, J-STD-020
Case Resistance acc. to EIA/IS-722, Test 4.7
>100 MΩ (between leeds and body)
Flammability UL 94V-0
(acc. to EIA/IS-722, Test 4.12)
Damp heat, steady state MIL-STD-202, Method 103
(1000h / 85°C / 85% humidity)
Immersion MIL-STD-202, Method 104 Condition B
Thermal Shock MIL-STD-202, Method 107
(300 air-to-air cycles: -40 to +140°C)
Operational Life MIL-STD-202, Method 108 Condition D
1000h @ 0.63 x In @ 125°C
Vibration, High Frequency MIL-STD-202, Method 204 Condition D
Mechanical Shock MIL-STD-202, Method 213 Condition F
Resistance to Solvents MIL-STD-202, Method 215
(acc to. EIA/IS-722, Test 4.11)
Temperature Cycling JESD22 Method JA-104
Flame Retardance AEC-Q200-001
Board Flex AEC-Q200-005
Terminal Strength AEC-Q200-006